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    Variable resistive memory device
    1.
    发明授权
    Variable resistive memory device 有权
    可变电阻式存储器件

    公开(公告)号：US08901526B2

    公开(公告)日：2014-12-02

    申请号：US13753712

    申请日：2013-01-30

    Applicant: Ki-hyung Nam ,  Yong-kwan Kim ,  Ho-joong Lee ,  Pulunsol Cho

    Inventor： Ki-hyung Nam ,  Yong-kwan Kim ,  Ho-joong Lee ,  Pulunsol Cho

    IPC: H01L29/00 ,  H01L45/00 ,  H01L27/22

    CPC classification number: H01L45/1253 ,  H01L27/228

    Abstract: A variable resistive memory device capable of reducing contact resistance by including a contact layer having low contact resistance, the variable resistive memory device including a substrate comprising an active region; a gate line on the substrate; a first contact layer electrically connected to the active region; a memory cell contact plug electrically connected to the first contact layer; and a variable resistive memory cell electrically connected to the memory cell contact plug, wherein the first contact layer has less contact resistance with respect to the active region than the memory cell contact plug.

    Abstract translation: 一种可变电阻存储器件，其能够通过包括具有低接触电阻的接触层来降低接触电阻，所述可变电阻式存储器件包括包括有源区的衬底; 衬底上的栅极线; 电连接到有源区的第一接触层; 电连接到所述第一接触层的存储单元接触插塞; 以及电连接到所述存储单元接触插塞的可变电阻存储单元，其中所述第一接触层相对于所述有源区具有比所述存储单元接触插塞更小的接触电阻。

    LIGHT-EMITTING DIODE (LED) WAFER PICKER
    2.
    发明申请
    LIGHT-EMITTING DIODE (LED) WAFER PICKER 有权

    公开(公告)号：US20130234194A1

    公开(公告)日：2013-09-12

    申请号：US13415982

    申请日：2012-03-09

    Applicant: in hwan RYU ,  hak pyo LEE ,  il chan Yang ,  Ho Joong LEE

    Inventor： in hwan RYU ,  hak pyo LEE ,  il chan Yang ,  Ho Joong LEE

    IPC: H01L33/48

    CPC classification number: H01L21/6838 ,  B25J11/0095 ,  B25J15/0616 ,  B65G47/911 ,  H01L33/005 ,  Y10T29/53178 ,  Y10T29/53191

    Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.

    VARIABLE RESISTIVE MEMORY DEVICE
    3.
    发明申请
    VARIABLE RESISTIVE MEMORY DEVICE 有权
    可变电阻存储器件

    公开(公告)号：US20130221306A1

    公开(公告)日：2013-08-29

    申请号：US13753712

    申请日：2013-01-30

    Applicant: Ki-hyung NAM ,  Yong-kwan KIM ,  Ho-joong LEE ,  Pulunsol CHO

    Inventor： Ki-hyung NAM ,  Yong-kwan KIM ,  Ho-joong LEE ,  Pulunsol CHO

    IPC: H01L45/00

    CPC classification number: H01L45/1253 ,  H01L27/228

    Abstract: A variable resistive memory device capable of reducing contact resistance by including a contact layer having low contact resistance, the variable resistive memory device including a substrate comprising an active region; a gate line on the substrate; a first contact layer electrically connected to the active region; a memory cell contact plug electrically connected to the first contact layer; and a variable resistive memory cell electrically connected to the memory cell contact plug, wherein the first contact layer has less contact resistance with respect to the active region than the memory cell contact plug.

    Abstract translation: 一种可变电阻存储器件，其能够通过包括具有低接触电阻的接触层来降低接触电阻，所述可变电阻式存储器件包括包括有源区的衬底; 衬底上的栅极线; 电连接到有源区的第一接触层; 电连接到所述第一接触层的存储单元接触插塞; 以及电连接到所述存储单元接触插塞的可变电阻存储单元，其中所述第一接触层相对于所述有源区具有比所述存储单元接触插塞更小的接触电阻。

    Light-emitting diode (LED) wafer picker
    6.
    发明授权
    Light-emitting diode (LED) wafer picker 有权
    发光二极管（LED）晶圆拾取器

    公开(公告)号：US08904629B2

    公开(公告)日：2014-12-09

    申请号：US13415982

    申请日：2012-03-09

    Applicant: In Hwan Ryu ,  Hak Pyo Lee ,  Il Chan Yang ,  Ho Joong Lee

    Inventor： In Hwan Ryu ,  Hak Pyo Lee ,  Il Chan Yang ,  Ho Joong Lee

    IPC: B23P19/00

    CPC classification number: H01L21/6838 ,  B25J11/0095 ,  B25J15/0616 ,  B65G47/911 ,  H01L33/005 ,  Y10T29/53178 ,  Y10T29/53191

    Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.

    Abstract translation: 提供了可以增加吸力并可以执行稳定吸附而不考虑与LED晶片的顶表面接触的发光二极管（LED）晶片拾取器。 LED晶片拾取器可以包括主体，其以吸附状态保持设置在主体下方的LED晶片，当从LED晶片拾取器的顶部吸入的空气沿着流线型的放电表面被排出到 LED晶片拾取器，引导构件，使得空气能够沿着排出表面流动，引导构件设置在排出表面的下方，形成在引导构件的中心部分中的单个中心孔，不包括面向排出表面的部分， 以及用于支撑LED晶片的支撑部，所述支撑部从所述引导构件向下延伸。 因此，能够容易地进行与LED晶片拾取器相对远的LED晶片的吸附。 此外，可以防止LED晶片的顶面与引导构件接触，从而由于异物的污染而减少检测。

    LIGHT-EMITTING DIODE (LED) WAFER PICKER
    7.
    发明申请
    LIGHT-EMITTING DIODE (LED) WAFER PICKER 审中-公开
    发光二极管（LED）WAFER PICKER

    公开(公告)号：US20150035302A1

    公开(公告)日：2015-02-05

    申请号：US14518232

    申请日：2014-10-20

    Applicant: In Hwan Ryu ,  Hak Pyo Lee ,  Il Chan Yang ,  Ho Joong Lee

    Inventor： In Hwan Ryu ,  Hak Pyo Lee ,  Il Chan Yang ,  Ho Joong Lee

    IPC: H01L21/683 ,  B25J11/00 ,  B25J15/06

    CPC classification number: H01L21/6838 ,  B25J11/0095 ,  B25J15/0616 ,  B65G47/911 ,  H01L33/005 ,  Y10T29/53178 ,  Y10T29/53191

    Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.

    Abstract translation: 提供了可以增加吸力并且可以执行稳定吸附而不考虑与LED晶片的顶表面接触的发光二极管（LED）晶片拾取器。 LED晶片拾取器可以包括主体，其以吸附状态保持设置在主体下方的LED晶片，当从LED晶片拾取器的顶部吸入的空气沿着流线型的放电表面被排出到 LED晶片拾取器，引导构件，使得空气能够沿着排出表面流动，引导构件设置在排出表面的下方，形成在引导构件的中心部分中的单个中心孔，不包括面向排出表面的部分， 以及用于支撑LED晶片的支撑部，所述支撑部从所述引导构件向下延伸。 因此，能够容易地进行与LED晶片拾取器相对远的LED晶片的吸附。 此外，可以防止LED晶片的顶面与引导构件接触，从而由于异物的污染而减少检测。

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