Method and circuit arrangement for generating a sinusoidal line AC
voltage from a DC voltage
    1.
    发明授权
    Method and circuit arrangement for generating a sinusoidal line AC voltage from a DC voltage 失效
    从直流电压产生SINUSOIDAL线路交流电压的方法和电路布置

    公开(公告)号:US5151851A

    公开(公告)日:1992-09-29

    申请号:US717939

    申请日:1991-06-20

    IPC分类号: H02J7/02 H02M7/538

    CPC分类号: H02M7/53806 H02J7/022

    摘要: Method and circuit arrangement for generating a sinusoidal line AC voltage from a DC voltage. For generating a sinusoidal line AC voltage from a DC voltage, the DC voltage is converted into a square-wave voltage having voltage pulses whose durations are controlled in accordance with the variation of the sinusoidal line AC voltage to be generated. The square-wave voltage is transmitted via a high-frequency transformer. Subsequently, the transmitted voltage pulses are respectively tapped and filtered for a given chronological duration. A secondary side of the high-frequency transformer is respectively shorted during pulse pauses caused by the sinusoidal control of voltage pulse durations for a simultaneous constant applied pulse frequency. In these phases, energy is transmitted back to the source of the DC voltage via the high-frequency transformer. As a result, the circuit arrangement can also be employed as a charging circuit.

    摘要翻译: 用于从直流电压产生正弦线路交流电压的方法和电路装置。 为了从直流电压产生正弦线路交流电压,将直流电压转换成具有根据要产生的正弦线路交流电压的变化来控制持续时间的电压脉冲的方波电压。 方波电压通过高频变压器传输。 随后,传送的电压脉冲分别按照给定的时间顺序被抽头和滤波。 高频变压器的二次侧分别在由同步恒定施加的脉冲频率的电压脉冲持续时间的正弦控制引起的脉冲暂停期间短路。 在这些阶段,能量通过高频变压器传输回直流电压源。 结果,电路装置也可以用作充电电路。

    Circuit board assembly
    3.
    发明授权
    Circuit board assembly 失效
    电路板总成

    公开(公告)号:US5144532A

    公开(公告)日:1992-09-01

    申请号:US700502

    申请日:1991-05-15

    摘要: A circuit board assembly for data equipment such as those having large numbers of layers and great power requirements in a small space having high computer performance, includes a multi-layer printed circuit board in laminated technology provided with voltage supply and signal carrying layers and pressure contacts at both sides connecting the multi-layer printed circuit board to further printed circuit boards. The further printed circuit boards, which are formed using micro-wiring technology, include backsides which are free of electrical components and connected to the pressure contacts and opposite sides carrying integrated electrical elements such as circuit chips forming an electrical circuit. Cooling plates are pressed against the surfaces of the circuit chips.

    摘要翻译: 在具有高计算机性能的小空间中的诸如具有大量层数和大功率需求的数据设备的电路板组件包括层压技术的多层印刷电路板,其中提供电压供应和信号承载层和压力接触 在将多层印刷电路板连接到另外的印刷电路板的两侧。 使用微结构技术形成的另外的印刷电路板包括没有电气部件并且连接到压力触点的背面和承载诸如形成电路的电路芯片的集成电气元件的相对侧。 冷却板被压靠在电路芯片的表面上。