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    Broken wafer recovery system
    2.
    发明授权
    Broken wafer recovery system 有权
    破碎晶圆回收系统

    公开(公告)号：US08459276B2

    公开(公告)日：2013-06-11

    申请号：US13115064

    申请日：2011-05-24

    申请人： Craig Lyle Stevens ,  David Eric Berkstresser ,  Wendell Thomas Blonigan

    发明人： Craig Lyle Stevens ,  David Eric Berkstresser ,  Wendell Thomas Blonigan

    IPC分类号： B08B3/00

    CPC分类号： A47L9/28 ,  H01L21/67271 ,  H01L21/67288 ,  H01L21/6838

    摘要： An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.

    摘要翻译： 用于回收和清洁破碎的基板的装置和方法，用于使用硅晶片的制造系统。 放置机构将吸头移动到破碎的基底的位置，并且使用耦合到柔性软管的抽吸泵去除破碎的碎片。 发动机盖定位在吸头的入口处，并且在罩的底部设置有遏制延伸部，以允许空气流入入口并防止从托盘到罩的热传导。 引脚可以围绕吸头的入口延伸，以使基板能够破裂成较小的部件以便移除。

    High throughput architecture for semiconductor processing
    8.
    发明授权
    High throughput architecture for semiconductor processing 有权
    用于半导体处理的高通量架构

    公开(公告)号：US06860965B1

    公开(公告)日：2005-03-01

    申请号：US09888017

    申请日：2001-06-21

    申请人： Craig Lyle Stevens

    发明人： Craig Lyle Stevens

    IPC分类号： C23C14/56 ,  H01L21/00 ,  H01L21/677 ,  C23F1/00 ,  B65G49/07 ,  C23C16/00 ,  H01L21/306

    CPC分类号： H01L21/6719 ,  C23C14/566 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/139

    摘要： In one embodiment, a wafer processing system has a loading station, a process module, and a load lock directly adjacent to the process module. The load lock has a small volume and can include integrated heating/cooling units. The load lock also has a wafer transfer mechanism for placing a wafer directly to the process module. The wafer processing system does not employ a transfer chamber to transport wafers between the load lock and the process module. Instead, a wafer is directly transferred from the load lock to the process module using the wafer transfer mechanism. Not requiring a transfer chamber not only improves the throughput of the wafer processing system, but also lowers its complexity and component count as well. The throughput of the wafer processing system is also improved by using a small volume load lock with integrated cooling/heating units.

    摘要翻译： 在一个实施例中，晶片处理系统具有加载站，处理模块和与处理模块直接相邻的加载锁。 负载锁具有小体积，并且可以包括集成的加热/冷却单元。 负载锁还具有用于将晶片直接放置到处理模块的晶片传送机构。 晶片处理系统不使用传送室来在加载锁和处理模块之间传送晶片。 相反，使用晶片传送机构将晶片从负载锁直接传递到处理模块。 不需要传送室不仅提高了晶片处理系统的吞吐量，而且降低了其复杂性和元件数量。 通过使用具有集成冷却/加热单元的小体积负载锁，也提高了晶片处理系统的吞吐量。