-
公开(公告)号：US11239386B2
公开(公告)日：2022-02-01
申请号：US16851232
申请日：2020-04-17
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC分类号： H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
摘要： An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
-
2.发明授权公开(公告)号：US09972759B2
公开(公告)日：2018-05-15
申请号：US14766420
申请日：2014-01-23
IPC分类号： H01L31/0203 , H01L31/02 , H01L31/024 , H01L33/48 , H01L33/62 , H01L33/64 , H01L23/00
CPC分类号： H01L33/62 , H01L24/18 , H01L24/24 , H01L31/02002 , H01L31/0203 , H01L31/024 , H01L33/483 , H01L33/647 , H01L2224/04105 , H01L2224/24137 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153
摘要： The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.
-
公开(公告)号：US20150243857A1
公开(公告)日：2015-08-27
申请号：US14424796
申请日：2013-08-28
CPC分类号： H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
摘要翻译： 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
-
公开(公告)号：US11749776B2
公开(公告)日：2023-09-05
申请号：US17552657
申请日：2021-12-16
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC分类号： H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
CPC分类号： H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/0203 , H01L31/02005 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L2933/0033 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
-
公开(公告)号：US20220109082A1
公开(公告)日：2022-04-07
申请号：US17552657
申请日：2021-12-16
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC分类号： H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
-
公开(公告)号：US09653670B2
公开(公告)日：2017-05-16
申请号：US14378610
申请日：2013-01-17
发明人： Stefan Illek , Walter Wegleiter , Karl Weidner , Stefan Stegmeier
IPC分类号： H01L33/00 , H01L21/00 , H01L33/64 , H01L33/48 , H01L33/62 , H01L27/15 , H01L33/36 , H01L33/52 , H01L25/075 , H01L33/54
CPC分类号： H01L33/64 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0016 , H01L2933/0025 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.
-
7.发明授权公开(公告)号：US09453634B2
公开(公告)日：2016-09-27
申请号：US14484069
申请日：2014-09-11
发明人： Walter Wegleiter , Andreas Plöβl , Frank Singer
IPC分类号： F21V17/00 , F21V17/10 , F21K99/00 , F21V19/00 , F21V21/096 , F21V29/89 , F21Y101/02
CPC分类号： F21V17/105 , F21K9/90 , F21V19/003 , F21V21/096 , F21V29/89 , F21Y2101/00 , F21Y2115/10 , Y10T29/4913
摘要： An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.
摘要翻译： 光电照明装置包括具有光电半导体芯片的照明模块。 连接托架具有第一主表面和远离第一主表面的第二主表面。 照明模块布置在连接托架的第一主表面上，并且连接托架由于吸引力而附着在散热器上。
-
公开(公告)号：US09209368B2
公开(公告)日：2015-12-08
申请号：US14424796
申请日：2013-08-28
IPC分类号： H01L33/00 , H01L33/56 , H01L33/38 , H01L33/40 , H01L33/36 , H01L33/62 , H01L33/54 , H01L33/60
CPC分类号： H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
摘要翻译： 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
-
公开(公告)号：US10665747B2
公开(公告)日：2020-05-26
申请号：US15963408
申请日：2018-04-26
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC分类号： H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L33/50 , H01L31/18 , H01L33/54 , H01L31/02
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
-
公开(公告)号：US20180248074A1
公开(公告)日：2018-08-30
申请号：US15963408
申请日：2018-04-26
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC分类号： H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
-
-
-
-
-
-
-
-
-
搜索结果
24 条记录 (耗时 0.019 秒)
