公开(公告)号：US20230232188A1

公开(公告)日：2023-07-20

申请号：US18118896

申请日：2023-03-08

申请人： Bandwidth Inc.

发明人： Daniel Pereira ,  Larry Reeder ,  Lydia Runnels ,  Adam Covati

IPC分类号： H04W4/029 ,  H04M7/00 ,  H04W4/14 ,  H04W4/20 ,  H04W76/50

CPC分类号： H04W4/029 ,  H04M7/0075 ,  H04W4/14 ,  H04W4/20 ,  H04W76/50

摘要： Techniques are described for obtaining current location data for a non-traditional telephony endpoint for emergency calling purposes. An emergency services (ES) provider receives, from a telephony server responding to a telecommunication session establishment request from a telephony endpoint, a location registration request, the location registration request including telephony endpoint identification information and a mobile device telephone number. The ES provider may send a short message service (SMS) message to the mobile device telephone number, the SMS message including an executable registration link that when executed on a mobile device receiving the SMS message causes the mobile device to retrieve location data of the mobile device. The ES provider may then receive the current location data from the mobile device and store it and the telephony endpoint identification information for subsequent use should a 911 call be made from that telephony endpoint. The ES provider may then send the telephony server an authorization acknowledgement for the telecommunication session establishment request.

公开(公告)号：US11108656B1

公开(公告)日：2021-08-31

申请号：US17193008

申请日：2021-03-05

申请人： Bandwidth, Inc.

发明人： Michael Nelson ,  Nicholas Porillo ,  Luther Wright

IPC分类号： H04L12/24 ,  H04L12/26 ,  G06F9/54

摘要： In some implementations, a computer may during a repeating interval in a local GCAC node: (a) receiving and storing key data from one or more other GCAC nodes, the key data indicative of resource usage data for each key in the respective one or more other GCAC nodes wherein each key is associated with an allocation limit equal to a number of resources it may use at any given time across all GCAC nodes; (b) storing current key data, the current key data indicative of the resource usage data for each key in the local GCAC node; (c) determining estimated network-wide key data, the estimated network-wide key data indicative of an estimated network-wide resource usage across all GCAC nodes for each key, the estimated network-wide key data based on a combination of the current key data for the local GCAC node and a weighted multiple of the key data in each of the one or more other GCAC nodes; (d) storing the estimated network-wide key data for each key; and (e) repeating steps (a)-(d) during each interval.

公开(公告)号：US10735398B1

公开(公告)日：2020-08-04

申请号：US16801811

申请日：2020-02-26

申请人： Bandwidth, Inc.

发明人： Adam Covati ,  Bryan C. Turner

IPC分类号： H04L29/06 ,  H04L9/08 ,  H04L9/32

摘要： Techniques are described for single or multi-factor authentication. An access request is received followed by a prompt for authentication data comprising a segment of a continuous rolling authentication code. Upon receipt of the segment of a continuous rolling authentication code, it is compared to another version of the continuous rolling authentication code generated by an algorithm and shared secret key known to both parties. The access request may be authenticated when the segment of the rolling authentication code received in response to the prompt for authentication data matches a segment the continuous rolling authentication code generated. Otherwise, it is rejected.

公开(公告)号：US20080005442A1

公开(公告)日：2008-01-03

申请号：US11798489

申请日：2007-05-14

申请人： Stanford Crane ,  Maria Portuondo ,  Willard Erickson ,  Maurice Bizzarri

发明人： Stanford Crane ,  Maria Portuondo ,  Willard Erickson ,  Maurice Bizzarri

IPC分类号： G06F13/36

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F13/4045 ,  G06F13/409 ,  H01R12/57 ,  H01R12/58 ,  H01R12/737 ,  H05K1/0286 ,  H05K1/14 ,  H05K7/1084 ,  H05K7/1441 ,  H05K7/1442 ,  H05K7/1444 ,  H05K7/1445

摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统架构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。

公开(公告)号：US20060285546A1

公开(公告)日：2006-12-21

申请号：US11467357

申请日：2006-08-25

申请人： A. J. Carew ,  Ronald Lutz ,  Brendon Mills

发明人： A. J. Carew ,  Ronald Lutz ,  Brendon Mills

IPC分类号： H04L12/56

CPC分类号： H04M11/062 ,  H04L49/105 ,  H04L2012/561 ,  H04L2012/5619 ,  H04L2012/5671 ,  H04M7/0066 ,  H04Q3/0045 ,  H04Q2213/13039 ,  H04Q2213/13093 ,  H04Q2213/13196 ,  H04Q2213/13296 ,  H04Q2213/13298

摘要： A voice gateway (64) includes an input port (70) that receives a voice signal from an unbundled analog line (62) coupled to a Class 5 switch (52). The voice signal is converted to a digital format by an analog-to-digital and digital-to-analog converting unit (76). The voice signal is placed into a compressed format by a compressing/de-compressing unit (80) using a selected one of a plurality of compression ratios. The voice signal is placed into a transport frame by a packetizing/de-packetizing unit (84) according to a selected packet format. The voice signal is multiplexed with other voice signals by an output port (88). The output port (88) places the voice signal onto a selected one of a plurality of output lines in order to transport the voice signal in its transport frame to one of an office customer premises (12) and a residence customer premises (14).

