INERTIAL MEASUREMENT APPARATUS AND METHOD WITH IMPROVED THERMAL AND NOISE PERFORMANCE

    公开(公告)号:US20210080334A1

    公开(公告)日:2021-03-18

    申请号:US17022123

    申请日:2020-09-16

    发明人: Mike Horton Shu Wang

    摘要: The present invention provides an inertial measurement apparatus and an inertial measurement method. The inertial measurement apparatus includes: a plurality of inertial sensors each configured to output an inertial sensing signal; a filter module configured to separate the inertial sensing signal of at least one of the plurality of inertial sensors into a low-frequency component and a high-frequency component; a temperature calibration module configured to perform a temperature calibration on the low-frequency component of the inertial sensing signal of the at least one of the plurality of inertial sensors; a noise reduction module configured to perform a noise reduction on the high-frequency component of the inertial sensing signal of the at least one of the plurality of inertial sensors; and a recombination module configured to recombine the calibrated low-frequency component and the noise reduced high-frequency component to form a recombined inertial sensing signal with improved thermal drift performance and noise performance. In this way, the thermal drift and the noise performance of the inertial sensing signal can be improved simultaneously.

    HIGH-PRECISION INERTIAL MEASUREMENT APPARATUS AND INERTIAL MEASUREMENT METHOD

    公开(公告)号:US20210072278A1

    公开(公告)日:2021-03-11

    申请号:US17017713

    申请日:2020-09-11

    发明人: Mike Horton Shu Wang

    IPC分类号: G01P15/02 G01P15/18 G01P15/14

    摘要: The present invention provides an inertial measurement apparatus and an inertial measurement method. The inertial measurement apparatus includes: a plurality of inertial sensors each configured for outputting an inertial sensing signal; and a processing unit configured for detecting whether each of the inertial sensors is abnormal by analyzing the inertial sensing signal of each of the inertial sensors. The plurality of inertial sensors is used and the abnormal inertial sensor is ignored when the inertial sensing signals of the inertial sensors are processed in real time, so that a high-precision inertial sensing signal can be obtained.

    INTEGRATED CURRENT SENSOR
    3.
    发明申请

    公开(公告)号:US20200209285A1

    公开(公告)日:2020-07-02

    申请号:US16711462

    申请日:2019-12-12

    发明人: Dalai Li Leyue Jiang

    IPC分类号: G01R15/20 G01R19/00

    摘要: An integrated current sensor is provided in the present invention. The integrated current sensor includes: a conductor comprising at least one current input pin, at least one current output pin, a first leg portion connected to the at least one current input pin, a second leg portion connected to the at least one current output pin, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing and signal processing unit; an isolation unit configured to be sandwiched between the magnetoresistive sensing and signal processing unit and the conductor; a plurality of signal pins configured for being coupled to the magnetoresistive sensing and signal processing unit via wires respectively; and a package body configured for wrapping part of the conductor, part of the signal pins, the isolation unit and the magnetoresistive sensing and signal processing unit. A direction of current on the first leg portion is opposite to a direction of current on the second leg portion. The signal pins, the at least one current input pin and the at least one current output pin are exposed from the package body. In this way, the integrated current sensor may realize good electrical isolation between a current side and a signal side. In addition, the integrated current sensor has high sensitivity and integration degree due to use of a magnetoresistive sensing way.

    Inertial measurement apparatus and method with improved thermal and noise performance

    公开(公告)号:US11293816B2

    公开(公告)日:2022-04-05

    申请号:US17022123

    申请日:2020-09-16

    发明人: Mike Horton Shu Wang

    摘要: Inertial measurement systems and methods are described. An exemplar inertial measurement system includes: a plurality of inertial sensors each configured to output an inertial sensing signal; a filter module configured to separate the inertial sensing signal of at least one of the plurality of inertial sensors into a low-frequency component and a high-frequency component; a temperature calibration module configured to perform a temperature calibration on the low-frequency component of the inertial sensing signal of the at least one of the plurality of inertial sensors; a noise reduction module configured to perform a noise reduction on the high-frequency component of the inertial sensing signal of the at least one of the plurality of inertial sensors; and a recombination module configured to recombine the calibrated low-frequency component and the noise reduced high-frequency component to form a recombined inertial sensing signal with improved thermal drift performance and noise performance.

    Linearity compensation circuit and sensing apparatus using the same

    公开(公告)号:US10914792B2

    公开(公告)日:2021-02-09

    申请号:US15959222

    申请日:2018-04-21

    摘要: A linearity compensation circuit is disclosed for improving the linearity of a sensing signal. The linearity compensation circuit may include a compensator that is capable of receiving a sensing signal from a sensor and generating a compensation signal based on the sensing signal. The linearity compensation circuit may also include an output circuit that is capable of combining the compensation signal and the sensing signal to generate a compensated signal that exhibits an improved linearity. Also disclosed is a sensing apparatus which includes a sensor and the linearity compensation circuit. The sensing apparatus may thus be able to generate a sensing signal that is linear over a wider dynamic range.

