SMART CARD WITH METAL INLAY ENCAPSULATING HIGH-DENSITY METAL PLUG

    公开(公告)号:US20240202484A1

    公开(公告)日:2024-06-20

    申请号:US18084039

    申请日:2022-12-19

    IPC分类号: G06K19/077

    CPC分类号: G06K19/07722

    摘要: A metal smart card, having an inlay layer, the inlay layer including a metal card body, the metal card body defining at least one cavity in the metal card body, the at least one cavity having a continuous surface defined by an inner surface of the metal card body, a metal plug, the metal plug being housed inside the at least one cavity, an electronic component, the electronic component being housed inside the at least one cavity, and a polymer layer disposed on an outer surface of the inlay layer, the polymer layer being in contact with an outer surface of the metal plug.