公开(公告)号：US11710676B2

公开(公告)日：2023-07-25

申请号：US17408227

申请日：2021-08-20

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Bernd Sporer

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/22 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L23/367 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/1056 ,  H05K2203/0195

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

公开(公告)号：US10582016B2

公开(公告)日：2020-03-03

申请号：US15331003

申请日：2016-10-21

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Mohan Marutirao Dhanawade

IPC: H04L29/06 ,  H04L29/08 ,  H04L12/00 ,  H04L12/40 ,  H04L12/66

Abstract: An industrial control system and a method of controlling an industrial control system having two communications protocols is described. The method comprises sending, by a controller, communications over a first communications network to a first device, the communications intended to control the first device and a second device, the communications transmitted to the first device from the controller in a first communications protocol; translating, by the first device, the communications from the controller in the first communications protocol intended for the second device into a second communications protocol; and transmitting, by the first device, the translated communications to the second device over a second communications network using the second communications protocol, wherein the first device is used to control or monitor one or more first processes in an industrial system and the second device is used to control or monitor one or more second processes in the industrial system.

公开(公告)号：US11822305B2

公开(公告)日：2023-11-21

申请号：US17140750

申请日：2021-01-04

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Balajose Goli ,  Abitha Beevi Mohammed Siddique ,  Venkatesh Mani Selvaraj ,  Vishal Fogla ,  Shantanu Ratnakar Rao Choudhary

IPC: G05B19/05 ,  G05B19/042 ,  G06F3/0482 ,  G06F3/04847

CPC classification number: G05B19/05 ,  G05B19/0426 ,  G06F3/0482 ,  G06F3/04847 ,  G05B2219/13144 ,  G05B2219/15006 ,  G05B2219/25067

Abstract: Exemplified herein is a graphical user interface for an industrial automation system that provides, in a single aggregated and eloquent view, a configuration workspace to discover and present configuration details of control components within an industrial automation system. These components may include industrial controllers, programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, programmable automation controllers (PACs), and the like, which have modules (as well as submodules) connected thereto. Among other things, the configuration workspace enables a holistic view of identified hardware configuration and the modular reconciliation and troubleshoot of the network device and module configurations.

公开(公告)号：US11477083B2

公开(公告)日：2022-10-18

申请号：US15843882

申请日：2017-12-15

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Daniel Halvard Miller ,  Keith George McNab ,  Wesley Michael Skeffington ,  Michael Joseph Yoensky ,  Steven J. Sullivan ,  William David Smith, II ,  John Ronald Burr

IPC: G05B19/042 ,  G05B19/418 ,  H04L41/0869 ,  H04L67/10 ,  G06F8/73 ,  H04L43/50 ,  H04W4/00 ,  G06F8/65 ,  G06F21/57 ,  H04L67/00 ,  H04W4/38 ,  H04L41/0253 ,  H04L41/00

Abstract: An apparatus is provided. The apparatus including a plurality of network interfaces, including a first network interface and a second network interface. The apparatus also includes a processor with two or more independent processing units, including a first independent processing unit and a second independent processing unit. The apparatus further includes a memory having first instructions and second instructions stored thereon. Execution of the first instructions, cause the first independent processing unit to execute operations associated with a first operating system and communicate, via the first network interface, over a bi-direction communication, with one or more platform computing devices. Execution of the second instructions, cause the second independent processing unit to execute real-time operations associated with a second operating system and communicate, via the second network interface, with one or more computing devices each having one or more sensors thereon.

公开(公告)号：US20210124329A1

公开(公告)日：2021-04-29

申请号：US17140750

申请日：2021-01-04

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Balajose Goli ,  Abitha Beevi Mohammed Siddique ,  Venkatesh Mani Selvaraj ,  Vishal Fogla ,  Shantanu Ratnakar Rao Choudhary

IPC: G05B19/05 ,  G05B19/042 ,  G06F3/0482 ,  G06F3/0484

Abstract: Exemplified herein is a graphical user interface for an industrial automation system that provides, in a single aggregated and eloquent view, a configuration workspace to discover and present configuration details of control components within an industrial automation system. These components may include industrial controllers, programmable logic controllers (PLCs), supervisory control and data acquisition (SCADA) systems, programmable automation controllers (PACs), and the like, which have modules (as well as submodules) connected thereto. Among other things, the configuration workspace enables a holistic view of identified hardware configuration and the modular reconciliation and troubleshoot of the network device and module configurations.

公开(公告)号：US10698377B2

公开(公告)日：2020-06-30

申请号：US15186995

申请日：2016-06-20

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Abitha Beevi Mohammed Siddique ,  Venkatesh Mani Selvaraj ,  Balajose Goli ,  Vishal Fogla ,  Shantanu Ratnakar Rao Choudhary

IPC: G05B19/042

Abstract: The exemplified methods and systems facilitates the configuring of IO devices and its IO modules (and submodules) in enabling an operator to retrieve, via a single input, in a development workspace, a list of IO modules and submodules that is compatible to a given IO device. The exemplified methods and systems facilitates retrieval of compatible IO modules and submodules based parameters of the IO modules and submodules. The exemplified methods and systems provide an intuitive interface, in a development workspace for configuring an IO device, to add a retrieved (i.e., searched) module or submodule from a list thereof to an existing project for a given IO device.

公开(公告)号：US20210043531A1

公开(公告)日：2021-02-11

申请号：US16534659

申请日：2019-08-07

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Bernd Sporer

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/22

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

公开(公告)号：US20210384098A1

公开(公告)日：2021-12-09

申请号：US17408227

申请日：2021-08-20

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Bernd Sporer

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/22

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

公开(公告)号：US11114361B2

公开(公告)日：2021-09-07

申请号：US16534659

申请日：2019-08-07

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Bernd Sporer

IPC: H01L23/367 ,  H05K1/18 ,  H05K3/22

Abstract: Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.

公开(公告)号：US11079915B2

公开(公告)日：2021-08-03

申请号：US15145095

申请日：2016-05-03

Applicant: INTELLIGENT PLATFORMS, LLC

Inventor： Pavan Kumar Singh Thakur ,  Jagadeesh Jinka ,  Chaithanya Guttikonda ,  Vibhoosh Gupta

IPC: G06F3/0484 ,  G05B19/409 ,  G06F3/0488

Abstract: Exemplified methods and systems provide a graphical HMI having an interface that mitigate or prevent touch errors and/or inadvertent touches through the use of multiple touch inputs, at a graphical user interface, of a touch-screen input device, to trigger an associated user interface command. In some embodiments, the multiple touch inputs comprise an input at two locations, one in relative association, with a displayed interface command, to trigger the command.