Abstract:
The present invention provides a fire safety apparatus for a high-pressure gas storage system which can suitably ensure the fire safety of the high-pressure tank. Preferably, a flame transfer member having superior flammability is provided outside the high-pressure tank having a tank valve on a first end thereof. The flame transfer member extends a second end of the high-pressure tank to the tank valve, so that when a fire occurs, the flame transfer member rapidly burns creating flames and transfers heat from the origin of the fire to a PRD (pressure relief device) provided on the tank valve.
Abstract:
The present invention provides a hydrogen supply system for a fuel cell which can compensate for a change in temperature, caused by heat generated when a high pressure tank is charged and discharged with hydrogen, using a metal hydride (MH) tank providing high hydrogen storage density, mounted in the high pressure tank such that hydrogen is to be discharged from the MH tank when hydrogen is charged to the high pressure tank, and hydrogen is to be charged to the MH tank when hydrogen is discharged from the high pressure tank.For this, the present invention provides a hydrogen supply system for a fuel cell, including: a high pressure tank which is capable of storing hydrogen received from a hydrogen refueling station and includes a metal hydride (MH) tank capable of storing hydrogen, mounted therein; first and second solenoid valves provided at both ends of the high pressure tank; a buffer tank connected in parallel to the high pressure tank; and a fuel cell stack connected to the buffer tank so that hydrogen from the high pressure tank or the MH tank is supplied to the stack through the buffer tank, wherein the hydrogen is charged from the hydrogen refueling station to the high pressure tank and discharged from the high pressure tank through the first solenoid valve, the hydrogen is charged and discharged to and from the MH tank through the second solenoid valve, the hydrogen is discharged from the MH tank as the first and second solenoid valves are simultaneously opened when the hydrogen is charged to the high pressure tank, and the hydrogen discharged from the MH tank is stored in the buffer tank and then supplied to the fuel cell stack.
Abstract:
Disclosed is a method for forming a bit-line of a semiconductor device. In a line patterning process for forming a bit-line in a DRAM (Dynamic Random Access Memory) of a semiconductor device, a barrier metal layer and a tungsten layer are sequentially formed on an interlayer insulating film comprising a contact hole to fill the contact hole by a CVD (Chemical Vapor Deposition) method. Then, the barrier metal layer and the tungsten layer are removed until the interlayer insulating film is exposed, and a tungsten layer having small thickness is re-formed on the exposed interlayer insulating film by a PVD (physical Vapor Deposition) method. As a result, the bit-line area is reduced as much as the barrier metal layer removed from the upper portion of interlayer insulating film, thereby having low bit-line capacitance.
Abstract:
A power supply apparatus for a fuel cell vehicle, and provides a power supply apparatus of a fuel cell vehicle. More specifically, an InfraRed (IR) data transmitter transmits and receives data to/from a hydrogen charger and a power supply apparatus, that is connected to the IR data transmitter, selectively supplies power thereto according to the opening/closing of a fuel door. In particular, a sensing apparatus is connected to the power supply apparatus and senses opening/closing of the fuel door and a normal power source that is connected to the sensing apparatus for opening/closing the fuel door selectively supplies power to the sensing apparatus when the normal power source is off.
Abstract:
A method for forming a recess gate of a semiconductor device is disclosed. The method for forming a recess gate of a semiconductor device comprises forming a polysilicon layer pattern covering a contact region on a semiconductor substrate, etching a predetermined thickness of the semiconductor substrate in the active region using the polysilicon layer pattern as an etching mask to form a recess gate region, and forming and patterning the gate polysilicon layer, the gate conductive layer and the gate hard mask layer to form a recess gate.
Abstract:
Disclosed is a semiconductor device having low voltage characteristic and advantageous integrity simultaneously. The semiconductor device comprises a silicon-on-insulator (SOI) substrate of a stack structure comprising a base layer as a means for supporting, a buried oxide layer, and a semiconductor layer providing an active region; and a first transistor and a second transistor formed on the active region of the SOI substrate, wherein the first and second transistors are formed as a stack structure on one active region and they share one gate electrode, a drain region of the second transistor is electrically connected to the gate electrode and a source region of the second transistor is electrically connected to the active region.
Abstract:
The present invention provides a hydrogen storage system for a vehicle which is readily attachable to and detachable from the vehicle. The hydrogen storage system includes a plurality of hydrogen tanks filled with hydrogen at the outside and is mounted on the top of a rear underfloor of the vehicle in the form of a cartridge.For this purpose, the present invention provides a hydrogen storage system for a vehicle, including a hydrogen storage housing, accommodating a hydrogen storage material filled with hydrogen at the outside and easily attached to and detached from the vehicle using a quick connector.
Abstract:
The present invention discloses a method for fabricating a SOI wafer. The method for fabricating the SOI wafer of the present invention, comprising the steps of: preparing a semiconductor substrate and a base substrate; forming a pad oxide layer, a nitride layer and a mask oxide layer in sequence on one surface of the semiconductor substrate; etching the pad oxide layer, the nitride layer, and the mask oxide layer to expose an isolation region of the semiconductor substrate; forming a trench by etching the exposed semiconductor substrate region; removing the mask oxide layer; forming a field oxide layer having bird's-beak at the edge thereof by oxidizing the low surface of the trench; removing the field oxide layer; forming an isolation layer of trench type to fill the oxide layer into the trench; removing the nitride layer and the pad oxide layer; depositing a first insulating layer on the isolation layer and the semiconductor substrate; depositing a second insulating layer on the base substrate; bonding the semiconductor substrate and the base substrate to form a contact of the first insulating layer with the second insulating layer; polishing the surface of the semiconductor substrate using the isolation layer as a polishing stopper; and further polishing the surface of the semiconductor substrate to expose the bird's beak and to form a semiconductor layer of a desired thickness.