摘要翻译： 语音网关（64）包括从耦合到等级5开关（52）的非捆绑模拟线（62）接收语音信号的输入端口（70）。 语音信号通过模拟数字和数模转换单元（76）转换为数字格式。 语音信号通过压缩/解压缩单元（80）被使用多个压缩比中选择的一个来压缩格式。 根据选择的分组格式，语音信号由打包/解分组单元（84）放入传输帧。 通过输出端口（88）将语音信号与其他语音信号进行复用。 输出端口（88）将语音信号放置在多个输出线路中的所选择的一个输出线路上，以将其传输帧中的语音信号传送到办公室客户驻地（12）和住宅客户驻地（14）之一。

公开(公告)号：US06839342B1

公开(公告)日：2005-01-04

申请号：US09685762

申请日：2000-10-09

申请人： Eric Sean Parham ,  Brian E. Williams ,  Anthony John Paul Carew ,  Robert Whitcher

发明人： Eric Sean Parham ,  Brian E. Williams ,  Anthony John Paul Carew ,  Robert Whitcher

IPC分类号： H04M7/00 ,  H04Q3/00 ,  H04L12/66

CPC分类号： H04M7/1225 ,  H04Q3/0025

摘要： A telecommunications network (10) includes a gateway (18) that receives signaling information in a message based signaling format from a Class 5 softswitch (26). The gateway (18) also receives voice traffic over an inter-machine trunk from a public switched telephone network (12). The gateway (18) places the voice traffic into data packets. The gateway (18) transfers the data packets and the signaling information to an Internet Protocol network (30). The data packets and the signaling information may be transferred over a common physical link and over separate logical links.

公开(公告)号：US20040007774A1

公开(公告)日：2004-01-15

申请号：US10455812

申请日：2003-06-06

申请人： Silicon Bandwidth, Inc.

发明人： Stanford W. Crane JR. ,  Maria M. Portuondo

IPC分类号： H01L021/48 ,  H01L023/52

CPC分类号： H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/181 ,  H01R12/73 ,  H01R13/26 ,  H05K3/3421 ,  H05K7/1084 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099

摘要： A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leads.

摘要翻译： 半导体管芯载体可以包括绝缘基板; 在绝缘衬底上以行和列布置的多个导电触点组的阵列，其中相邻行的组与来自相邻列的组交错，并且每个组的一部分重叠成相邻行或相邻列 的阵列组; 半导体芯片; 以及用于在半导体管芯和导电接触件之间提供电连接的结构。 半导体管芯载体还可以包括绝缘衬底; 多个引线，其各自具有从所述绝缘基板的下表面延伸出所述半导体管芯载体的外部部分，以及在所述绝缘基板的上表面处设置在所述半导体管芯载体内的内部部分; 半导体芯片; 以及与半导体管芯的导电部分接触并且还与引线的内部部分接触的导电材料层。

公开(公告)号：US20030162319A1

公开(公告)日：2003-08-28

申请号：US10082174

申请日：2002-02-26

申请人： Silicon Bandwidth, Inc.

发明人： Stanford W. Crane JR. ,  Vicente D. Alcaria ,  Myoung-Soo Jeon

IPC分类号： H01L021/44

CPC分类号： H01L23/49861 ,  H01L23/055 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A micro grid array semiconductor die package includes a housing defining a cavity for holding at least one semiconductor die, said housing including a plurality of insulative side walls, each of said side walls having a bottom surface and an interior wall including a top surface, and an end plate joined to said side walls; and a plurality of substantially straight conductive leads extending through at least one of said side walls, each of said conductive leads including an internal lead section extending into the cavity from the top surface of the interior wall and a external lead section extending externally from said at least one bottom surface of said side wall.

摘要翻译： 微格阵列半导体管芯封装包括限定用于保持至少一个半导体管芯的空腔的壳体，所述壳体包括多个绝缘侧壁，每个所述侧壁具有底表面和包括顶表面的内壁，以及 连接到所述侧壁的端板; 以及延伸穿过至少一个所述侧壁的多个基本上直的导电引线，每个所述导电引线包括从所述内壁的顶表面延伸到所述空腔中的内引线部分和从所述内壁的外表面延伸的外引线部分 所述侧壁的至少一个底表面。

公开(公告)号：US20020053455A1

公开(公告)日：2002-05-09

申请号：US09964542

申请日：2001-09-28

申请人： SILICON BANDWIDTH INC.

发明人： Stanford W. Crane JR. ,  Maria M. Portuondo

IPC分类号： H02G003/08

CPC分类号： H01L24/49 ,  H01L23/057 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/45111 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49174 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3426 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

公开(公告)号：US11849064B1

公开(公告)日：2023-12-19

申请号：US18367196

申请日：2023-09-12

申请人： Bandwidth Inc.

发明人： Dane Linsky ,  Geoff Garrido ,  Paul Washburn

IPC分类号： H04M3/22

CPC分类号： H04M3/2227 ,  H04M3/2218

摘要： Methods identifying inbound call traffic anomalies in a telecommunications system are provided. The method includes receiving expected values for data related to the telecommunications system, the data being associated with call detail records; for each metric in the received data, determining if an observed value is outside defined upper and lower thresholds; selecting a set of residuals based on an aggregation of data in the call detail records if the observed value is outside the defined upper and lower thresholds; computing an anomaly score based the selected set of residuals; determining if multiple, serial anomalous alerting windows are needed to create an alert if the computed anomaly score is greater than a minimum anomaly score; and declaring that the data supports an anomaly in the inbound call traffic if it is determined that multiple, serial anomalous alerting windows are not needed to create an alert.