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1.发明授权Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface 有权提高金属或金属合金表面的可焊性和耐腐蚀性的解决方案和工艺公开(公告)号：US08491713B2
公开(公告)日：2013-07-23
申请号：US13143222
申请日：2010-01-13
Applicant: Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
Inventor： Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
CPC classification number: C23C22/58 , C23C22/06 , C23C22/74 , C23F11/1676 , C25D5/48 , H01L21/4835 , H05K3/282 , H05K2203/122 , Y10T428/31678
Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
Abstract translation: 描述了一种新的溶液，其包含磷化合物和任选的可焊性增强化合物及其在增加金属或金属合金表面的可焊性和耐腐蚀性的方法中的用途。
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2.发明申请SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF A METAL OR METAL ALLOY SURFACE 有权提高金属或金属合金表面的焊接性和耐腐蚀性的方法和工艺公开(公告)号：US20110281124A1
公开(公告)日：2011-11-17
申请号：US13143222
申请日：2010-01-13
Applicant: Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
Inventor： Jürgen Barthelmes , Robert Ruether , Olaf Kurtz , Jana Breitfelder
CPC classification number: C23C22/58 , C23C22/06 , C23C22/74 , C23F11/1676 , C25D5/48 , H01L21/4835 , H05K3/282 , H05K2203/122 , Y10T428/31678
Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
Abstract translation: 描述了一种新的溶液，其包含磷化合物和任选的可焊性增强化合物及其在增加金属或金属合金表面的可焊性和耐腐蚀性的方法中的用途。
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