Abstract:
In a semiconductor device, a heater is formed on a surface of a cap chip, and a first temperature sensor and a second temperature sensor are formed on a surface of a base chip. The cap chip and the base chip are laminated through a connection member such that the surfaces oppose to each other. The position of the heater is different from the positions of the temperature sensors in a direction of the lamination. The heater in the cap chip contacts bumps directly.
Abstract:
The present invention provides a motor control device including a feedback control system that generates a torque command for reducing a difference between an operation command signal for commanding an operation of a motor and a detection signal of a detector attached to the motor to detect a position and speed of the motor and drives the motor. The motor control device includes a correcting unit configured to estimate an amplitude and a phase of a correction amount for suppressing the detection error included in the detection signal and sequentially update estimation values of the amplitude and the phase and a post-correction-detection-signal calculating unit configured to generate a post-correction detection signal, which is a difference between the detection signal and the correction amount, instead of the detection signal.
Abstract:
The present invention provides a motor control device including a feedback control system that generates a torque command for reducing a difference between an operation command signal for commanding an operation of a motor and a detection signal of a detector attached to the motor to detect a position and speed of the motor and drives the motor. The motor control device includes a correcting unit configured to estimate an amplitude and a phase of a correction amount for suppressing the detection error included in the detection signal and sequentially update estimation values of the amplitude and the phase and a post-correction-detection-signal calculating unit configured to generate a post-correction detection signal, which is a difference between the detection signal and the correction amount, instead of the detection signal.
Abstract:
An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.
Abstract:
Parasitic capacitance between upper and lower adjacent wirings of an inductor using a multilayer wiring layer in an insulating film formed on a base substrate is reduced. An inductor is characterized by having one go-around of go-around wiring (A-B or B-C) formed in each of at least two of adjacent wiring layers of a plurality of wiring layers 18 placed in an insulating film on a base substrate, and in that one end (B) of the one go-around of go-around wiring (A-B and B-C) formed in each of the at least two of wiring layers is connected to each other at a via and the one go-around of go-around wiring (A-B and B-C) formed in each of the at least two of wiring layers is placed at substantially the same position in a surface of the base substrate when viewed from an upper side of the base substrate.
Abstract:
A semiconductor device and manufacturing method to effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.
Abstract:
A semiconductor device with a transistor region has a first conductor pattern formed within a multilayer interconnect structure positioned under a signal line and above the transistor region. The first conductor pattern is coupled to ground or a power supply and overlaps the transistor region. The signal line overlaps the first conductor pattern.
Abstract:
An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.
Abstract:
A fuel assembly lower tie-plate with better performance in capturing linearly elongated foreign substances. The lower tie-plate has a screening plate positioned below the network section in the lower tie-plate cavity. The screening plate is arranged substantially horizontally so that the lower tie-plate cavity is divided into upper and lower parts by the screening plate. Tubular filters are attached to the screening plate so that the tubular filters have openings below and above the screening plate. Top ends of the tubular filters are closed, and the openings above the screening plate are formed in side walls of the tubular filters. The lower tie-plate may be assembled by combining the screening plate, the network section and the nozzle section together, after the tubular filters have been attached to the screening plate.
Abstract:
Each of imaging optical systems has a post-lens system having a front focus at a position of a rear focus of a pre-lens system. Each of the optical axes is set in a direction normal to the optical axes of optical fibers and different from the normal direction to a placement surface of the optical fibers. Each of image pickup planes of CCDs is inclined relative to the optical axis of the imaging optical system so that the longer an object distance of each optical fiber among the optical fibers, the shorter an image distance thereof, and each image pickup plane is located in parallel to the optical axes of the optical fibers.