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公开(公告)号：US08147976B2
公开(公告)日：2012-04-03
申请号：US13172015
申请日：2011-06-29
摘要： A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了将玻璃料烧结到玻璃板的方法，其中烧结的玻璃料和玻璃板随后密封到另一个玻璃板以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US08147632B2
公开(公告)日：2012-04-03
申请号：US12156202
申请日：2008-05-30
CPC分类号： C03B19/06 , C03C3/21 , C03C8/08 , C03C8/24 , C03C27/06 , H01L51/5246 , Y10T428/131
摘要： A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了一种用于控制烘箱内的氧含量的方法，同时将玻璃料烧结到玻璃板上，其中烧结的玻璃料和玻璃板随后被密封到另一个玻璃板上以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US20090297861A1
公开(公告)日：2009-12-03
申请号：US12156202
申请日：2008-05-30
IPC分类号： B32B17/06 , C03B23/203
CPC分类号： C03B19/06 , C03C3/21 , C03C8/08 , C03C8/24 , C03C27/06 , H01L51/5246 , Y10T428/131
摘要： A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了一种用于控制烘箱内的氧含量的方法，同时将玻璃料烧结到玻璃板上，其中烧结的玻璃料和玻璃板随后被密封到另一个玻璃板上以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US08329303B2
公开(公告)日：2012-12-11
申请号：US13406950
申请日：2012-02-28
CPC分类号： C03B19/06 , C03C3/21 , C03C8/08 , C03C8/24 , C03C27/06 , H01L51/5246 , Y10T428/131
摘要： A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
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公开(公告)号：US20120156406A1
公开(公告)日：2012-06-21
申请号：US13406950
申请日：2012-02-28
CPC分类号： C03B19/06 , C03C3/21 , C03C8/08 , C03C8/24 , C03C27/06 , H01L51/5246 , Y10T428/131
摘要： A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了一种用于控制烘箱内的氧含量的方法，同时将玻璃料烧结到玻璃板上，其中烧结的玻璃料和玻璃板随后被密封到另一个玻璃板上以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US20110256407A1
公开(公告)日：2011-10-20
申请号：US13172015
申请日：2011-06-29
摘要： A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了将玻璃料烧结到玻璃板的方法，其中烧结的玻璃料和玻璃板随后密封到另一个玻璃板以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US07992411B2
公开(公告)日：2011-08-09
申请号：US12156377
申请日：2008-05-30
摘要： A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了将玻璃料烧结到玻璃板的方法，其中烧结的玻璃料和玻璃板随后密封到另一个玻璃板以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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公开(公告)号：US20090297862A1
公开(公告)日：2009-12-03
申请号：US12156377
申请日：2008-05-30
摘要： A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
摘要翻译： 本文描述了将玻璃料烧结到玻璃板的方法，其中烧结的玻璃料和玻璃板随后密封到另一个玻璃板以形成密封的玻璃包装。 密封玻璃封装的实例包括发光器件（例如有机发光二极管（OLED）器件），光伏器件，食品容器和药物容器。
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