公开(公告)号：US20140263683A1

公开(公告)日：2014-09-18

申请号：US14207421

申请日：2014-03-12

申请人： Jagadeesh Krishnan ,  Jitendra Jain ,  Deepak Ravikumar ,  Devin Patten ,  John Kuppler ,  Kenneth Smith ,  Xudong Hu

发明人： Jagadeesh Krishnan ,  Jitendra Jain ,  Deepak Ravikumar ,  Devin Patten ,  John Kuppler ,  Kenneth Smith ,  Xudong Hu

IPC分类号： E01B3/34 ,  E01B3/32 ,  B28B1/14 ,  E01B3/36

CPC分类号： B28B1/14 ,  B28B11/24 ,  B28B23/02 ,  C04B20/12 ,  C04B28/188 ,  C04B32/02 ,  C04B2111/00413 ,  E01B3/44 ,  Y02P40/18 ,  Y02P40/615 ,  C04B14/06 ,  C04B40/024 ,  C04B40/0268 ,  C04B2103/302 ,  C04B24/2647 ,  C04B20/1077 ,  C04B20/1037 ,  C04B20/1062 ,  C04B40/0231 ,  C04B14/043 ,  C04B20/1074 ,  C04B20/107

摘要： The invention provides novel railroad ties manufactured from novel composite materials that possess excellent physical and performance characteristics matching or exceeding existing concrete RRTs. The RRTs of the invention can be readily produced from widely available, low cost raw materials by a process suitable for large-scale production with improved energy consumption and more desirable carbon footprint and minimal environmental impact.

摘要翻译： 本发明提供由新型复合材料制造的新型铁路连接件，其具有优异的物理和性能特性匹配或超过现有的混凝土RRT。 本发明的RRT可以通过适用于大规模生产的方法由广泛可得的低成本原料容易地生产，其具有改善的能量消耗和更理想的碳足迹和最小的环境影响。

公开(公告)号：US09393715B2

公开(公告)日：2016-07-19

申请号：US14207421

申请日：2014-03-12

申请人： Jagadeesh Krishnan ,  Jitendra Jain ,  Deepak Ravikumar ,  Devin Patten ,  John Kuppler ,  Kenneth Smith ,  Xudong Hu

发明人： Jagadeesh Krishnan ,  Jitendra Jain ,  Deepak Ravikumar ,  Devin Patten ,  John Kuppler ,  Kenneth Smith ,  Xudong Hu

IPC分类号： E01B3/46 ,  B28B1/14 ,  E01B3/44 ,  B28B11/24 ,  B28B23/02 ,  C04B28/18 ,  C04B32/02 ,  C04B111/00

CPC分类号： B28B1/14 ,  B28B11/24 ,  B28B23/02 ,  C04B20/12 ,  C04B28/188 ,  C04B32/02 ,  C04B2111/00413 ,  E01B3/44 ,  Y02P40/18 ,  Y02P40/615 ,  C04B14/06 ,  C04B40/024 ,  C04B40/0268 ,  C04B2103/302 ,  C04B24/2647 ,  C04B20/1077 ,  C04B20/1037 ,  C04B20/1062 ,  C04B40/0231 ,  C04B14/043 ,  C04B20/1074 ,  C04B20/107

摘要： The invention provides novel railroad ties manufactured from novel composite materials that possess excellent physical and performance characteristics matching or exceeding existing concrete RRTs. The RRTs of the invention can be readily produced from widely available, low cost raw materials by a process suitable for large-scale production with improved energy consumption and more desirable carbon footprint and minimal environmental impact.

摘要翻译： 本发明提供由新型复合材料制造的新型铁路连接件，其具有优异的物理和性能特性匹配或超过现有的混凝土RRT。 本发明的RRT可以通过适用于大规模生产的方法由广泛可得的低成本原料容易地生产，其具有改善的能量消耗和更理想的碳足迹和最小的环境影响。

公开(公告)号：US06668447B2

公开(公告)日：2003-12-30

申请号：US10242377

申请日：2002-09-12

申请人： Sanjiv Singh Samant ,  Jinesh Jitendra Jain ,  Joseph Laughter

发明人： Sanjiv Singh Samant ,  Jinesh Jitendra Jain ,  Joseph Laughter

IPC分类号： H05K336

CPC分类号： H05K1/118 ,  H01J47/001 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

摘要： An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

公开(公告)号：US06483713B2

公开(公告)日：2002-11-19

申请号：US09989626

申请日：2001-11-20

申请人： Sanjiv Singh Samant ,  Jinesh Jitendra Jain ,  Joseph Laughter

发明人： Sanjiv Singh Samant ,  Jinesh Jitendra Jain ,  Joseph Laughter

IPC分类号： H05K100

CPC分类号： H05K1/189 ,  H01J47/001 ,  H05K3/0058 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49126

摘要： An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

摘要翻译： 获得多层电路板的一个更简单和更便宜的方法是使用柔性电路板并以有组织的方式折叠。 柔性电路具有独特的特性，可以作为三维电路，可以在多平面配置中成形，在特定区域中进行刚性化，并模制成用于特定应用的背板。 折叠电路由一系列可折叠的电路板条和刚性电路板条制成，这些条带互连，折叠并结合成复合结构。 可折叠带可以具有折叠布置，使得一组上折叠条和下可折叠条在相反方向折叠。 通过在相反的方向上折叠可折叠条，多个中间部分彼此堆叠。 折叠电路可以在第一折叠之后被接合，或者进一步折叠以实现更大的面积减小，并且随后作为复合多层结构粘结。