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18 条记录 (耗时 0.023 秒)

    Method of Producing Semiconductor Device and Semiconductor Device
    3.
    发明申请
    Method of Producing Semiconductor Device and Semiconductor Device 有权
    生产半导体器件和半导体器件的方法

    公开(公告)号：US20080258267A1

    公开(公告)日：2008-10-23

    申请号：US11884536

    申请日：2006-02-08

    申请人： Hiroaki Nakashima

    发明人： Hiroaki Nakashima

    IPC分类号： H01L23/538 ,  H01L21/304 ,  H01L21/768

    CPC分类号： H01L21/76898 ,  H01L21/304 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A method of producing a semiconductor device which can reliably perform conductor filling to form a through hole electrode by a simple method is provided. A method of producing a semiconductor device of the present invention includes the steps of thinning a substrate from its back side in a state in which a first supporting body is attached to the front side of the substrate, removing the first supporting body from the substrate and attaching a second supporting body having an opening to the back side of the substrate, forming a through hole communicating with the opening of the second supporting body in the substrate before or after attaching the second supporting body, forming an insulating film within the through hole, and filling a conductor into the through hole of the substrate.

    摘要翻译： 提供一种通过简单的方法制造能够可靠地进行导体填充以形成通孔电极的半导体器件的制造方法。 本发明的半导体装置的制造方法包括以下步骤：在基板的正面安装有第一支撑体的状态下，将基板从其背面变薄，从基板移除第一支撑体， 将具有开口的第二支撑体附接到基板的背面，在安装第二支撑体之前或之后形成与基板中的第二支撑体的开口连通的通孔，在通孔内形成绝缘膜， 并将导体填充到基板的通孔中。

    Method of producing semiconductor device and semiconductor device
    6.
    发明授权
    Method of producing semiconductor device and semiconductor device 有权
    半导体器件和半导体器件的制造方法

    公开(公告)号：US08278738B2

    公开(公告)日：2012-10-02

    申请号：US11884536

    申请日：2006-02-08

    申请人： Hiroaki Nakashima

    发明人： Hiroaki Nakashima

    IPC分类号： H01L29/40

    CPC分类号： H01L21/76898 ,  H01L21/304 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： A method of producing a semiconductor device which can reliably perform conductor filling to form a through hole electrode by a simple method is provided. A method of producing a semiconductor device of the present invention includes the steps of thinning a substrate from its back side in a state in which a first supporting body is attached to the front side of the substrate, removing the first supporting body from the substrate and attaching a second supporting body having an opening to the back side of the substrate, forming a through hole communicating with the opening of the second supporting body in the substrate before or after attaching the second supporting body, forming an insulating film within the through hole, and filling a conductor into the through hole of the substrate.

    摘要翻译： 提供一种通过简单的方法制造能够可靠地进行导体填充以形成通孔电极的半导体器件的制造方法。 本发明的半导体装置的制造方法包括以下步骤：在基板的正面安装有第一支撑体的状态下，将基板从其背面变薄，从基板移除第一支撑体， 将具有开口的第二支撑体附接到基板的背面，在安装第二支撑体之前或之后形成与基板中的第二支撑体的开口连通的通孔，在通孔内形成绝缘膜， 并将导体填充到基板的通孔中。

    Ink jet recording apparatus
    9.
    发明授权
    Ink jet recording apparatus 有权
    喷墨记录装置

    公开(公告)号：US07156481B2

    公开(公告)日：2007-01-02

    申请号：US10833116

    申请日：2004-04-28

    申请人： Hiroyuki Matsuba ,  Tohru Nakagawa ,  Hideo Torii ,  Takeshi Kamada ,  Kazunari Chikanawa ,  Hiroaki Nakashima ,  Seishi Tomari

    发明人： Hiroyuki Matsuba ,  Tohru Nakagawa ,  Hideo Torii ,  Takeshi Kamada ,  Kazunari Chikanawa ,  Hiroaki Nakashima ,  Seishi Tomari

    IPC分类号： B41J29/38 ,  B41J2/45

    CPC分类号： B41J2/155 ,  B41J2/14233 ,  B41J2/1433 ,  B41J2002/14362 ,  B41J2002/14475 ,  B41J2002/14491 ,  B41J2202/20

    摘要： An ink jet recording apparatus, which performs printing by ink ejection, includes a pressure chamber in which ink liquid is filled; a nozzle hole (116) which is formed so as to communicate with the pressure chamber; a piezoelectric element (113) which is formed on the pressure chamber, and deforms the pressure chamber by mechanical expansion and contraction, whereby pressure is generated in the pressure chamber and ink is ejected from the nozzle hole (116); and a dew point control unit (123) which maintains a dew point in an atmosphere of the piezoelectric element (113) and the vicinity of the piezoelectric element at a lower value than a dew point in an environment where the ink jet recording apparatus is set. The dew point control unit (123) includes a compressor (123a), and an air drier (123b) which dries compression gas from the compressor (123a) and feeds it to the piezoelectric element.

    摘要翻译： 通过喷墨进行打印的喷墨记录装置包括其中填充有墨液的压力室; 形成为与压力室连通的喷嘴孔（116）; 形成在压力室上的压电元件（113），并通过机械膨胀和收缩使压力室变形，从而在压力室中产生压力，并且从喷嘴孔（116）喷射墨水。 和露点控制单元（123），其在设置有喷墨记录装置的环境下，将压电元件（113）的气氛和压电元件附近的露点保持在低于露点的值 。 露点控制单元（123）包括压缩机（123a）和干燥来自压缩机（123a）的压缩气体并将其供给到压电元件的空气干燥器（123b）。