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    Semiconductor device packaging structure and packaging method
    1.
    发明授权
    Semiconductor device packaging structure and packaging method 有权
    半导体器件封装结构及封装方法

    公开(公告)号：US09070672B2

    公开(公告)日：2015-06-30

    申请号：US13908246

    申请日：2013-06-03

    申请人： Ineffable Cellular Limited Liability Company

    发明人： Wen-Hsiung Chang

    IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/31

    CPC分类号： H01L23/49579 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2924/01033 ,  H01L2924/014

    摘要： Exemplary semiconductor device packaging structure and packaging method are provided. The packaging method uses an adhesive layer to bond multiple wafer pieces onto a first surface of a carrier substrate, each adjacent two of the wafer pieces having a gap formed therebetween for exposing a part of the adhesive layer. A packaging layer is filled in each of the gaps. At least one through silicon via is formed each of the wafer pieces to expose a bonding pad formed on an active surface of the wafer pieces. Redistribution circuit layers are formed on back surfaces of the respective wafer pieces and filled into the through silicon vias for electrical connection with the bonding pads. A sawing process is performed to saw starting from each of the packaging layers to a second surface of the carrier substrate, and thereby multiple semiconductor device packaging structures are obtained.

    摘要翻译： 提供了半导体器件封装结构和封装方法。 封装方法使用粘合剂层将多个晶片片接合到载体基板的第一表面上，每个相邻的两个晶片片之间形成有间隙，用于暴露粘合剂层的一部分。 包装层填充在每个间隙中。 每个晶片件形成至少一个通硅通孔，以暴露形成在晶片片的有效表面上的焊盘。 再分布电路层形成在各个晶片的后表面上，并填充到通孔中，用于与焊盘电连接。 进行锯切处理，从每个包装层开始到载体基板的第二表面，从而获得多个半导体器件封装结构。

    Image sensing device
    2.
    发明授权
    Image sensing device 有权
    图像传感装置

    公开(公告)号：US08982268B2

    公开(公告)日：2015-03-17

    申请号：US13665743

    申请日：2012-10-31

    申请人： Ineffable Cellular Limited Liability Company

    发明人： Taung-Yu Li

    IPC分类号： H04N5/225 ,  H04N9/04

    CPC分类号： H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N9/045

    摘要： An image sensing device includes an image sensing chip, an optical module and a protecting element. The image sensing chip has a front surface defining an image sensing region thereon. The optical module includes a barrel and at least one transparent element. The barrel is directly disposed on the front surface and around the image sensing region. The transparent element is disposed in the barrel and faces to the image sensing region. The protecting element covers an area of the front surface outside the optical module and surrounds the barrel. The image sensing device has a thin thickness.

    摘要翻译： 图像感测装置包括图像感测芯片，光学模块和保护元件。 图像感测芯片具有在其上限定图像感测区域的前表面。 光学模块包括筒体和至少一个透明元件。 筒体直接设置在前表面和图像感测区域周围。 透明元件设置在镜筒中并面向图像感测区域。 保护元件覆盖光学模块外部的前表面的一个区域并且围绕该镜筒。 图像感测装置具有薄的厚度。

    SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
    4.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD 有权
    半导体器件封装结构和封装方法

    公开(公告)号：US20130256842A1

    公开(公告)日：2013-10-03

    申请号：US13908246

    申请日：2013-06-03

    申请人： Ineffable Cellular Limited Liability Company

    发明人： Wen-Hsiung Chang

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49579 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2924/01033 ,  H01L2924/014

    摘要： Exemplary semiconductor device packaging structure and packaging method are provided. The packaging method uses an adhesive layer to bond multiple wafer pieces onto a first surface of a carrier substrate, each adjacent two of the wafer pieces having a gap formed therebetween for exposing a part of the adhesive layer. A packaging layer is filled in each of the gaps. At least one through silicon via is formed each of the wafer pieces to expose a bonding pad formed on an active surface of the wafer pieces. Redistribution circuit layers are formed on back surfaces of the respective wafer pieces and filled into the through silicon vias for electrical connection with the bonding pads. A sawing process is performed to saw starting from each of the packaging layers to a second surface of the carrier substrate, and thereby multiple semiconductor device packaging structures are obtained.

    摘要翻译： 提供了半导体器件封装结构和封装方法。 包装方法使用粘合剂层将多个晶片片粘合到载体基板的第一表面上，每个相邻的两个晶片片之间形成有间隙，用于暴露粘合剂层的一部分。 包装层填充在每个间隙中。 每个晶片件形成至少一个通硅通孔，以暴露形成在晶片片的有效表面上的焊盘。 再分布电路层形成在各个晶片的后表面上，并填充到通孔中，用于与焊盘电连接。 进行锯切处理，从每个包装层开始到载体基板的第二表面，从而获得多个半导体器件封装结构。

    Package process of backside illumination image sensor
    5.
    发明授权
    Package process of backside illumination image sensor 有权
    背面照明图像传感器的封装过程

    公开(公告)号：US09281332B2

    公开(公告)日：2016-03-08

    申请号：US13668245

    申请日：2012-11-03

    申请人： Ineffable Cellular Limited Liability Company

    发明人： Wen-Hsiung Chang

    IPC分类号： H01L27/146

    CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a package process of backside illumination image sensor, a wafer including a plurality of pads is provided. A first carrier is processed to form a plurality of blind vias therein. The first carrier is adhered to the wafer so that the blind vias face to the pads correspondingly. A spacing layer is formed and a plurality of sensing components are disposed. A second carrier is adhered on the spacing layer. Subsequently, a carrier thinning process is performed so that the blind vias become the through holes. An insulating layer is formed on the first carrier. An electrically conductive layer is formed on the insulating layer and filled in the though holes to electrically connect to the pads. The package process can achieve the exact alignment of the through holes and the pads, thereby increasing the package efficiency and improving the package quality.

    摘要翻译： 在背面照明图像传感器的封装处理中，提供包括多个焊盘的晶片。 处理第一载体以在其中形成多个盲孔。 第一载体粘附到晶片上，使得盲孔相应地面对焊盘。 形成间隔层并设置多个感测部件。 第二载体粘附在间隔层上。 随后，执行载流子稀化处理，使得盲孔成为通孔。 绝缘层形成在第一载体上。 在绝缘层上形成导电层，并填充在通孔中以电连接到焊盘。 封装过程可以实现通孔和焊盘的精确对准，从而提高封装效率并提高封装质量。