Abstract:
A thick-film thermal printhead (FIG. 11) and a variety of implementation approaches for controlling such a printhead. The conductive lead at each end of the heater element is switched to either the power supply (Vhd) or ground, depending on the corresponding nib data bit with the advantage of eliminating leakage current completely.Thermal printhead control is based on the sequential exclusive-OR (XOR) logic operation applied to the shifted-in nib data bit stream. The XOR function may be within the driver IC, the raster data processing FPGA (Field Programming Gate Array), or in a lookup table in the memory block of a main processor system.A new driver IC is disclosed in which the outputs are SPDT (Single-Pole-Double-Throw) switches, and the built-in XOR gates are configured to act in the pass-through mode, so that the new driver IC may be used as a traditional driver IC.
Abstract:
The present invention is and includes a conversion circuit for allowing a printer controller to send a different set of control signals for dot history control to an integrated circuit driver other than those which the integrated circuit driver is designed to receive. The conversion circuit includes a plurality of driver circuits coupled to a plurality of strobe signals from at least one strobe signal generator, wherein each of the plurality of driver circuits comprises a plurality of gating groups respectively coupled to the plurality of strobe signals, wherein each of the plurality of gating groups includes a plurality of gate units respectively coupled to a plurality of heating elements wherein at least one gate unit controls at least one coupled heating element according to a corresponding strobe signal.
Abstract:
A thermal head includes a metal substrate; an insulating layer formed on the surface of the metal substrate; a plurality of heating elements disposed on the surface of the insulating layer, the heating elements being arranged with a predetermined pitch along a plurality of lines in a main scanning direction, the plurality of lines being spaced apart from each other in a paper-feeding direction perpendicular to the main scanning direction; and a heat radiating element projecting from the surface of the metal substrate to the side where the insulating layer is disposed. Although most of the heat generated by the respective heating elements is transferred to an ink ribbon or print paper, residual partial heat is absorbed by heat radiating means via the insulating layer and radiated into the atmosphere, which suppresses thermal interference among the heating elements.
Abstract:
A thermal head includes a metal substrate; an insulating layer formed on the surface of the metal substrate; a plurality of heating elements disposed on the surface of the insulating layer, the heating elements being arranged with a predetermined pitch along a plurality of lines in a main scanning direction, the plurality of lines being spaced apart from each other in a paper-feeding direction perpendicular to the main scanning direction; and a heat radiating element projecting from the surface of the metal substrate to the side where the insulating layer is disposed. Although most of the heat generated by the respective heating elements is transferred to an ink ribbon or print paper, residual partial heat is absorbed by heat radiating means via the insulating layer and radiated into the atmosphere, which suppresses thermal interference among the heating elements.
Abstract:
The object is to provide a thermal print head that can absorb an expansion due to difference of thermal expansion coefficients of a ceramic substrate and a glass-epoxy based printed circuit board to enable to obtain excellent printing quality, to be high in reliability, and to be capable of downsizing. For this, a thermal print head is constituted to comprise a base provided with heat-generating resistors, a printed circuit board disposed in close proximity to the base, a semiconductor element for driving that is mounted on the base or the printed circuit board and electrically connected to the base and the printed circuit board, and a sealing-member that seals the semiconductor element for driving and includes a hard seal portion consisting of hard sealing-material and a soft seal portion consisting of soft sealing-material more flexible than the hard sealing-material, wherein the hard seal portion is disposed on the base, and the soft seal portion is disposed extended on the base and the printed circuit board.
Abstract:
A thermal head has an insulating substrate having a first main surface and a second main surface opposite the first main surface, and an end surface. Heater resistors are arranged in a line on the first surface of the insulating substrate. Driving elements are disposed on the second main surface of the insulating substrate for driving the heater resistors. The heater resistors are electrically connected to the driving elements by turnup connection terminals.
Abstract:
A thermal printhead (10) includes an insulating head substrate (11) having a first edge (11a) and a second edge (11b) opposite to the first edge, a heating resistor (12) formed on the head substrate (11) along the first edge (11a), at least one drive IC (13) mounted on the head substrate (11) along the second edge (11b), and a protection cover (20) mounted for covering the drive IC (13). The protection cover (20) includes a cover member (22) for covering the drive IC (13) and a fixation member (21) formed integrally with the cover member (22). The fixation member (21) has a positioning wall (23) coming into direct contact with the second edge (11b) of the head substrate (11). The fixation member is designed to attach the protection cover (20) to the head substrate (11) without utilizing separate fixing means.
Abstract:
A thermal printhead according to the present invention includes a stepped heat sink plate (1) having an upper first supporting surface (1a) and a lower second supporting surface (1b), a head substrate (2) mounted on the first supporting surface (1a) of the heat sink plate (1) and formed with printing dots (3), and a printed circuit board (14) mounted on the second supporting surface (1b) of the heat sink plate (1) and formed with various wiring patterns. The head substrate (2) has an edge projecting from the first supporting surface (1a) of the heat sink plate (1) toward the second supporting surface (1b). The printed circuit board (14) overlaps the projecting edge of the head substrate (2) with a predetermined spacing (18) therebetween.
Abstract:
A thermal print head includes an auxiliary print head guard disposed in close relationship to the primary print head guard so as to protect from damage by a foreign object the material encapsulating the electrical components and connectors contained on an integrated circuit board.
Abstract:
A thermal ceramic head chip (1) having plural heating elements (2) and a connecting portion (5) and held on a head base (10) and a folded flexible printed circuit sheet (3) having an external lead portion (4) on its outside face, the wiring conductors on the flexible printed circuit sheet (3) is connected to the connecting portion (5). At the former's connecting opening disposed on the inside face of the former, and the flexible printed circuit sheet (3) with a dew sensor gap (13) for electrical detection of dew if any.