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公开(公告)号：US20240266278A1
公开(公告)日：2024-08-08
申请号：US18436946
申请日：2024-02-08
发明人： Yi Sun , Heng Yang , Deming Xiao
IPC分类号： H01L23/50 , G05F1/56 , H01L23/00 , H01L23/498
CPC分类号： H01L23/50 , G05F1/56 , H01L23/49816 , H01L24/14 , H01L2224/72 , H01L2224/90
摘要： An interconnection structure for IC package onto the external device is discussed. The IC package has a voltage regulator contained therein; and the external device has a load assembled thereupon. A plurality of connection devices with elasticity are attached to the IC package, so that when a perpendicular force is applied to the connection devices, the IC package is electrically coupled to the external device to provide power supply to the load with ease replacement.
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公开(公告)号：US20240243665A1
公开(公告)日：2024-07-18
申请号：US18156055
申请日：2023-01-18
发明人： Vipin Pala
CPC分类号： H02M3/33507 , H02M1/08
摘要： A composite switch circuit having a normally-on power switch device and a normally-off power switch device in cascode configuration is discussed. The composite switch circuit is with reduced power loss by biasing a common connection of the source terminal of the normally-on power switch device and the drain terminal of the normally-off power switch device with a low voltage supply during a reverse recovery process of the composite switch circuit.
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公开(公告)号：US12040711B2
公开(公告)日：2024-07-16
申请号：US17737755
申请日：2022-05-05
发明人： Zhe Yang , Daocheng Huang , Faisal Ahmad , Odai Alsmadi
CPC分类号： H02M3/158 , H02M1/0009
摘要： A multiphase converter provides an output voltage to a load. The multiphase converter receives a load event signal from the load and turns ON at a same time the phases of the multiphase converter to increase the output voltage in response to the load event signal indicating that a load current drawn by the load from the multiphase converter is about to increase. The multiphase converter increases an impedance of low-side switches of the multiphase converter in response to the load event signal indicating that the load current is about to decrease.
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公开(公告)号：US12007821B2
公开(公告)日：2024-06-11
申请号：US17716924
申请日：2022-04-08
发明人： Ming Lu , Pengjie Lai
IPC分类号： G06F1/30
CPC分类号： G06F1/30
摘要： A power management integrated circuit (PMIC) chip provides power loss protection to an application device. The PMIC chip has several storage pins that each receives a set of storage capacitors that are charged using power from a power source during normal operation. An application device receives power from the power source during normal operation and receives power from an operational set of storage capacitors during power loss. A failing set of storage capacitors is disconnected from an operational set of storage capacitors and from the PMIC chip. The operational set of storage capacitors remains connected to the PMIC chip to provide power loss protection.
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公开(公告)号：US20240145334A1
公开(公告)日：2024-05-02
申请号：US18408958
申请日：2024-01-10
发明人： Fengchun He , Daocheng Huang , Junjie Feng , Xu Han
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H01L23/3675 , H05K7/209 , H01L25/16
摘要： A power module has a substrate, a magnetic component disposed on the substrate, a plurality of power integrated circuits (ICs), and a heat spreader. The heat spreader and at least a part of the plurality of power ICs are disposed on a top surface of the substrate. The heat spreader is fixed on the substrate through a structural adhesive, covering top surfaces of the part of the plurality of power ICs on the top surface of the substrate, and is in contact with the top surfaces of the part of the plurality of power ICs on the top surface of the substrate through a thermal conductive adhesive. A difference between a height measured from a topmost surface of the magnetic component to the top surface of the substrate and a height measured from a topmost surface of the heat spreader to the top surface of the substrate is within 300 um.
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6.发明公开公开(公告)号：US20240055511A1
公开(公告)日：2024-02-15
申请号：US18446130
申请日：2023-08-08
发明人： Vipindas Pala , Sauvik Chowdhury
IPC分类号： H01L29/78 , H01L29/808 , H01L29/10 , H01L29/06
CPC分类号： H01L29/7803 , H01L29/808 , H01L29/1058 , H01L29/0623 , H01L29/7813
摘要： A semiconductor device includes a first source region, a first sidewall body region, a gate region, a second source region and a link region formed in a substrate of a first conductivity type. The first source region and the second source region may be of the first conductivity type while the first sidewall body region and the link region may be of a second conductivity type opposite to the first conductivity type. The link region and the gate region are respectively disposed at a first side and a second side of the first source region. The first sidewall body region may be disposed below or underneath the first source region.
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公开(公告)号：US20230402925A1
公开(公告)日：2023-12-14
申请号：US17839573
申请日：2022-06-14
发明人： Chiahsin Chang , Chao Liu , James Nguyen
CPC分类号： H02M3/1584 , H02M1/32
摘要： A multi-phase voltage converter has a plurality of integrated circuits (ICs), and a controller. Each IC has a temperature report pin and a temperature sensing circuit, the controller has a temperature input pin connected to the temperature report pin of each of the plurality of ICs. The controller provides an acquiring command via the temperature input pin to all of the ICs. The acquiring command is capable of selecting one of the plurality of ICs to report an individual temperature.
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公开(公告)号：US11811324B2
公开(公告)日：2023-11-07
申请号：US17530746
申请日：2021-11-19
发明人： Jian Zhang , Changjiang Chen
CPC分类号： H02M3/1582 , H02M1/0009 , H02M3/157
摘要： An integrated circuit of a buck-boost converter working in a buck mode with a buck power switching cycle, a boost mode with a boost power switching cycle or a buck-boost mode with a buck-boost power switching cycle. The integrated circuit integrates a first power switch, a second power switch, a third power switch and a fourth power switch, and an output current sensing circuit. The buck-boost power switching cycle consists of a first buck-boost phase, a second buck-boost phase and a third buck-boost phase. The output current sensing circuit samples the current flowing through the first power switch during the second buck-boost phase and the current flowing through the fourth power switch during the third buck-boost phase so as to generate the output current information.
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公开(公告)号：US11791705B1
公开(公告)日：2023-10-17
申请号：US17839631
申请日：2022-06-14
发明人： Chiahsin Chang , Chao Liu , James Nguyen , Francis Yu , Huichun Dai , Fangyu Zhang
CPC分类号： H02M1/0043 , H02M1/0009 , H02M1/0041 , H02M1/084 , H02M1/327
摘要： A multi-phase voltage converter has a plurality of integrated circuits (ICs), and a controller. Each IC has a power switch, a monitoring pin and a current sense pin. The power switch is controlled to convert an input voltage to an output voltage. The current sense pin is capable of providing a current sense signal representative of a current flowing through the power switch. The controller is capable of providing a clock signal via the monitoring pin, and provides a plurality of data signals via the current sense pin of the plurality of ICs. Each of the plurality of ICs is assigned an identification code based on the clock signal and one of the plurality of data signals.
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公开(公告)号：US11705817B2
公开(公告)日：2023-07-18
申请号：US17492271
申请日：2021-10-01
发明人： Dianbo Fu , Daocheng Huang , Junjie Feng
IPC分类号： H02M3/335
CPC分类号： H02M3/33573 , H02M3/33576
摘要： An LLC resonant converter including a transformer, a switching full-bridge circuit, a resonant circuit, and a bridge rectifier. The switching full-bridge circuit has a first pair of switches and a second pair of switches, with the first pair of switches being connected between a DC input voltage and a second end of a secondary winding of the transformer, the second pair of switches being connected between a DC input voltage and a first end of the secondary winding of the transformer.
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