    COIL AND A MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210035735A1

    公开(公告)日:2021-02-04

    申请号:US16935214

    申请日:2020-07-22

    IPC分类号: H01F41/04 H01F41/02 H01F27/28

    摘要: The present invention relates to a coil and a manufacturing method thereof. The method includes: depositing a first metal layer on a first surface of a wafer and patterning the first metal layer to obtain a first patterned metal layer on the first surface; etching a plurality of through holes on a second surface of the wafer to the first surface of the wafer, and depositing a second metal layer on the second surface of the etched wafer and patterning the second metal layer to obtain a plurality of through hole metals and a second patterned metal layer on the second surface; and, dicing the wafer to obtain a plurality of independent coils. Each coil comprises the first patterned metal layer, the through hole metals and the second patterned metal layer. The first patterned metal layer is coupled with the second patterned metal layer through the through hole metals. Thus, high-precision coils can be efficiently manufactured in batches and at low costs through a wafer level process. The coil may be used for generating or inducing an electromagnetic field.

    Double Pinned MR Multilayer Film, Full Bridge MR Sensor and Manufacturing Method Therefor

    公开(公告)号:US20230121716A1

    公开(公告)日:2023-04-20

    申请号:US17968848

    申请日:2022-10-19

    IPC分类号: G01R33/09 G01R33/00

    摘要: A double pinned magnetoresistance (MR) multilayer film, a full bridge MR sensor using the double pinned MR multilayer film and a method for manufacturing the full bridge MR sensor are provided in the present invention. The double pinned MR multilayer film comprises: a buffer layer, a first antiferromagnetic layer, a first ferromagnetic layer, a first interlayer, a ferromagnetic reference layer, a spacer layer, a ferromagnetic free layer, a second interlayer, a second ferromagnetic layer, a second antiferromagnetic layer and a cover layer that are stacked in sequence. The first antiferromagnetic layer applies a first exchange bias to the first ferromagnetic layer, and the first ferromagnetic layer applies a first artificial antiferromagnetic coupling to the ferromagnetic reference layer through the first interlayer. The second antiferromagnetic layer applies a second exchange bias to the second ferromagnetic layer, and the second ferromagnetic layer applies a second artificial antiferromagnetic coupling to the ferromagnetic free layer through the second interlayer. The full bridge MR sensor can not only realize the full bridge function in a single chip, but also has small zero point, simple annealing process and low cost through two global annealing.

    Integrated current sensor
    8.
    发明授权

    公开(公告)号:US11016124B2

    公开(公告)日:2021-05-25

    申请号:US16711462

    申请日:2019-12-12

    发明人: Dalai Li Leyue Jiang

    IPC分类号: G01R15/20 G01R19/00

    摘要: An integrated current sensor is provided in the present invention. The integrated current sensor includes: a conductor comprising at least one current input pin, at least one current output pin, a first leg portion connected to the at least one current input pin, a second leg portion connected to the at least one current output pin, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing and signal processing unit; an isolation unit configured to be sandwiched between the magnetoresistive sensing and signal processing unit and the conductor; a plurality of signal pins configured for being coupled to the magnetoresistive sensing and signal processing unit via wires respectively; and a package body configured for wrapping part of the conductor, part of the signal pins, the isolation unit and the magnetoresistive sensing and signal processing unit. A direction of current on the first leg portion is opposite to a direction of current on the second leg portion. The signal pins, the at least one current input pin and the at least one current output pin are exposed from the package body. In this way, the integrated current sensor may realize good electrical isolation between a current side and a signal side. In addition, the integrated current sensor has high sensitivity and integration degree due to use of a magnetoresistive sensing way.

    GLASS ISOLATION DEVICE AND A MANUFACTURING METHOD THEREOF, AND A CURRENT SENSOR

    公开(公告)号:US20200209286A1

    公开(公告)日:2020-07-02

    申请号:US16711464

    申请日:2019-12-12

    发明人: Dalai Li Leyue Jiang

    摘要: The present invention provides a glass isolation device and a method for manufacturing the glass isolation device, and a current sensor. The current sensor comprises: a conductor, comprising a current input terminal, a current output terminal, a first leg portion connected to the current input terminal, a second leg portion connected to the current output terminal, and a connection portion connected between the first leg portion and the second leg portion; a magnetoresistive sensing device; and an isolation device disposed between the magnetoresistive sensing device and the conductor and comprising an insulating substrate and a conductive thin film formed on the insulating substrate. The conductive thin film is grounded through a wire, and currents on the first leg portion and the second leg portion are in opposite directions. The glass isolation device of the present invention has low raw material and manufacturing costs, and can effectively achieve electrical isolation between a current side and a signal side.