Fluorosilicone mold release composition
    1.
    发明授权
    Fluorosilicone mold release composition 有权
    氟硅酮脱模组合物

    公开(公告)号:US08497340B2

    公开(公告)日:2013-07-30

    申请号:US12305738

    申请日:2007-06-15

    摘要: Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf—X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).

    摘要翻译: 公开在包含式(I)的氟硅酮化合物:(I)的脱模剂组合物中,其中R 1,R 2,R 4,R 5,R 6,R 7,R 8和R 9各自为相同或不同的取代或未取代的烷基 ,或取代或未取代的芳基,R 3和R 10各自为 取代或未取代的烷基或取代或未取代的芳基,或者Rf-X-或Z-Y-,其中X和Y各自为 二价有机基团,Rf为C1-6氟烷基,Z为含有可水解位点的甲硅烷基,m为1-100,n为1-50,o为0-200。 脱模组合物可以提供脱模性和脱模性(反复脱模性)的优异的脱模性和耐久性。

    FLUOROSILICONE MOLD RELEASE COMPOSITION
    2.
    发明申请
    FLUOROSILICONE MOLD RELEASE COMPOSITION 有权
    氟代硅氧烷释放组合物

    公开(公告)号:US20100126380A1

    公开(公告)日:2010-05-27

    申请号:US12305738

    申请日:2007-06-15

    IPC分类号: C09D5/00 C07F7/18 B28B7/36

    摘要: Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf-X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).

    摘要翻译: 公开在包含式(I)的氟硅酮化合物:(I)的脱模剂组合物中,其中R 1,R 2,R 4,R 5,R 6,R 7,R 8和R 9各自为相同或不同的取代或未取代的烷基 ,或取代或未取代的芳基,R 3和R 10各自为 取代或未取代的烷基或取代或未取代的芳基,或者Rf-X-或Z-Y-,其中X和Y各自为 二价有机基团,Rf为C1-6氟烷基,Z为含有可水解位点的甲硅烷基,m为1-100,n为1-50,o为0-200。 脱模组合物可以提供脱模性和脱模性(反复脱模性)的优异的脱模性和耐久性。

    SURFACE MODIFIER
    3.
    发明申请
    SURFACE MODIFIER 有权
    表面改性剂

    公开(公告)号:US20090208728A1

    公开(公告)日:2009-08-20

    申请号:US11910356

    申请日:2006-03-30

    摘要: A surface modifier comprising an organosilicone compound represented by General Formula (A) and/or General Formula (B): F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)rSi(X′)3-a(R1)a (A) and F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)2-a(R1)aSiO(F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)1-a(R1)aSiO)zF—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)2-a(R1)aSi (B) wherein q is an integer from 1 to 3; m, n, and o are independently integers from 0 to 200; p is 1 or 2; X is O or a bivalent organic group; r is an integer from 2 to 20; R1 is a C1-22 linear or branched hydrocarbon group; a is an integer from 0 to 2; X′ is hydrolysable group; and z is an integer from 0 to 10 when a is 0 or 1.

    摘要翻译: F(CF 2)q - (OC 3 F 6)m - (OC 2 F 4)n - (OCF 2)o(CH 2)p X(CH 2)n表示的由有机硅氧烷化合物表示的表面改性剂,由通式(A)和/ )R(X')3-a(R1)a(A)和F-(CF2)q-(OC3F6)m-(OC2F4)n-(OCF2)o(CH2)pX(CH2) 2-a(R1)aSiO(F-(CF2)q-(OC3F6)m-(OC2F4)n-(OCF2)o(CH2)pX(CH2)r(X')1-a(R1)aSiO)zF - (CF 2)q - (OC 3 F 6)m - (OC 2 F 4)n - (OCF 2)o(CH 2)p X(CH 2)r(X')2-a(R1)aSi(B)其中q是从1到 3; m,n和o独立地为0至200的整数; p为1或2; X是O或二价有机基团; r为2〜20的整数; R1是C1-22直链或支链烃基; a是从0到2的整数; X'是可水解基团; 当a为0或1时,z为0至10的整数。

    Silicone composition and electrically conductive silicone adhesive formed therefrom
    4.
    发明授权
    Silicone composition and electrically conductive silicone adhesive formed therefrom 失效
    有机硅组合物和由其形成的导电硅氧烷粘合剂

    公开(公告)号:US06534581B1

    公开(公告)日:2003-03-18

    申请号:US09620397

    申请日:2000-07-20

    IPC分类号: C08K505

    摘要: A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4−n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid. A silicone adhesive and a multi-part curable silicone composition.

