公开(公告)号：US11924974B2

公开(公告)日：2024-03-05

申请号：US18196661

申请日：2023-05-12

申请人： BESI SWITZERLAND AG

发明人： Norbert Bilewicz ,  Andreas Mayr ,  Hugo Pristauz ,  Hubert Selhofer

IPC分类号： H05K13/04 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H05K13/08

CPC分类号： H05K13/0413 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L24/741 ,  H05K13/046 ,  H05K13/0815 ,  G05B2219/45031

摘要： The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US11696429B2

公开(公告)日：2023-07-04

申请号：US17196798

申请日：2021-03-09

申请人： BESI SWITZERLAND AG

发明人： Norbert Bilewicz ,  Andreas Mayr ,  Hugo Pristauz ,  Hubert Selhofer

IPC分类号： H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

CPC分类号： H05K13/0413 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L24/741 ,  H05K13/046 ,  H05K13/0815 ,  G05B2219/45031

摘要： The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US20210272925A1

公开(公告)日：2021-09-02

申请号：US17252756

申请日：2019-06-23

申请人： Besi Switzerland AG

发明人： Markus Aebischer

IPC分类号： H01L23/00 ,  H01L21/677

摘要： An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.

公开(公告)号：US10973158B2

公开(公告)日：2021-04-06

申请号：US15947571

申请日：2018-04-06

申请人： BESI SWITZERLAND AG

发明人： Norbert Bilewicz ,  Andreas Mayr ,  Hugo Pristauz ,  Hubert Selhofer

IPC分类号： H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

摘要： The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US20140305372A1

公开(公告)日：2014-10-16

申请号：US14253625

申请日：2014-04-15

申请人： Besi Switzerland AG

发明人： Ruedi Grueter ,  Christof Koster ,  Paul Andreas Stadler

IPC分类号： B05C5/02

CPC分类号： B05C5/027 ,  B05C5/0216 ,  B05C5/0279 ,  B05C5/0295 ,  H01L21/6715 ,  H01L24/743 ,  H05K13/0469

摘要： A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.

摘要翻译： 用于在基材上分配粘合剂的装置包括具有第一分配喷嘴和至少一个第二分配喷嘴的书写头。 该设备可以在两种操作模式下操作，并且被配置为执行从一种操作模式到另一种操作模式的改变的以下步骤：提升书写头，缩回或延伸针脚，以及将书写头降低到 预定的工作高度，其中分配喷嘴的尖端在销的缩回状态下达到基板上方的基本相似的高度，并且其中，至少一个第二分配喷嘴的尖端在顶部上方比顶端高出基板的高度 的第一分配喷嘴处于销的延伸状态。

公开(公告)号：US11996385B2

公开(公告)日：2024-05-28

申请号：US17252760

申请日：2019-06-24

申请人： Besi Switzerland AG

发明人： Andreas Mayr ,  Manfred Dorfer

IPC分类号： H01L21/00 ,  B65G47/90 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L24/799 ,  B65G47/902 ,  H01L21/6838 ,  B65G2203/0233

摘要： An apparatus 100 for releasing a die 150 with a vacuum platform 130 with two or more segments 140 is provided, which may be extended independently of the surface of the vacuum platform 130 to push against the adhesive film 110 at the respective attachment in the direction of the die gripper 170. By providing two or more segments 140 that are independently extendable, die detachment (or at least partial detachment) may be performed in parallel, and two or more dies 150 may be detached before the adhesive film 110 needs to be repositioned. Both measures may increase throughput. In addition, empty attachment positions may be omitted.

公开(公告)号：US20210195816A1

公开(公告)日：2021-06-24

申请号：US17196798

申请日：2021-03-09

申请人： BESI SWITZERLAND AG

发明人： Norbert BILEWICZ ,  Andreas MAYR ,  Hugo PRISTAUZ ,  Hubert SELHOFER

IPC分类号： H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

摘要： The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US09233389B2

公开(公告)日：2016-01-12

申请号：US14253625

申请日：2014-04-15

申请人： Besi Switzerland AG

发明人： Ruedi Grueter ,  Christof Koster ,  Paul Andreas Stadler

IPC分类号： B05B7/06 ,  B05B3/00 ,  B05C5/02 ,  H05K13/04 ,  H01L23/00 ,  H01L21/67

CPC分类号： B05C5/027 ,  B05C5/0216 ,  B05C5/0279 ,  B05C5/0295 ,  H01L21/6715 ,  H01L24/743 ,  H05K13/0469

摘要： A device for dispensing adhesive on a substrate comprises a writing head with a first dispensing nozzle and at least one second dispensing nozzle. The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: —lifting of the writing head, retracting or extending a pin, and lowering of the writing head to a predetermined working altitude, wherein the tips of the dispensing nozzles reach a substantially similar altitude above the substrate in the retracted state of the pin, and wherein the tip of the at least one second dispensing nozzle reaches a higher altitude above the substrate than the tip of the first dispensing nozzle in the extended state of the pin.

摘要翻译： 用于在基材上分配粘合剂的装置包括具有第一分配喷嘴和至少一个第二分配喷嘴的书写头。 该设备可以在两种操作模式下操作，并且被配置为执行从一种操作模式到另一种操作模式的改变的以下步骤：书写头的移动，缩回或延伸针脚以及降低书写头 到预定的工作高度，其中分配喷嘴的尖端在销的缩回状态下到达基板上方基本相似的高度，并且其中至少一个第二分配喷嘴的尖端在基板上方比在 第一分配喷嘴的尖端处于销的延伸状态。

公开(公告)号：US20150008249A1

公开(公告)日：2015-01-08

申请号：US14323420

申请日：2014-07-03

申请人： Besi Switzerland AG

发明人： Christoffer Stroemberg ,  Heinrich Berchtold ,  Charles Galea

IPC分类号： B23K1/06

CPC分类号： B23K1/06 ,  B23K1/0016 ,  B23K3/063

摘要： A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

摘要翻译： 用于在基底上分配和分配无助焊剂的装置包括细长工具，工具安装件，超声波发生器，导线管，以及任选的散热器和壳体。 该工具可以固定到工具安装座上，并且具有一个纵向钻孔，该钻孔通向工具尖端的开口。 导线管沿着中心纵向轴线延伸穿过超声波发生器和工具安装座，突出到工具的纵向钻孔中并达到工具尖端上方的位置。 导线管不接触工具。 超声波发生器固定在刀架上。 有利地，可以主动冷却的冷却室形成在壳体的内壁和超声波发生器之间。

公开(公告)号：US08925608B2

公开(公告)日：2015-01-06

申请号：US14158747

申请日：2014-01-17

申请人： Besi Switzerland AG

发明人： Andreas Mayr

IPC分类号： B32B37/00 ,  H01L21/67 ,  B29C65/00 ,  B30B15/06 ,  B30B15/34

CPC分类号： H01L21/67103 ,  B29C66/9121 ,  B30B15/064 ,  B30B15/34 ,  H01L24/75 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/75502 ,  H01L2224/75745

摘要： A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.

摘要翻译： 用于将半导体芯片安装在基板上的接合头包括接合头本体和由单件构成的抽吸构件。 用于加热，冷却和监测吸附构件的温度所需的元件都被整合到吸入构件中，使得加热和冷却元件都不会被阻止热传递的表面与半导体芯片分离。 接合头本体仅包含为抽吸构件提供电力所需的元件和冷却介质。