Applying different pressures through sub-pad to fixed abrasive CMP pad
    1.
    发明授权
    Applying different pressures through sub-pad to fixed abrasive CMP pad 有权
    通过子垫将不同的压力施加到固定的磨料CMP垫上

    公开(公告)号:US08858300B2

    公开(公告)日:2014-10-14

    申请号:US12702333

    申请日:2010-02-09

    摘要: A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.

    摘要翻译: 化学机械抛光(CMP)系统包括旋转抛光台,其包括提供具有不同压力的至少两个压力区的压板; 位于所述压板上的子垫,所述子垫包括允许通过其传递不同压力的多个开口; 定位在子垫上的固定磨料垫; 以及密封地联接到所述压板的压力产生系统,用于在所述至少两个压力区域中产生不同的压力,其中所述不同压力在所述固定磨料垫上产生形貌。 还提供了一个子垫和相关方法。

    APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD
    2.
    发明申请
    APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD 有权
    将不同的压力通过辅助垫片施加到固定的磨料CMP垫

    公开(公告)号:US20110195640A1

    公开(公告)日:2011-08-11

    申请号:US12702333

    申请日:2010-02-09

    IPC分类号: B24B1/00 B24B7/20 B24B37/00

    摘要: A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmission of the different pressures therethrough; a fixed abrasive pad positioned on the sub-pad; and a pressure-creating system sealingly coupled to the platen for creating a different pressure in the at least two pressure zones, wherein the different pressures create topography on the fixed abrasive pad. A sub-pad and related method are also provided.

    摘要翻译: 化学机械抛光(CMP)系统包括旋转抛光台,其包括提供具有不同压力的至少两个压力区的压板; 位于所述压板上的子垫,所述子垫包括允许通过其传递不同压力的多个开口; 定位在子垫上的固定磨料垫; 以及密封地联接到所述压板的压力产生系统,用于在所述至少两个压力区域中产生不同的压力,其中所述不同压力在所述固定磨料垫上产生形貌。 还提供了一个子垫和相关方法。

    Detailing and cleaning apparatus for green ceramic dry dicing process
    3.
    发明授权
    Detailing and cleaning apparatus for green ceramic dry dicing process 失效
    绿色陶瓷干式切割工艺的细部和清洁装置

    公开(公告)号:US6033289A

    公开(公告)日:2000-03-07

    申请号:US139513

    申请日:1998-08-25

    摘要: An apparatus for processing a ceramic laminate comprising an array of unfired ceramic substrates having intersecting slots in at least two directions formed on a side thereof. The apparatus includes a frame and a vacuum chuck fixture movable with respect to the frame for securing the laminate. A plurality of the blade assemblies are independently movable and adapted for passage through different slots in the laminate to loosen debris therefrom. Each blade assembly comprises a pair of blade portions having opposed and spaced tapered cutting edges biased against the wall of the slot by a spring. The pair of blade portions is adapted for lateral movement during passage along the slot toward and away from the slot wall, wherein one of the blade portion pairs guides the other of the blade portion pairs for contact with the slot wall. A flexible cleaner includes fabric pads, an oscillating brush and a vacuum cleaner and passes along the slot after passage of the blade assembly to remove loosened debris from the slot.

    摘要翻译: 一种用于处理陶瓷层压体的装置,其包括在其一侧形成的至少两个方向上具有相交槽的未烧制陶瓷基板阵列。 该装置包括可相对于框架移动的框架和真空吸盘夹具,用于固定层压板。 多个叶片组件可独立地移动并且适于通过层叠体中的不同的狭槽以从其中松开碎片。 每个叶片组件包括一对叶片部分,其具有相对且间隔开的锥形切割边缘,该切割边缘通过弹簧偏置在狭槽的壁上。 所述一对叶片部分适于在沿着所述槽朝向和远离所述狭槽壁通过期间的横向移动,其中所述叶片部分对中的一个引导所述叶片部分对中的另一个以与所述狭槽壁接触。 柔性清洁器包括织物垫,振荡刷和真空吸尘器,并且在通过刀片组件之后沿着狭槽通过以从槽中去除松散的碎屑。