公开(公告)号：US07507914B2

公开(公告)日：2009-03-24

申请号：US11136120

申请日：2005-05-24

申请人： Aaron Levine ,  Jay D. Stanke

发明人： Aaron Levine ,  Jay D. Stanke

IPC分类号： H05K1/16

CPC分类号： H01L21/485 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/225 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00

摘要： A miniature PWB with features that incorporate the required circuitry changes and component footprints, which has been enhanced with micro-castellations such as those found on ceramic surface mount packages. The miniature PWB is mounted on the circuit board using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit and part changes without changing the layout of the base printed wiring board.

摘要翻译： 具有特征的微型电路板，其中包含所需的电路变化和组件占位面积，这已经通过微型铸造（如陶瓷表面贴装封装上发现的）进行了增强。 使用本领域公知的技术将微型PWB安装在电路板上。 这种技术的组合提供了一种适应性强，耐用的互连方法，其允许电路和部件更改，而不改变基本印刷线路板的布局。