公开(公告)号：US20210195816A1

公开(公告)日：2021-06-24

申请号：US17196798

申请日：2021-03-09

申请人： BESI SWITZERLAND AG

发明人： Norbert BILEWICZ ,  Andreas MAYR ,  Hugo PRISTAUZ ,  Hubert SELHOFER

IPC分类号： H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

摘要： The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US20230284426A1

公开(公告)日：2023-09-07

申请号：US18196661

申请日：2023-05-12

申请人： BESI SWITZERLAND AG

发明人： Norbert BILEWICZ ,  Andreas MAYR ,  Hugo PRISTAUZ ,  Hubert SELHOFER

IPC分类号： H05K13/04 ,  H05K13/08 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  H05K13/046 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/681 ,  H01L24/741 ,  G05B2219/45031

摘要： The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. At least one reference mark is attached to the bond head or the component gripper.

公开(公告)号：US20180317353A1

公开(公告)日：2018-11-01

申请号：US15947571

申请日：2018-04-06

申请人： BESI SWITZERLAND AG

发明人： Norbert BILEWICZ ,  Andreas MAYR ,  Hugo PRISTAUZ ,  Hubert SELHOFER

IPC分类号： H05K13/04 ,  H01L23/00 ,  H01L21/67 ,  H01L21/68

摘要： The invention relates to an apparatus and a method for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.