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公开(公告)号：US20170077361A1
公开(公告)日：2017-03-16
申请号：US15122680
申请日：2015-03-03
发明人： Martin Brandl , Tobias Gebuhr , Thomas Schwarz
CPC分类号： H01L33/507 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48471 , H01L2224/48479 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00012 , H01L2224/4554
摘要： A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.
摘要翻译： 制造光电子部件的方法包括提供载体; 在载体上布置光电子半导体芯片; 在所述载体上形成用于辐射转换的转换层，其中所述光电半导体芯片被所述转换层包围; 并执行单一化处理以形成分离的光电子部件，其中至少转换层被切断。
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82.发明授权公开(公告)号：US09583467B2
公开(公告)日：2017-02-28
申请号：US14430215
申请日：2013-09-06
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/52 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/52 , H01L33/62 , H01L33/644 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2933/0075 , H01L2924/00
摘要： An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.
摘要翻译： 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。
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83.发明申请公开(公告)号：US20160225964A1
公开(公告)日：2016-08-04
申请号：US15022535
申请日：2014-08-25
发明人： Thomas Schwarz , Frank Singer , Jürgen Moosburger
CPC分类号： H01L33/54 , H01L21/568 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82 , H01L2224/96 , H01L2924/1815 , H01L2933/0033 , H01L2933/005 , H01L2933/0066
摘要： An optoelectronic semiconductor component includes an optoelectronic semiconductor that is partly embedded into a shaped body, which is formed from a molding compound that at least partly covers at least two lateral faces and the rear surface of the optoelectronic semiconductor chip. A first contact layer and a second contact layer are arranged on the shaped body and are electrically connected to the optoelectronic semiconductor chip. A mounting face is arranged transversely in relation to the radiation passage face and is provided for mounting the optoelectronic semiconductor component.
摘要翻译： 光电子半导体部件包括部分地嵌入到成形体中的光电子半导体，其由至少部分地覆盖光电子半导体芯片的至少两个侧面和后表面的模制化合物形成。 第一接触层和第二接触层布置在成形体上并与光电子半导体芯片电连接。 安装面相对于辐射通道面横向布置，并且用于安装光电子半导体部件。
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公开(公告)号：US20160155891A1
公开(公告)日：2016-06-02
申请号：US14900243
申请日：2014-06-25
CPC分类号： H01L33/005 , H01L24/24 , H01L25/167 , H01L27/15 , H01L33/44 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
摘要： An optoelectronic component includes an optoelectronic semiconductor chip embedded in a molded body such that an upper side of the optoelectronic semiconductor chip is at least partially not covered by the molded body, wherein a first metallization is arranged on an upper side of the molded body, wherein the first metallization is electrically insulated from the optoelectronic semiconductor chip, and a first material is arranged on the first metallization.
摘要翻译： 光电子部件包括嵌入到成型体中的光电半导体芯片，使得光电子半导体芯片的上侧至少部分地不被成型体覆盖，其中第一金属化被布置在成型体的上侧，其中 第一金属化与光电子半导体芯片电绝缘，并且第一材料布置在第一金属化上。
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85.发明申请公开(公告)号：US20160087177A1
公开(公告)日：2016-03-24
申请号：US14888770
申请日：2014-05-05
发明人： Thomas Schwarz , Frank Singer , Alexander Linkov , Stefan Illek , Wolfgang Mönch
CPC分类号： H01L33/62 , H01L24/24 , H01L25/0753 , H01L33/0095 , H01L33/46 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2933/0058 , H01L2933/0066 , H01L2924/00 , H01L2224/4554
摘要： A radiation-emitting semiconductor device includes at least one semiconductor chip having a semiconductor layer sequence having an active region that produces radiation; a mounting surface on which at least one electrical contact for external contacting of the semiconductor chip is formed, wherein the mounting surface runs parallel to a main extension plane of the semiconductor layer sequence; a radiation exit surface running at an angle to or perpendicularly to the mounting surface; a radiation-guiding layer arranged in a beam path between the semiconductor chip and the radiation exit surface; and a reflector body adjacent to the radiation-guiding layer in regions and in a top view of the semiconductor device covers the semiconductor chip.
摘要翻译： 辐射发射半导体器件包括至少一个具有半导体层序列的半导体芯片，该半导体层序列具有产生辐射的有源区; 其上形成有用于半导体芯片外部接触的至少一个电触点的安装表面，其中所述安装表面平行于所述半导体层序列的主延伸平面延伸; 辐射出口表面以与安装表面成角度或垂直于该安装表面延伸; 布置在半导体芯片和辐射出射表面之间的光束路径中的辐射引导层; 并且在半导体器件的区域和顶视图中与辐射引导层相邻的反射器体覆盖半导体芯片。
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公开(公告)号：US20150295141A1
公开(公告)日：2015-10-15
申请号：US14441458
申请日：2013-11-04
发明人： Thomas Schwarz , Matthias Sabathil
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H05K1/021 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
摘要： In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.
摘要翻译： 在至少一个实施例中，光电子半导体部件包含至少一个具有电接触器件的芯片支架，并且还包括至少一个光电子半导体芯片，该光电半导体芯片设置成产生辐射并且机械地和电气地安装在芯片支撑件上。 组件支持附加到芯片支持。 半导体芯片位于部件支撑件的凹部中。 元件支撑件与芯片支撑件和半导体芯片电绝缘。 部件支撑由金属或金属合金形成。 在远离芯片支架的顶部，元件支撑件提供反射涂层。
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公开(公告)号：US20150137162A1
公开(公告)日：2015-05-21
申请号：US14413670
申请日：2013-07-18
发明人： Matthias Sabathil , Stefan Illek , Thomas Schwarz
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side.
摘要翻译： 光电子半导体元件具有上侧和下侧的体积发射蓝宝石倒装芯片。 该光电子半导体部件嵌入具有上侧和下侧的光学透明模具体中。
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公开(公告)号：US11984435B2
公开(公告)日：2024-05-14
申请号：US17289114
申请日：2019-11-08
发明人： Thomas Schwarz , Frank Singer
IPC分类号： H01L25/075 , H01L33/10 , H01L33/58 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/10 , H01L33/58 , H01L33/62
摘要： A multi-pixel display device with an integrated circuit, a plurality of light-emitting semiconductor chips disposed on the integrated circuit, a display area having a plurality of pixels, each of the light-emitting semiconductor chips being associated with one of the pixels, a light-directing element disposed between the plurality of light-emitting semiconductor chips and the display area and adapted to direct the light of each light-emitting semiconductor chip from the plurality of light-emitting semiconductor chips to its associated pixel.
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公开(公告)号：US11480723B2
公开(公告)日：2022-10-25
申请号：US17475030
申请日：2021-09-14
发明人： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Tilman Ruegheimer , Frank Singer
IPC分类号： F21V8/00 , G02B27/01 , H01L25/075
摘要： The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US20220254304A1
公开(公告)日：2022-08-11
申请号：US17677870
申请日：2022-02-22
发明人： Thorsten Baumheinrich , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Jens Richter , Thomas Schwarz , Paul Ta , Kilian Regau , Christopher Soell , Hoa Vu , Christopher Wiesmann , Patrick Hoerner , Jong Park , Kanishk Chand
摘要： The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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