公开(公告)号：US09349615B2

公开(公告)日：2016-05-24

申请号：US13883143

申请日：2010-12-30

申请人： Jianyou Xie ,  Xizhou Li ,  Wei Mu ,  Yongzhong Wang ,  Haidong Wei

发明人： Jianyou Xie ,  Xizhou Li ,  Wei Mu ,  Yongzhong Wang ,  Haidong Wei

IPC分类号： H01L29/00 ,  H01L21/56 ,  H01L25/065 ,  H01L27/04 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L27/04 ,  H01L2223/5442 ,  H01L2223/54486 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC chips are provided on the substrate, an adhesive film is disposed between each of the two IC chips and the substrate, the IC chips are connected to first pads on the substrate through bonding wires, and the substrate is covered by a mold cap. A third IC chip may be further disposed on one of the IC chips, and the third IC chip is connected to the first pad and the IC chip under the third IC chip respectively through a bonding wire. A substrate adopting a surface mount technology (SMT) PAD window-opening manner is used, chip mounting is performed on the substrate, and the substrate undergoes reflow soldering, cleaning, die bonding, plasma cleaning, bonding, marking, cutting, and packing, so that the SiP system-integration IC chip package is manufactured. The package of the present invention integrates devices of different types, has a complete system function, and can be used as a middle stage of further development of system on chip (SoC).

摘要翻译： 提供一种系统级封装（SiP）系统集成电路（IC）芯片封装及其制造方法。 封装包括衬底，无源器件和两个IC芯片设置在衬底上，粘合膜设置在两个IC芯片和衬底之间，IC芯片通过接合线连接到衬底上的第一焊盘， 并且基板被模具盖覆盖。 第三IC芯片可以进一步设置在一个IC芯片上，并且第三IC芯片分别通过接合线连接到第三IC芯片下面的第一焊盘和IC芯片。 使用采用表面贴装技术（SMT）PAD开窗方式的基板，在基板上进行芯片安装，并且基板进行回流焊接，清洗，芯片接合，等离子体清洗，接合，标记，切割和封装， 从而制造SiP系统集成IC芯片封装。 本发明的封装集成了不同类型的器件，具有完整的系统功能，可以作为芯片（SoC）进一步开发的中间阶段。

公开(公告)号：US20130214386A1

公开(公告)日：2013-08-22

申请号：US13883143

申请日：2010-12-30

申请人： Jianyou Xie ,  Xizhou Li ,  Wei Mu ,  Yongzhong Wang ,  Haidong Wei

发明人： Jianyou Xie ,  Xizhou Li ,  Wei Mu ,  Yongzhong Wang ,  Haidong Wei

IPC分类号： H01L21/56 ,  H01L27/04

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L27/04 ,  H01L2223/5442 ,  H01L2223/54486 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC chips are provided on the substrate, an adhesive film is disposed between each of the two IC chips and the substrate, the IC chips are connected to first pads on the substrate through bonding wires, and the substrate is covered by a mold cap. A third IC chip may be further disposed on one of the IC chips, and the third IC chip is connected to the first pad and the IC chip under the third IC chip respectively through a bonding wire. A substrate adopting a surface mount technology (SMT) PAD window-opening manner is used, chip mounting is performed on the substrate, and the substrate undergoes reflow soldering, cleaning, die bonding, plasma cleaning, bonding, marking, cutting, and packing, so that the SiP system-integration IC chip package is manufactured. The package of the present invention integrates devices of different types, has a complete system function, and can be used as a middle stage of further development of system on chip (SoC).

摘要翻译： 提供一种系统级封装（SiP）系统集成电路（IC）芯片封装及其制造方法。 封装包括衬底，无源器件和两个IC芯片设置在衬底上，粘合膜设置在两个IC芯片和衬底之间，IC芯片通过接合线连接到衬底上的第一焊盘， 并且基板被模具盖覆盖。 第三IC芯片可以进一步设置在一个IC芯片上，并且第三IC芯片分别通过接合线连接到第三IC芯片下面的第一焊盘和IC芯片。 使用采用表面贴装技术（SMT）PAD开窗方式的基板，在基板上进行芯片安装，并且基板进行回流焊接，清洗，芯片接合，等离子体清洗，接合，标记，切割和封装， 从而制造SiP系统集成IC芯片封装。 本发明的封装集成了不同类型的器件，具有完整的系统功能，可以作为芯片（SoC）进一步开发的中间阶段。