Abstract:
The present invention relates to a method of efficiently assigning addresses in a WPAN and a WPAN device. The address assignment method of the present invention is performed by a higher device. Address assignment information for determining an address to be assigned to a lower device, is managed. An address is assigned to a lower device that requests connection from the higher device based on the address assignment information. The address assignment information is updated to a address value as the address value is assigned, and the updated address assignment information is transmitted to lower devices. If an update of address assignment information is requested by the lower device that assigned an address value to a device lower thereto, the address assignment information is updated and the updated address assignment information is transmitted to lower devices.
Abstract:
A CMOS image sensor and a method for manufacturing the same are provided. The method can include: forming a device isolation layer on a device isolation region of a semiconductor substrate; forming photodiodes on photodiode regions of the semiconductor substrate; forming a salicide metal layer and a barrier metal layer sequentially on the entire surface of the semiconductor layer; forming a light blocking layer between the photodiodes to block a light incident a photodiode from reaching an adjacent photodiode by selectively removing the salicide metal layer and the barrier metal layer that have not reacted during a silicide process; and forming a dielectric layer on the entire surface of the semiconductor substrate having the light blocking layer.
Abstract:
Disclosed are a CMOS image sensor and a method for manufacturing the same, capable of improving the characteristics of the image sensor by increasing junction capacitance of a floating diffusion area. The CMOS image sensor generally includes a photodiode and a plurality of transistors (e.g., transfer, reset, drive, and select transistors), a first conductive type semiconductor substrate, having an active area including a photodiode area, a floating diffusion area, and a voltage input/output area, a gate electrode of each transistor on the active area, a first conductive type first well area in the semiconductor substrate corresponding to the voltage input/output area, a first conductive type second well area in the semiconductor substrate corresponding to the floating diffusion area, and a second conductive type diffusion area in the semiconductor substrate at opposed sides of each gate electrode.
Abstract:
Disclosed are a CMOS image sensor and a method for manufacturing the same, for reducing or preventing damage to a photodiode and improving a pixel design margin to achieve scale down of a pixel. The CMOS image sensor includes an isolation layer in a semiconductor substrate, a gate electrode crossing a part of the isolation layer and the active area, a photodiode area in the active area, an insulating sidewall spacer on sides of the gate electrode, a metal silicide layer on the gate electrode and at least part of a surface of the photodiode area adjacent to the gate electrode, a metal layer electrically connecting the gate electrode to the photodiode area, and a dielectric layer on the entire surface of semiconductor substrate.
Abstract:
A microwave oven is capable of cooking food using steam produced in a cooking cavity. The microwave oven includes a cabinet in which a cooking cavity is defined. A microwave heating unit radiates microwaves into the cooking cavity. A steaming unit is provided on a predetermined position of the cabinet to define a cooking space, which is partitioned from the cooking cavity. A steam guide passage guides steam produced in the cooking cavity, into the steaming unit.
Abstract:
The present invention relates to a method and to a wireless personal area network (WPAN) device in which the device sets the beacon slot in the WPAN device and receives beacon slot information from neighbor devices, while setting the beacon table of the devices, to avoid the transmission time of the neighbor devices and the transmission time of the devices neighboring the neighbor devices in a WPAN. In the method, beacon message, including information about neighbors' transmission time and information about neighbors' neighbors' transmission time, is received from neighbor devices. The beacon message is combined, and the neighbors' transmission time information and the neighbors' neighbors' transmission time information are input into a beacon table. The neighbors' transmission time and the neighbors' neighbors' transmission time are input into a field for BTTSs to be avoided in the beacon table. The first beacon slot is set, as my beacon transmission slot, among beacon slots except for the transmission time input into the field for BTTSs to be avoided. Information about the set beacon transmission slot is input into a field for my BTTS in the beacon table.
Abstract:
The ozone-resistant polyurethane composition according to the present invention, which is for the linings of valves, pipes or ozone contactors used in advanced water-treatment plants, comprises: 100 parts by weight of a polyurethane prepolymer consisting of toluene diisocyanate and poly(tetramethylene ether)glycol; from 8 to 14 parts by weight of 6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine; and from 0.8 to 2.8 parts by weight of benzophenone or benzotriazole. Also, the production method for the ozone-resistant polyurethane composition according to the present invention, which is for the linings of valves, pipes or ozone contactors used in advanced water treatment plants, comprises the steps of: mixing from 0.8 to 2.8 parts by weight of benzophenone or benzotriazole in 100 parts by weight of a polyurethane prepolymer consisting of toluene diisocyanate and poly(tetramethylene ether)glycol, and stirring for between 25 and 35 minutes at between 90 and 100° C.; and mixing from 8 to 14 parts by weight of 6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine into the stirred liquid.
Abstract:
Provided is a CMOS image sensor and method of manufacturing same. The CMOS image sensor includes a photodiode, a transfer transistor, a reset transistor, a drive transistor, and a select transistor. A device isolation layer is formed on a first conductive type substrate. Gate electrodes of the transfer transistor, the reset transistor, the drive transistor, and the select transistor are formed on an active region of the substrate with gate insulating layers interposed therebetween. A first diffusion region is formed of a second conductive type in a first region of the active region, where the first region does not include a floating diffusion region between the transfer transistor and the reset transistor and the photodiode region. A second diffusion region is formed of the second conductive type in the floating diffusion region at a concentration lower than that of the second conductive type first diffusion region.
Abstract:
A phototransistor of a CMOS image sensor suitable for decreasing the size of layout, and a method for fabricating the phototransistor are disclosed, in which the phototransistor includes a first conductive type semiconductor substrate; an STI layer on the first conductive type semiconductor substrate, to define an active area and a device isolation area in the first conductive type semiconductor substrate; a second conductive type well in the first conductive type semiconductor substrate; a gate line on the first conductive type semiconductor substrate; an ohmic contact layer in the second conductive type well, wherein the ohmic contact layer is overlapped with the gate line in state of interposing the STI layer therebetween; and a contact to connect the gate line with the ohmic contact layer through the STI layer.
Abstract:
CMOS image sensors and methods for fabricating the same are disclosed. A disclosed CMOS image sensor comprises: a semiconductor substrate; a photo diode; a microlens located over the photo diode; and a color filter layer located over the microlens.