公开(公告)号：USD1063369S1

公开(公告)日：2025-02-25

申请号：US29968067

申请日：2024-10-14

Applicant: Jian Zhang

Designer： Jian Zhang

公开(公告)号：USD1047426S1

公开(公告)日：2024-10-22

申请号：US29942196

申请日：2024-05-14

Applicant: Jian Zhang

Designer： Jian Zhang

Abstract: FIG. 1 is a front elevation view of a mahjongg set bag showing the new design;
FIG. 2 is a back elevation view thereof;
FIG. 3 is a left-side view thereof;
FIG. 4 is a right-side view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is another perspective view thereof; and,
FIG. 9 is an enlarged view of the encircled portion in FIG. 7.
The broken lines depict portions of the mahjongg set bag that form no part of the claimed design.
The dash-dot lines in FIG. 7 and FIG. 9 illustrate the boundaries of the enlarged view indicators and form no part of the claimed design.

公开(公告)号：USD984612S1

公开(公告)日：2023-04-25

申请号：US29856827

申请日：2022-10-18

Applicant: Jian Zhang

Designer： Jian Zhang

公开(公告)号：US20230080291A1

公开(公告)日：2023-03-16

申请号：US18057727

申请日：2022-11-21

Applicant: Jian Zhang

Inventor： Xudong Ding

IPC: A63B69/40

Abstract: The utility model discloses an automatic ball launcher. The automatic ball launcher includes a ball launcher shell, in which an accommodating space is arranged; a ball launching channel, arranged in the accommodating space and provided with a ball launching inlet and a ball launching outlet; an acceleration mechanism, arranged in the accommodating space for pushing and accelerating the ball that enters the ball launching channel to a preset speed; and a ball launching mechanism, arranged in the accommodating space and close to the ball launching outlet for receiving the ball that is pushed by the acceleration mechanism and launching the ball from the ball launching outlet to the outside of the ball launching channel. The utility model can launch the ball more stably.

公开(公告)号：US11440117B2

公开(公告)日：2022-09-13

申请号：US16602396

申请日：2019-09-27

Applicant: Jian Zhang

Inventor： Jian Zhang

IPC: B23K3/00 ,  B23K3/047 ,  H01L23/00 ,  H01L21/68 ,  H01L21/687 ,  B23K3/06

Abstract: A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

公开(公告)号：US20200043759A1

公开(公告)日：2020-02-06

申请号：US15998295

申请日：2018-08-01

Applicant: Jian Zhang

Inventor： Jian Zhang

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A vertically oriented treatment chamber for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip. A treatment chamber comprises a first or upper heater at an upper end of the treatment chamber and a second or lower heater at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip supported on the wafer chip support ring.

公开(公告)号：US20190243753A1

公开(公告)日：2019-08-08

申请号：US16263363

申请日：2019-01-31

Applicant: Jian Zhang ,  Minghao Lu ,  Xiaolu Ye ,  Ning He

Inventor： Jian Zhang ,  Minghao Lu ,  Xiaolu Ye ,  Ning He

IPC: G06F11/36 ,  G06F9/50 ,  G06F17/11

Abstract: Systems and methods for testing a subject system with a software testing process are described. The system receives Boolean states responsive to repeatedly applying a first test case to a subject system. Each Boolean state signifies an outcome of an application of the first test case to a version of a first software feature over a span of time. The system identifies test case outcomes for the first test case that are adjacent in time and different and generates an intermittency value for the first test case. The system determines that the intermittency value for the first test case exceeds an intermittency threshold and alerts an engineering resource. Finally, the system repeats the above operations until the intermittency value for the first test case does not exceed the intermittency threshold.

公开(公告)号：US09629258B2

公开(公告)日：2017-04-18

申请号：US14998387

申请日：2015-12-28

Applicant: Jian Zhang

Inventor： Jian Zhang

IPC: B23K37/00 ,  H05K3/34 ,  B23K3/00 ,  B23K37/04 ,  B23K1/00 ,  B23K1/008 ,  H01L21/67 ,  B23K3/04 ,  B23K3/08 ,  B23K101/40

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/00 ,  B23K3/04 ,  B23K3/08 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/6719

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.

公开(公告)号：US09596786B2

公开(公告)日：2017-03-14

申请号：US14361858

申请日：2012-05-29

Applicant: Yigong Ding ,  Weizheng Yao ,  Jian Zhang ,  Weihua Ruan ,  Dawei Wang

Inventor： Yigong Ding ,  Weizheng Yao ,  Jian Zhang ,  Weihua Ruan ,  Dawei Wang

IPC: H05K7/20 ,  F25D3/02 ,  F25D17/02 ,  F25D31/00

CPC classification number: H05K7/20254 ,  F25B2400/24 ,  F25D3/02 ,  F25D16/00 ,  F25D17/02 ,  F25D31/002 ,  F28B1/06 ,  F28D9/00 ,  F28D15/00 ,  F28D20/021 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20281 ,  H05K7/20927 ,  H05K7/20945 ,  H01L2924/00

Abstract: A closed circulating water cooling apparatus and method. The cooling apparatus comprises: an internal cooling apparatus, a plate heat exchanger, an ice thermal-storage auxiliary cooling apparatus. The internal cooling apparatus comprises an air cooler. The ice thermal-storage auxiliary cooling apparatus comprises an ice thermal-storage apparatus.

Abstract translation: 封闭式循环水冷却装置及方法。 冷却装置包括：内部冷却装置，板式热交换器，冰蓄冷辅助冷却装置。 内部冷却装置包括空气冷却器。 冰蓄热辅助冷却装置包括冰蓄热装置。

公开(公告)号：US09572266B2

公开(公告)日：2017-02-14

申请号：US14998386

申请日：2015-12-28

Applicant: Jian Zhang

Inventor： Jian Zhang

IPC: B23K37/00 ,  H05K3/34 ,  B23K3/00 ,  B23K37/04 ,  B23K1/00 ,  B23K1/008 ,  H01L21/67 ,  B23K3/04 ,  B23K3/08

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/00 ,  B23K3/04 ,  B23K3/08 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/6719

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber. The exhaust member includes a plurality of individual exhaust lines connecting a plurality of process chambers to each other and a common exhaust line connected to the plurality of individual exhaust lines to exhaust the fluid to the outside of the substrate treating module.

Abstract translation: 提供一种半导体衬底制造装置和衬底处理方法，更具体地，涉及一种在半导体晶片上进行回流处理工艺的装置和方法。 该装置处理装置包括载置容纳基板的载体的载荷端口，具有一个回流处理单元的基板处理模块或用于在基板上进行回流处理的多个回流处理单元，以及基板传送模块， 传送机器人在负载端口和衬底处理模块之间传送衬底，衬底传送模块设置在负载端口和衬底处理模块之间。 回流处理单元包括其中具有处理空间的处理室和排出处理室内的流体的排气构件。 排气构件包括将多个处理室彼此连接的多个单独的排气管线和连接到多个单独排气管线的共同排气管线，以将流体排出到基板处理模块的外部。