公开(公告)号：US07510463B2

公开(公告)日：2009-03-31

申请号：US11422753

申请日：2006-06-07

申请人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

发明人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

IPC分类号： B24B1/00 ,  B24B21/18

CPC分类号： B24B53/017 ,  B24B53/12

摘要： The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

摘要翻译： 本发明是一种用于延长研磨盘的寿命的装置和方法，用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化（CMP）中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成，每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明，提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。

公开(公告)号：US06183828B2

公开(公告)日：2001-02-06

申请号：US09082066

申请日：1998-05-20

申请人： Steven Francis Starcke ,  John David Amundson ,  Douglas Howard Piltingsrud ,  James Aloysius Hagan

发明人： Steven Francis Starcke ,  John David Amundson ,  Douglas Howard Piltingsrud ,  James Aloysius Hagan

IPC分类号： B32B300

CPC分类号： C03C17/3607 ,  C03C17/36 ,  C04B41/009 ,  C04B41/52 ,  C04B2111/00844 ,  C23C18/1865 ,  C23C18/1893 ,  G11B23/0021 ,  G11B23/0057 ,  Y02T50/67 ,  Y10S428/913 ,  Y10T428/21 ,  C04B41/0072 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/5042 ,  C04B41/5122 ,  C04B41/5353 ,  C04B41/5012 ,  C04B41/4541 ,  C04B41/5144 ,  C04B35/10 ,  C04B35/48

摘要： The invention is a method of plating a nonmetallic substrate comprising the steps of depositing an adhesion enhancing film on the substrate, treating the adhesion enhancing film to make the film catalytic, and forming an outer coating and passivating plate on the adhesion enhancing film. The resulting plated, nonmetallic substrates may comprise any number of materials used as an inner substrate such as compounds of oxide, nitride, phosphide, carbide, glass, ceramic, and mixtures thereof. In use, the resulting substrate may find application in any number of data storage and retrieval application.

摘要翻译： 本发明是一种镀非金属基材的方法，包括以下步骤：在基材上沉积粘合增强膜，处理粘合增强膜以使膜催化，并在粘合增强膜上形成外涂层和钝化板。 所得到的电镀非金属基底可以包括用作内部基底的任何数量的材料，例如氧化物，氮化物，磷化物，碳化物，玻璃，陶瓷及其混合物的化合物。 在使用中，所得到的底物可以应用于任何数量的数据存储和检索应用。

公开(公告)号：US5871810A

公开(公告)日：1999-02-16

申请号：US461400

申请日：1995-06-05

申请人： Steven Francis Starcke ,  John David Amundson ,  Douglas Howard Piltingsrud ,  James Aloysius Hagan

发明人： Steven Francis Starcke ,  John David Amundson ,  Douglas Howard Piltingsrud ,  James Aloysius Hagan

IPC分类号： C23C18/28 ,  C03C17/36 ,  C04B41/52 ,  C23C18/18 ,  G11B5/66 ,  G11B5/73 ,  G11B5/738 ,  G11B5/84 ,  G11B23/00

CPC分类号： C03C17/3607 ,  C03C17/36 ,  C04B41/009 ,  C04B41/52 ,  C23C18/1865 ,  C23C18/1893 ,  C04B2111/00844 ,  G11B23/0021 ,  G11B23/0057 ,  Y02T50/67 ,  Y10S428/913 ,  Y10T428/21

摘要： The invention is a method of plating a nonmetallic substrate comprising the steps of depositing an adhesion enhancing film on the substrate, treating the adhesion enhancing film to make the film catalytic, and forming an outer coating and passivating plate on the adhesion enhancing film. The resulting plated, nonmetallic substrates may comprise any number of materials used as an inner substrate such as compounds of oxide, nitride, phosphide, carbide, glass, ceramic, and mixtures thereof. In use, the resulting substrate may find application in any number of data storage and retrieval application.

摘要翻译： 本发明是一种镀非金属基材的方法，包括以下步骤：在基材上沉积粘合增强膜，处理粘合增强膜以使膜催化，并在粘合增强膜上形成外涂层和钝化板。 所得的电镀非金属基底可以包括用作内部基底的任何数量的材料，例如氧化物，氮化物，磷化物，碳化物，玻璃，陶瓷及其混合物的化合物。 在使用中，所得到的底物可以应用于任何数量的数据存储和检索应用。

公开(公告)号：US06801396B1

公开(公告)日：2004-10-05

申请号：US08964686

申请日：1997-11-05

申请人： Brent Ray Den Hartog ,  Dennis Leonard Fox ,  James Aloysius Hagan ,  John Chen Shen ,  Kannimangalam Venkatasubramanyam Viswanathan

发明人： Brent Ray Den Hartog ,  Dennis Leonard Fox ,  James Aloysius Hagan ,  John Chen Shen ,  Kannimangalam Venkatasubramanyam Viswanathan

IPC分类号： G11B582

CPC分类号： G11B5/84 ,  Y10S977/863 ,  Y10S977/881 ,  Y10S977/888 ,  Y10S977/895

摘要： The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is “wiped away” via mechanical action.

摘要翻译： 本发明利用化学和机械精加工的组合来将盘基片表面抛光至近原子光滑度。 一般来说，已经被加工（即粗糙研磨）到预定表面粗糙度的盘基片的表面受到化学制剂（称为攻击剂）的攻击。 化学制剂用于软化基材。 然后，软化的材料通过机械作用“擦去”。

公开(公告)号：US20070287367A1

公开(公告)日：2007-12-13

申请号：US11422753

申请日：2006-06-07

申请人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

发明人： Ben Kim ,  Manoj Balachandran ,  James Aloysius Hagan ,  Deoram Persaud ,  Adam Daniel Ticknor ,  Wei-tsu Tseng

IPC分类号： B24D11/00

CPC分类号： B24B53/017 ,  B24B53/12

摘要： The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.

摘要翻译： 本发明是一种用于延长研磨盘的寿命的装置和方法，用于在用于在生产集成的半导体晶片的表面中抛光和/或平面化半导体晶片的表面的抛光垫的化学机械平面化（CMP）中使用的抛光垫 电路。 本发明由包括多个磨料段的盘组成，每个研磨段围绕调节盘的公共旋转轴线彼此以切向和径向关系固定。 根据本发明，提供了用于将研磨段单独地或组合地移动到调节盘的活性研磨表面的平面内或外的装置。

公开(公告)号：US06236542B1

公开(公告)日：2001-05-22

申请号：US08184718

申请日：1994-01-21

申请人： Brent Ray Den Hartog ,  Dennis Leonard Fox ,  James Aloysius Hagan ,  John Chen Shen ,  Kannimangalam Venkatasubramanyam Viswanathan

发明人： Brent Ray Den Hartog ,  Dennis Leonard Fox ,  James Aloysius Hagan ,  John Chen Shen ,  Kannimangalam Venkatasubramanyam Viswanathan

IPC分类号： G11B582

CPC分类号： G11B5/84 ,  Y10S977/863 ,  Y10S977/881 ,  Y10S977/888 ,  Y10S977/895

摘要： The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is “wiped away” via mechanical action.

摘要翻译： 本发明利用化学和机械精加工的组合来将盘基片表面抛光至近原子光滑度。 一般来说，已经被加工（即粗糙研磨）到预定表面粗糙度的盘基片的表面受到化学制剂（称为攻击剂）的攻击。 化学制剂用于软化基材。 然后，软化的材料通过机械作用“擦去”。