摘要:
Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf—X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).
摘要:
Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf-X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).
摘要:
A surface modifier comprising an organosilicone compound represented by General Formula (A) and/or General Formula (B): F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)rSi(X′)3-a(R1)a (A) and F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)2-a(R1)aSiO(F—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)1-a(R1)aSiO)zF—(CF2)q—(OC3F6)m—(OC2F4)n—(OCF2)o(CH2)pX(CH2)r(X′)2-a(R1)aSi (B) wherein q is an integer from 1 to 3; m, n, and o are independently integers from 0 to 200; p is 1 or 2; X is O or a bivalent organic group; r is an integer from 2 to 20; R1 is a C1-22 linear or branched hydrocarbon group; a is an integer from 0 to 2; X′ is hydrolysable group; and z is an integer from 0 to 10 when a is 0 or 1.
摘要:
A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R2nSiX4−n wherein each R2 is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is —OR2 or —OCH2CH2OR2; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid. A silicone adhesive and a multi-part curable silicone composition.
摘要翻译:一种用于制备硅氧烷粘合剂的硅氧烷组合物,所述组合物通过混合(A)每分子平均含有至少两个硅键合的羟基的有机聚硅氧烷制备; (B)足以固化组合物的量的交联剂; 其中所述试剂选自(i)至少一种具有式R 2 n SiX 4-n的硅烷,其中每个R 2独立地选自具有1至约8个碳原子的一价烃和一价卤代烃基,n为0或1,X 是-OR2或-OCH2CH2OR2; (ii)(i)的部分水解产物和(iii)包含(i)和(ii)的混合物; (C)足以赋予硅氧烷粘合剂导电性的导电填料,其中填料包括至少具有选自银,金,铂,钯和合金的金属外表面的颗粒 的; (D)有效量的分子量高达约1000且每分子含有至少一个羟基的羟基官能有机化合物,条件是该化合物基本上不能抑制组合物的固化; 和(E)催化量的包含羧酸金属盐的缩合催化剂。 硅氧烷粘合剂和多部分可固化的硅氧烷组合物。
摘要:
A surface treatment composition comprises a polyfluoropolyether silane. The polyfluoropolyether silane and the surface treatment composition are produced by reacting a perfluoropolyether-containing compound and a hydrosilane in the pres-ence of a hydrosilylation catalyst and an isomer reducing agent.
摘要:
A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.
摘要:
A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R13SiO(R12SiO)nSiR13 wherein each R1 is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0.1 to 200 Pa·s at 25° C., and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R23SiO1/2 siloxane units and SiO4/2 siloxane units wherein each R2 is independently alkyl or alkenyl, the mole ratio of R23SiO1/2 units to SiO4/2 units is from 0.65 to 1.9, the resin contains an average of from about 3 to 30 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition; and (E) a catalytic amount of a hydrosilylation catalyst. An electrically conductive silicone adhesive comprising a reaction product of the above-described composition and a multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B) are present with components (C) and (E) in the same part.
摘要:
A curable silicone composition for preparing a silicone adhesive, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound is free of acetylenic hydroxy groups and the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a hydrosilylation catalyst. A silicone adhesive and a multi-part curable silicone composition.
摘要:
A surface treatment composition comprising (i) an organosilicon compound having an alkoxysilane functional group at the end of a fluorocontaining polyether chain and (ii) fluorocontaining polyether compound s, wherein a content of the fluorocontaining polyether compounds in the surface treatment composition is less than 25 mol % based on the surface treatment composition.
摘要:
The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal containing catalyst, a conductive metal particulate, a precrosslinked elastomeric silicone particle, and a non-reactive volatile diluent. The electrically conductive silicone compositions of this invention are useful as electrically conductive adhesives and coatings for electrical and electronic devices. The cured electrically conductive silicone compositions of this invention have high electroconductivity and rubbery elasticity.