PLACEMENT HEAD WITH TWO ROTOR ARRANGEMENTS WITH INDIVIDUALLY ACTUATABLE HANDLING DEVICES

    公开(公告)号:US20210400857A1

    公开(公告)日:2021-12-23

    申请号:US17350027

    申请日:2021-06-17

    IPC分类号: H05K13/04 H05K13/08

    摘要: A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.

    Portion-wise filling of a reservoir with bulk components

    公开(公告)号:US11240948B2

    公开(公告)日:2022-02-01

    申请号:US16776616

    申请日:2020-01-30

    摘要: A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

    SUPPLEMENTARY TOOL FOR CHIP TRANSFER DEVICE WITH REMOVAL TOOL AND TURNING TOOL

    公开(公告)号:US20190122917A1

    公开(公告)日:2019-04-25

    申请号:US16163758

    申请日:2018-10-18

    IPC分类号: H01L21/687 H01L21/683

    摘要: A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.

    PORTION-WISE FILLING OF A RESERVOIR WITH BULK COMPONENTS

    公开(公告)号:US20180184555A1

    公开(公告)日:2018-06-28

    申请号:US15845430

    申请日:2017-12-18

    摘要: A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

    METHOD AND APPARATUS FOR SELECTING A PASTE STENCIL FOR PASTE PRINTING AND FOR APPLYING PASTE ONTO A SUBSTRATE BY MEANS OF THE SELECTED PASTE STENCIL

    公开(公告)号:US20170144430A1

    公开(公告)日:2017-05-25

    申请号:US15355791

    申请日:2016-11-18

    发明人: Werner LIEGEL

    IPC分类号: B41F15/34

    摘要: A method and an apparatus for selecting a paste stencil (10) for paste printing onto a substrate (20), the paste stencil (10) being selected on the basis of a stencil thickness (h), in the case of which an area ratio of a small through opening (11a, 11b) of the substrate is greater than or equal to a setpoint area ratio. Furthermore, the present disclosure relates to a method and an apparatus for applying paste material (30) onto a substrate (20) for at least one small component (21a, 21b) and at least one large component (22) which is larger than the at least one small component (21a, 21b), paste material (30) being applied for the at least one small component (21a, 21b) and the at least one large component (22) by means of a paste stencil (10) which is selected according to the invention, and additional paste material (30) being applied onto the paste material (30) for the at least one large component (22), after paste material (30) has been applied by means of the selected paste stencil (10) for the at least one small component (21a, 21b) and the at least one large component (22).

    Supplementary tool for chip transfer device with removal tool and turning tool

    公开(公告)号:US11088013B2

    公开(公告)日:2021-08-10

    申请号:US16163758

    申请日:2018-10-18

    摘要: A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.

    BELT CONVEYOR FOR AN AUTOMATIC PLACEMENT MACHINE AND AUTOMATIC PLACEMENT MACHINE
    9.
    发明申请
    BELT CONVEYOR FOR AN AUTOMATIC PLACEMENT MACHINE AND AUTOMATIC PLACEMENT MACHINE 有权
    用于自动放置机的皮带输送机和自动放置机

    公开(公告)号:US20150321855A1

    公开(公告)日:2015-11-12

    申请号:US14706548

    申请日:2015-05-07

    IPC分类号: B65G23/06 G01D5/16

    摘要: A belt conveyor (10) for an automatic placement machine (50) that includes at least a rotatably mounted pinwheel (12) for conveying a belt (11), a drive (14) with at least one gear wheel (16) for driving the pinwheel (12) and a position-determining device (20) for determining a rotational position of the pinwheel (12), the position-determining device (20) having a first sensor device (30) with at least one magnetoresistive sensor arrangement (31). The disclosure further includes an automatic placement machine (50) having at least one belt conveyor (10).

    摘要翻译: 一种用于自动放置机器(50)的带式输送机(10),其包括用于输送带(11)的至少可旋转地安装的风轮(12),具有至少一个齿轮(16)的驱动器(14),用于驱动 风轮(12)和用于确定所述风车(12)的旋转位置的位置确定装置(20),所述位置确定装置(20)具有带有至少一个磁阻传感器装置(31)的第一传感器装置(30) )。 本公开还包括具有至少一个带式输送机(10)的自动贴片机(50)。

    RECORDING COMPONENT DATA
    10.
    发明申请

    公开(公告)号:US20230126278A1

    公开(公告)日:2023-04-27

    申请号:US17970642

    申请日:2022-10-21

    发明人: Sylvester DEMMEL

    IPC分类号: H05K13/08 H05K13/04

    摘要: Data associated with an electronics component within a placement process performed by a placement machine is recorded by using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head. The camera could be located within the feeder or the placement head.