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公开(公告)号：US20120199491A1
公开(公告)日：2012-08-09
申请号：US13452139
申请日：2012-04-20
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/18 , C25D17/001 , C25D17/10 , C25D17/12 , H01L21/2885 , H01L21/67011 , H01L31/022425 , H05K3/241 , Y02E10/50
摘要： Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.
摘要翻译： 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6μm/分钟或更高）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。
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公开(公告)号：US08911609B2
公开(公告)日：2014-12-16
申请号：US13452139
申请日：2012-04-20
IPC分类号： C25D3/38 , H01L21/288 , H01L31/0224 , C25D17/10 , C25D17/12 , C25D5/00 , C25D17/00 , H01L21/67 , H05K3/24 , C25D5/18
CPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/18 , C25D17/001 , C25D17/10 , C25D17/12 , H01L21/2885 , H01L21/67011 , H01L31/022425 , H05K3/241 , Y02E10/50
摘要： Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.
摘要翻译： 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6μm/分钟或更高）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。
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公开(公告)号：US20090250352A1
公开(公告)日：2009-10-08
申请号：US12080680
申请日：2008-04-04
CPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/18 , C25D17/001 , C25D17/10 , C25D17/12 , H01L21/2885 , H01L21/67011 , H01L31/022425 , H05K3/241 , Y02E10/50
摘要： Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.
摘要翻译： 本发明的实施方案涉及将铜电镀到基底的至少一个表面上的方法，其中邻近电镀的至少一个表面（即，阴极）和电化学电池的阳极形成更均匀的双电层 ， 分别。 在一个实施方案中，电镀铜可以基本上不含枝晶，表现出高度的（111）晶体织构，和/或以高沉积速率（例如，约6mum /分钟或更多）电镀，由 在阳极处的至少一个表面处的阴极电流密度与阳极电流密度的比至少为约20℃的条件下对铜进行电镀。在另一个实施方案中，多孔阳极膜可以形成在可消耗的铜阳极上 使用促进形成邻近阳极的更均匀的电双层的长调理过程。
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公开(公告)号：US20090090631A1
公开(公告)日：2009-04-09
申请号：US11906882
申请日：2007-10-03
CPC分类号： C25D17/06 , C25D17/004 , C25D21/12 , Y10T29/49908
摘要： In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.
摘要翻译： 在一个实施例中，衬底保持器包括支撑衬底的基底，该基底包括具有周边区域的表面。 盖可以与基座组装，并且包括至少一个仅暴露表面的一部分的开口。 密封组件基本上密封盖和基底之间的区域，并进一步邻近基底的周边区域。 电极包括位于该区域内的至少一个接触部分，并延伸至基底的周边区域的至少一部分。 顺应性构件包括聚合物材料并且可以位于至少一个接触部分和基底的周边区域或覆盖物之间的区域内。 在其他实施例中，公开了一种电镀系统，其可以采用这种衬底保持器。
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公开(公告)号：US20090038947A1
公开(公告)日：2009-02-12
申请号：US11890997
申请日：2007-08-07
摘要： In one embodiment of the invention, an electroplating aqueous solution is disclosed. The electroplating aqueous solution includes at least two acids, copper, at least one accelerator agent, and at least two suppressor agents. The at least one accelerator agent provides an acceleration strength of at least about 2.0 and the at least two suppressor agents, collectively, provide a suppression strength of at least about 5.0. Methods of making and using such an electroplating aqueous solution are also disclosed.
摘要翻译： 在本发明的一个实施方案中，公开了电镀水溶液。 电镀水溶液包含至少两种酸，铜，至少一种促进剂和至少两种抑制剂。 所述至少一种促进剂提供至少约2.0的加速强度，并且所述至少两种抑制剂一起提供至少约5.0的抑制强度。 还公开了制造和使用这种电镀水溶液的方法。
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公开(公告)号：US07905994B2
公开(公告)日：2011-03-15
申请号：US11906882
申请日：2007-10-03
IPC分类号： C25B9/02
CPC分类号： C25D17/06 , C25D17/004 , C25D21/12 , Y10T29/49908
摘要： In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.
摘要翻译： 在一个实施例中，衬底保持器包括支撑衬底的基底，该基底包括具有周边区域的表面。 盖可以与基座组装，并且包括至少一个仅暴露表面的一部分的开口。 密封组件基本上密封盖和基底之间的区域，并进一步邻近基底的周边区域。 电极包括位于该区域内的至少一个接触部分，并延伸至基底的周边区域的至少一部分。 顺应性构件包括聚合物材料并且可以位于至少一个接触部分和基底的周边区域或覆盖物之间的区域内。 在其他实施例中，公开了一种电镀系统，其可以采用这种衬底保持器。
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