Invention Grant
- Patent Title: Thermal head
- Patent Title (中): 热头
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Application No.: US09629668Application Date: 2000-08-01
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Publication No.: US06271873B1Publication Date: 2001-08-07
- Inventor: Norimitsu Sambongi
- Applicant: Norimitsu Sambongi
- Priority: JP11-218352 19990802
- Main IPC: B41J2335
- IPC: B41J2335

Abstract:
A thermal head has an insulating substrate having a first main surface and a second main surface opposite the first main surface, and an end surface. Heater resistors are arranged in a line on the first surface of the insulating substrate. Driving elements are disposed on the second main surface of the insulating substrate for driving the heater resistors. The heater resistors are electrically connected to the driving elements by turnup connection terminals.
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