公开(公告)号：US09487172B2

公开(公告)日：2016-11-08

申请号：US14343888

申请日：2012-03-09

申请人： Jeongeun Shin ,  Junbum Park ,  Hansung Lee ,  Seungman Kim ,  Sungjea Ko ,  Hyokak Kim ,  Bosang Kim ,  Keunyung Byun

发明人： Jeongeun Shin ,  Junbum Park ,  Hansung Lee ,  Seungman Kim ,  Sungjea Ko ,  Hyokak Kim ,  Bosang Kim ,  Keunyung Byun

IPC分类号： B60R21/0134 ,  G06K9/00 ,  B60R1/00 ,  B60W30/095 ,  B60K31/00 ,  H04N5/232

CPC分类号： B60R21/0134 ,  B60K31/0008 ,  B60R1/00 ,  B60R2300/105 ,  B60R2300/70 ,  B60R2300/802 ,  B60R2300/8093 ,  B60W30/095 ,  B60W2420/42 ,  G06K9/00805 ,  H04N5/23238

摘要： Disclosed are an image display device and a method thereof capable of detecting a distance between an obstacle included in a distorted image captured by a wide angle camera and a vehicle to thus prevent an occurrence of an accident in which the vehicle collides with the obstacle so as to damaged, in advance. The image display device includes: a storage unit configured to store obstacle characteristic images previously captured from multiple viewpoints; an image capture unit configured to capture images of a surrounding area of a vehicle; a controller configured to detect an obstacle from the captured images on the basis of the images captured by the image capture unit and the obstacle characteristic images, and generate warning information when a distance value between the vehicle and the obstacle is equal to or smaller than a first pre-set distance value; and a display unit configured to display the generated warning information.

摘要翻译： 公开了一种图像显示装置及其方法，其能够检测由广角摄像机拍摄的失真图像中包括的障碍物与车辆之间的距离，从而防止发生车辆与障碍物碰撞的事故，以便 提前损坏。 图像显示装置包括：存储单元，被配置为存储先前从多个视点捕获的障碍物特征图像; 被配置为捕获车辆的周围区域的图像的图像捕获单元; 控制器，其被配置为基于由所述图像捕获单元捕获的图像和所述障碍物特征图像，从所捕获的图像中检测障碍物，并且当所述车辆和所述障碍物之间的距离值等于或小于 第一预设距离值; 以及显示单元，被配置为显示所生成的警告信息。

公开(公告)号：US07078247B2

公开(公告)日：2006-07-18

申请号：US10250144

申请日：2003-06-06

申请人： Lawrence Bauer, Jr. ,  Kenneth Giewont ,  Subramanian Iyer ,  Bosang Kim ,  Jeffrey Lloyd ,  Peter Locke ,  James Norum ,  Paul Parries ,  Kent Way ,  Kwong Hon Wong

发明人： Lawrence Bauer, Jr. ,  Kenneth Giewont ,  Subramanian Iyer ,  Bosang Kim ,  Jeffrey Lloyd ,  Peter Locke ,  James Norum ,  Paul Parries ,  Kent Way ,  Kwong Hon Wong

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L21/4763 ,  H01L21/44 ,  G01R31/26

CPC分类号： H01L22/24 ,  H01L21/31116 ,  Y10T436/115831

摘要： The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or other material behind the liner. A weak spot in the liner permits the gas to react with the silicon, which produces a visible area that can be readily identified. The test can be performed in a few hours, in contrast to a period of several months required to complete the process, package the circuit and conduct a burn-in test.

摘要翻译： 在短时间内通过将衬垫暴露于攻击衬底后面的下层硅或其他材料的反应性气体来测试集成电路中的互连结构或其他层中的衬垫的完整性。 衬里中的弱点允许气体与硅反应，这产生可以容易地识别的可见区域。 该测试可以在几个小时内进行，与完成该过程所需的几个月的时间相比，封装电路并进行老化测试。

公开(公告)号：US20050010455A1

公开(公告)日：2005-01-13

申请号：US10250144

申请日：2003-06-06

申请人： Lawrence Bauer ,  Kenneth Giewont ,  Subramanian Iyer ,  Bosang Kim ,  Jeffrey Lloyd ,  Peter Locke ,  James Norum ,  Paul Parries ,  Kent Way ,  Kwong Wong

发明人： Lawrence Bauer ,  Kenneth Giewont ,  Subramanian Iyer ,  Bosang Kim ,  Jeffrey Lloyd ,  Peter Locke ,  James Norum ,  Paul Parries ,  Kent Way ,  Kwong Wong

IPC分类号： H01L21/311 ,  H01L21/66 ,  G06F17/60

CPC分类号： H01L22/24 ,  H01L21/31116 ,  Y10T436/115831

摘要： The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or other material behind the liner. A weak spot in the liner permits the gas to react with the silicon, which produces a visible area that can be readily identified. The test can be performed in a few hours, in contrast to a period of several months required to complete the process, package the circuit and conduct a burn-in test.

摘要翻译： 在短时间内通过将衬垫暴露于攻击衬底后面的下层硅或其他材料的反应性气体来测试集成电路中的互连结构或其他层中的衬垫的完整性。 衬里中的弱点允许气体与硅反应，这产生可以容易地识别的可见区域。 该测试可以在几个小时内进行，与完成该过程所需的几个月的时间相比，封装电路并进行老化测试。