公开(公告)号：US06458014B1

公开(公告)日：2002-10-01

申请号：US09846339

申请日：2001-05-02

Applicant: Akira Ihsikawa ,  Tatsuya Senga ,  Akira Miyaji ,  Yoshijiro Ushio

Inventor： Akira Ihsikawa ,  Tatsuya Senga ,  Akira Miyaji ,  Yoshijiro Ushio

IPC: B24B4900

CPC classification number: B24B37/205 ,  B24B37/013 ,  B24B49/04 ,  B24B49/12

Abstract: After a hole is formed in a polishing pad, a transparent window plate is inserted into the hole. Here, a gap is left between the upper surface of the transparent window plate and the outermost surface constituting the working surface of the polishing pad. During polishing, the polishing head holding the wafer applies a load to the polishing pad by means of a load-applying mechanism, so that the polishing pad and transparent window plate are compressed. In this case, the system is arranged so that the gap remains constant, and so that a dimension equal to or greater than a standard value is maintained. Since the upper surface of the transparent window plate is recessed from the upper surface of the polishing pad, there is no scratching of the surface of the transparent window plate during dressing. Accordingly, the polishing pad has a long useful life.

Abstract translation: 在抛光垫中形成孔之后，将透明窗板插入孔中。 这里，在透明窗板的上表面和构成抛光垫的工作面的最外表面之间留有间隙。 在抛光期间，保持晶片的研磨头通过负载施加机构向抛光垫施加负载，使得抛光垫和透明窗板被压缩。 在这种情况下，系统被布置成使得间隙保持恒定，并且维持等于或大于标准值的尺寸。 由于透明窗板的上表面从抛光垫的上表面凹陷，因此在修整期间不会刮擦透明窗板的表面。 因此，抛光垫的使用寿命长。