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公开(公告)号：US20210400857A1
公开(公告)日：2021-12-23
申请号：US17350027
申请日：2021-06-17
发明人： Karl-Heinz BESCH , Thomas BLIEM , Thomas ROSSMANN , Klaus SATTLER , Michele TRIGIANI , Markus HUBER
摘要： A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.
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公开(公告)号：US20200170153A1
公开(公告)日：2020-05-28
申请号：US16776616
申请日：2020-01-30
发明人： Thomas ROSSMANN , Stefan SEITZ , Norbert HEILMANN , Johannes JUSTINGER , Stefan MAGG , Stefan GEIGER
IPC分类号： H05K13/02 , B65G65/32 , B65G65/23 , B65G65/00 , B65B15/04 , H05K13/00 , B65B25/00 , B65B57/06
摘要： A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).
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3.发明申请公开(公告)号：US20190124803A1
公开(公告)日：2019-04-25
申请号：US16161929
申请日：2018-10-16
摘要： A holding and drive device including a frame; a rotation structure which is attached to the frame in such a manner that it can rotate around a rotation axis; a rotation drive for rotating the rotation structure around the rotation axis; and a rotation structure interface attached to or formed on the rotation structure, to which a tool device including a plurality of sleeves can be detachably attached, which are configured for the detachable attachment of a respective component holding device protruding from the rotation axis with a radial direction component or of another tool element. A corresponding tool device, a corresponding supplementary tool device, and a component handling device constructed from these components. A method for the application-specific configuration of such a component handling device.
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公开(公告)号：US20190122917A1
公开(公告)日：2019-04-25
申请号：US16163758
申请日：2018-10-18
IPC分类号： H01L21/687 , H01L21/683
摘要： A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.
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公开(公告)号：US20180184555A1
公开(公告)日：2018-06-28
申请号：US15845430
申请日：2017-12-18
发明人： Thomas ROSSMANN , Stefan SEITZ , Norbert HEILMANN , Johannes JUSTINGER , Stefan MAGG , Stefan GEIGER
CPC分类号： H05K13/028 , B65B15/04 , B65B25/00 , B65B57/06 , B65G65/005 , B65G65/23 , B65G65/32 , B65G2201/047 , H05K13/0084 , H05K13/021
摘要： A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).
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