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公开(公告)号：US08299664B2
公开(公告)日：2012-10-30
申请号：US12822381
申请日：2010-06-24
CPC分类号： H01L23/3107 , H01L25/11 , H01L2924/0002 , H01L2924/13091 , H01L2924/19041 , H02K3/522 , H02K11/024 , H02K11/05 , H02K11/33 , H02K2203/03 , H02K2203/09 , H02K2211/03 , H01L2924/00
摘要： A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
摘要翻译： 特殊的端子可以从半导体模块的封装体突出，并且可以与电动机壳体的接合部分接合，以限制半导体模块相对于电机壳体的位置偏移。 附加地或替代地，模块侧接合部分可以形成在封装主体中并且可以与壳体侧接合部分接合以相对于电动机壳体定位半导体模块。
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2.发明申请SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权使用相同的半导体模块和电子电路集成电动机公开(公告)号：US20100327709A1
公开(公告)日：2010-12-30
申请号：US12822403
申请日：2010-06-24
申请人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
发明人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
CPC分类号： H05K1/18 , H01L2224/73221 , H01L2924/0002 , H02K11/33 , H02K2211/03 , H02M7/003 , H05K2201/1003 , H05K2201/1053 , H05K2201/10659 , H01L2924/00
摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。
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公开(公告)号：US20100327677A1
公开(公告)日：2010-12-30
申请号：US12822381
申请日：2010-06-24
CPC分类号： H01L23/3107 , H01L25/11 , H01L2924/0002 , H01L2924/13091 , H01L2924/19041 , H02K3/522 , H02K11/024 , H02K11/05 , H02K11/33 , H02K2203/03 , H02K2203/09 , H02K2211/03 , H01L2924/00
摘要： A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
摘要翻译： 特殊的端子可以从半导体模块的封装体突出，并且可以与电动机壳体的接合部分接合，以限制半导体模块相对于电机壳体的位置偏移。 附加地或替代地，模块侧接合部分可以形成在封装主体中并且可以与壳体侧接合部分接合以相对于电动机壳体定位半导体模块。
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4.发明授权Semiconductor module and electronic circuit-integrated motor device using same 有权半导体模块和电子电路集成电机器件使用相同公开(公告)号：US08247937B2
公开(公告)日：2012-08-21
申请号：US12822403
申请日：2010-06-24
申请人： Hideki Minato , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
发明人： Hideki Minato , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
CPC分类号： H05K1/18 , H01L2224/73221 , H01L2924/0002 , H02K11/33 , H02K2211/03 , H02M7/003 , H05K2201/1003 , H05K2201/1053 , H05K2201/10659 , H01L2924/00
摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。
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