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    Thermal head
    1.
    发明授权
    Thermal head 失效
    热头

    公开(公告)号：US06271873B1

    公开(公告)日：2001-08-07

    申请号：US09629668

    申请日：2000-08-01

    Applicant: Norimitsu Sambongi

    Inventor： Norimitsu Sambongi

    IPC: B41J2335

    CPC classification number: B41J2/3351 ,  B41J2/3352 ,  B41J2/3356 ,  B41J2/3357 ,  B41J2/33595 ,  B41J2/345

    Abstract: A thermal head has an insulating substrate having a first main surface and a second main surface opposite the first main surface, and an end surface. Heater resistors are arranged in a line on the first surface of the insulating substrate. Driving elements are disposed on the second main surface of the insulating substrate for driving the heater resistors. The heater resistors are electrically connected to the driving elements by turnup connection terminals.

    Abstract translation: 热敏头具有绝缘基板，其具有与第一主表面相对的第一主表面和第二主表面以及端表面。 加热电阻器被布置在绝缘基板的第一表面上的一行中。 驱动元件设置在绝缘基板的第二主表面上，用于驱动加热电阻。 加热电阻器通过反转连接端子电连接到驱动元件。

    Thermal head and thermal printer
    3.
    发明授权
    Thermal head and thermal printer 有权

    公开(公告)号：US09834008B2

    公开(公告)日：2017-12-05

    申请号：US15321089

    申请日：2015-06-18

    Applicant: KYOCERA Corporation

    Inventor： Masafumi Hirayama ,  Yuuna Ookubo ,  Yasumitsu Yamamoto ,  Youichi Moto ,  Yui Tanaka ,  Hisatoshi Takada

    IPC: B41J2/335

    CPC classification number: B41J2/33595 ,  B41J2/335 ,  B41J2/35

    Abstract: A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is electrically connected to the heat generating section; and a connector including a fixing ping electrically connected to the electrode, a movable pin which holds the substrate between the movable pin and the fixing pin, and a connection pin which connects the fixing pin and the movable pin. The movable pin includes a movable section which is bent or curved and a contact section making contact with the substrate. The movable pin is disposed so as to protrude from the connection pin beyond the fixing pin. The contact section is located closer to a connection pin side than a tip end of the fixing pin.

    HEAD AND LIQUID EJECTING APPARATUS
    4.
    发明申请
    HEAD AND LIQUID EJECTING APPARATUS 有权
    头和液体喷射装置

    公开(公告)号：US20160263889A1

    公开(公告)日：2016-09-15

    申请号：US15014071

    申请日：2016-02-03

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Toshiaki HAMAGUCHI ,  Eiju HIRAI ,  Yoichi NAGANUMA ,  Motoki TAKABE

    IPC: B41J2/14

    CPC classification number: B41J2/14201 ,  B41J2/14032 ,  B41J2/14233 ,  B41J2/33595 ,  B41J2002/14241 ,  B41J2002/14491

    Abstract: Provided is a head including a channel formation substrate that is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid, a piezo element, a driving circuit board that is bonded to the one surface side of the channel formation substrate, and a driving circuit for driving the piezo element. The piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board. A holding portion that holds the piezo element is provided between the driving circuit board and the channel formation substrate. The holding portion is opened to an atmosphere through an atmosphere open passage which is provided to penetrate the driving circuit board in a direction in which the driving circuit board and the channel formation substrate are stacked.

    Abstract translation: 本发明提供一种头部，其包括：通道形成基板，设置有与用于喷射液体的喷嘴连通的压力产生室;压电元件;接合到通道形成基板的一个表面侧的驱动电路板;以及 用于驱动压电元件的驱动电路。 压电元件和驱动电路通过设置在通道形成基板和驱动电路板中的任一个上的凸块彼此电连接。 保持压电元件的保持部设置在驱动电路基板和沟道形成基板之间。 保持部通过设置成沿驱动电路基板和通道形成基板堆叠的方向贯通驱动电路基板的大气开放通道向大气开放。

    Wafer structure
    5.
    发明授权
    Wafer structure 有权

    公开(公告)号：US11712890B2

    公开(公告)日：2023-08-01

    申请号：US17116186

    申请日：2020-12-09

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Chi-Feng Huang ,  Yung-Lung Han ,  Tsung-I Lin

    IPC: B41J2/14 ,  B41J2/16 ,  B41J2/335 ,  B41J2/17

    CPC classification number: B41J2/14024 ,  B41J2/14129 ,  B41J2/14072 ,  B41J2/1707 ,  B41J2/33595 ,  B41J2202/11 ,  B41J2202/13

    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

    THERMAL PRINT HEAD
    8.
    发明申请
    THERMAL PRINT HEAD 审中-公开

    公开(公告)号：US20180009232A1

    公开(公告)日：2018-01-11

    申请号：US15710360

    申请日：2017-09-20

    Applicant: Rohm Co., Ltd.

    Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

    IPC: B41J2/335 ,  B41J2/34

    CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

    Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

    Thermal print head
    9.
    发明授权
    Thermal print head 有权

    公开(公告)号：US09796189B2

    公开(公告)日：2017-10-24

    申请号：US15390141

    申请日：2016-12-23

    Applicant: Rohm Co., Ltd.

    Inventor： Isamu Nishimura ,  Yasuhiro Fuwa

    IPC: B41J2/335 ,  B41J2/34

    CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

    Abstract: A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

    THERMAL HEAD AND THERMAL PRINTER
    10.
    发明申请
    THERMAL HEAD AND THERMAL PRINTER 有权

    公开(公告)号：US20170217203A1

    公开(公告)日：2017-08-03

    申请号：US15500607

    申请日：2015-08-22

    Applicant: KYOCERA Corporation

    Inventor： Yousuke IWAMOTO ,  Youichi MOTO ,  Yuuna OOKUBO ,  Arata OKAYAMA

    IPC: B41J2/335

    CPC classification number: B41J2/3351 ,  B41J2/33515 ,  B41J2/3352 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/3357 ,  B41J2/33595 ,  B41J2/345 ,  H01R12/721

    Abstract: [Object] To provide a thermal head that can reduce the probability of breakage of a connector.[Solution] A thermal head X1 includes a substrate 7; a plurality of heating elements 9 disposed on the substrate 7; a plurality of electrodes disposed on the substrate 7 and electrically connected to the plurality of heating elements 9; a connector 31 disposed adjacent to the substrate 7 and including a plurality of connector pins 8a including connection portions 32, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing 10 containing the plurality of connector pins 8a; and a covering member 12 covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member 12 includes a first portion 12a located on the substrate 7 and a second portion 12b located on the housing 10. The second portion 12b includes a first protrusion 12b1 protruding toward the opening 10i in a plan view. Thus, the probability of breakage of the connector can be reduced.

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