    摘要翻译: 一种用于制备硅氧烷粘合剂的硅氧烷组合物,所述组合物通过混合(A)每分子平均含有至少两个硅键合的羟基的有机聚硅氧烷制备; (B)足以固化组合物的量的交联剂; 其中所述试剂选自(i)至少一种具有式R 2 n SiX 4-n的硅烷,其中每个R 2独立地选自具有1至约8个碳原子的一价烃和一价卤代烃基,n为0或1,X 是-OR2或-OCH2CH2OR2; (ii)(i)的部分水解产物和(iii)包含(i)和(ii)的混合物; (C)足以赋予硅氧烷粘合剂导电性的导电填料,其中填料包括至少具有选自银,金,铂,钯和合金的金属外表面的颗粒 的; (D)有效量的分子量高达约1000且每分子含有至少一个羟基的羟基官能有机化合物,条件是该化合物基本上不能抑制组合物的固化; 和(E)催化量的包含羧酸金属盐的缩合催化剂。 硅氧烷粘合剂和多部分可固化的硅氧烷组合物。

    Silicone composition and electrically conductive, cured silicone product
    6.
    发明授权
    Silicone composition and electrically conductive, cured silicone product 失效
    有机硅组合物和导电固化的硅氧烷产品

    公开(公告)号:US06831145B2

    公开(公告)日:2004-12-14

    申请号:US10226396

    申请日:2002-08-23

    IPC分类号: C08G7708

    摘要: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

    摘要翻译: 一种用于制备固化的硅氧烷产品的硅氧烷组合物,该组合物通过混合:(A)每分子平均含有至少两个环氧官能的有机基团的有机聚硅氧烷; (B)固化剂的量足以固化组合物,只要固化剂不含酚羟基; (C)足以赋予硅氧烷产品导电性的导电填料,其中填料包括至少具有选自银,金,铂,钯及其合金的金属外表面的颗粒; 和(D)有效量的分子量高达约1000且每分子含有至少一个羟基的羟基官能的有机化合物,只要该化合物基本上不抑制组合物的固化。 固化的硅氧烷产品和多部分有机硅组合物。

    Silicone composition and electrically conductive silicone adhesive formed therefrom
    7.
    发明授权
    Silicone composition and electrically conductive silicone adhesive formed therefrom 失效
    有机硅组合物和由其形成的导电硅氧烷粘合剂

    公开(公告)号:US06433057B1

    公开(公告)日:2002-08-13

    申请号:US09536845

    申请日:2000-03-28

    IPC分类号: C08K310

    摘要: A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R13SiO(R12SiO)nSiR13 wherein each R1 is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0.1 to 200 Pa·s at 25° C., and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R23SiO1/2 siloxane units and SiO4/2 siloxane units wherein each R2 is independently alkyl or alkenyl, the mole ratio of R23SiO1/2 units to SiO4/2 units is from 0.65 to 1.9, the resin contains an average of from about 3 to 30 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition; and (E) a catalytic amount of a hydrosilylation catalyst. An electrically conductive silicone adhesive comprising a reaction product of the above-described composition and a multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B) are present with components (C) and (E) in the same part.

    摘要翻译: 一种硅氧烷组合物,其包含(A)10至50重量份的具有式R 13 SiO(R 12 SiO)n SiR 13的聚二有机硅氧烷,其中每个R 1独立地是一价脂族烃基或一价卤代脂族烃基,n具有这样的值, 聚二有机硅氧烷在25℃下的粘度为0.1至200Pa.s,聚二有机硅氧烷每分子含有至少两个烯基; (B)50〜90重量份基本上由R23SiO1 / 2硅氧烷单元和SiO4 / 2硅氧烷单元组成的有机聚硅氧烷树脂,其中每个R 2独立地为烷基或烯基,R 23 SiO 1/2单元与SiO 4/2单元的摩尔比为 从0.65至1.9,树脂平均含有约3至30摩尔%的链烯基,组分(A)和(B)的总量为100重量份; (C)每分子平均具有至少两个与硅键合的氢原子的有机氢聚硅氧烷,其量足以固化该组合物; (D)足以赋予组合物导电性的量的导电填料; 和(E)催化量的氢化硅烷化催化剂。 包含上述组合物的反应产物和不包含组分(A)和组分(B))的包含组分(A)至(E)的两份或多份的多部分有机硅组合物的导电性硅氧烷粘合剂, 部分(C)和(E)在同一部分。

    Silicone composition and electrically conductive silicone adhesive formed therefrom
    8.
    发明授权
    Silicone composition and electrically conductive silicone adhesive formed therefrom 有权
    有机硅组合物和由其形成的导电硅氧烷粘合剂

    公开(公告)号:US06361716B1

    公开(公告)日:2002-03-26

    申请号:US09620179

    申请日:2000-07-20

    IPC分类号: C08K302

    摘要: A curable silicone composition for preparing a silicone adhesive, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound is free of acetylenic hydroxy groups and the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a hydrosilylation catalyst. A silicone adhesive and a multi-part curable silicone composition.

    摘要翻译: 一种用于制备硅氧烷粘合剂的可固化硅氧烷组合物,该组合物包含(A)每分子平均含有至少两个硅键合的烯基的有机聚硅氧烷; (B)每分子平均具有至少两个与硅键合的氢原子的有机氢聚硅氧烷,其浓度足以固化该组合物; (C)足以赋予硅氧烷粘合剂导电性的导电填料,其中填料包括至少具有选自银,金,铂,钯及其合金的金属外表面的颗粒; (D)有效量的分子量高达约1000并且每分子含有至少一个羟基的羟基官能化有机化合物,条件是该化合物不含炔属羟基,并且该化合物基本上不抑制 组成; 和(E)催化量的氢化硅烷化催化剂。 硅氧烷粘合剂和多部分可固化的硅氧烷组合物。