公开(公告)号：US09972454B1

公开(公告)日：2018-05-15

申请号：US14867336

申请日：2015-09-28

Applicant: Apple Inc.

Inventor： Sawyer I. Cohen ,  Tyler B. Cater ,  Ramachandran Chundru ,  Vivek Katiyar ,  Marwan Rammah ,  Ashutosh Y. Shukla

IPC: H01H1/10 ,  H01H3/12 ,  H01H11/00 ,  H01H3/00

CPC classification number: H01H3/12 ,  H01H11/00 ,  H01H2003/008 ,  H01H2011/0087

Abstract: An electronic device includes a tactile switch assembly. The tactile switch assembly includes a tactile switch structure. A grounding structure can be included in an electrostatic discharge path in the tactile switch structure. The grounding structure can result in a shorter electrostatic discharge path that minimizes damage caused by an electrostatic discharge event. Additionally, different grounding connectors are disclosed that can attach to a grounded component in the electronic device and to a tactile switch bracket associated with the tactile switch assembly. The grounding connector provides a grounding connection to the tactile switch bracket.

公开(公告)号：US09888562B2

公开(公告)日：2018-02-06

申请号：US13726509

申请日：2012-12-24

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/36

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

公开(公告)号：US09671889B1

公开(公告)日：2017-06-06

申请号：US14340138

申请日：2014-07-24

Applicant: Apple Inc.

Inventor： Thayne M. Miller ,  Jean-Marie Bussat ,  Steven P. Hotelling ,  Sawyer I. Cohen ,  Tyler B. Cater

IPC: G06K9/00 ,  G06F3/041 ,  G06F3/044

CPC classification number: G06K9/0002 ,  H03K17/962 ,  H03K17/975 ,  H03K2217/960755

Abstract: Input members with capacitive sensors are disclosed. In one embodiment of an electronic button, a first circuit is configured to capture a fingerprint of a user's finger placed on the electronic button, and a second circuit is configured to sense a force applied to the electronic button by the user's finger. The first circuit is further configured to provide temperature information to compensate for temperature sensitivities of the second circuit, and the second circuit is further configured to provide force information to the first circuit.

公开(公告)号：US09342727B2

公开(公告)日：2016-05-17

申请号：US14196832

申请日：2014-03-04

Applicant: APPLE INC.

Inventor： Sawyer I. Cohen ,  Scott A. Myers ,  Dale N. Memering

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06K9/00053

Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

Abstract translation: 电子设备可以包括具有感测区域的生物特征感测装置和位于感测区域上方的基板和/或生物测定传感装置。 衬底可以包括通过衬底的至少一部分形成的通孔。 通孔可以至少位于生物测定装置的感测区域的上方。 通孔可以用导电材料或电介质材料填充。 或者，可以用导电材料填充一些通孔，而其它通孔用非导电或电介质材料填充。

公开(公告)号：US20160071664A1

公开(公告)日：2016-03-10

申请号：US14553985

申请日：2014-11-25

Applicant: Apple Inc.

Inventor： Sawyer I. Cohen ,  Tyler B. Cater ,  Marwan Rammah ,  Yaocheng Zhang ,  Edward S. Huo ,  Dhaval N. Shah ,  Scott A. Myers ,  Vivek Katiyar

IPC: H01H13/50

CPC classification number: H01H13/705 ,  H01H13/52 ,  H01H2221/062 ,  H01H2221/064 ,  H01H2221/08

Abstract: Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.

Abstract translation: 公开了用于形成用于电子设备的按钮组件的系统和方法。 根据一些实施例，按钮组件包括一个或多个声音改进特征，以在根据电子设备的用户按压时改善按钮组件所产生的声音。 根据一些实施例，按钮组件包括提供按钮组件的各种部件的适当对准并且适应按钮组件的各种部件的任何公差叠加的垫片。 垫片可以包括对准特征，以防止垫片在按钮组件内移动。 根据一些实施例，垫片的厚度被定制以适应按钮组件的部件的不同公差叠加。 在一些实施例中，按钮组件包括声音改进特征和垫片的组合。

公开(公告)号：US20160004284A1

公开(公告)日：2016-01-07

申请号：US14323874

申请日：2014-07-03

Applicant: Apple Inc.

Inventor： Sawyer I. Cohen ,  David A. Pakula ,  Tseng-Mau Yang ,  Tyler B. Cater ,  Ashutosh Y. Shukla

IPC: G06F1/20 ,  F28F21/06 ,  H05K7/20 ,  B32B37/18 ,  B32B37/12 ,  B32B38/00 ,  F28F21/02 ,  B32B37/14

CPC classification number: H05K7/20454 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/20 ,  H05K7/20481

Abstract: This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.

Abstract translation: 本申请涉及在便携式计算设备内有效地分配热量。 更具体地，公开了一种用于在便携式计算设备的内部部件之间传导热量的装置。 被称为热间隙垫的装置构造成在内部部件之间桥接可变尺寸的间隙。 这通过将弹性芯包裹在高导热材料层中来实现。 弹性芯允许热间隙垫的形状根据间隙的大小而变化。 可以调节热间隙垫的弹性以考虑间隙中的变化量。 在一些实施例中，可以添加导电层以促进电流通过热间隙垫。

公开(公告)号：US20150254490A1

公开(公告)日：2015-09-10

申请号：US14196832

申请日：2014-03-04

Applicant: APPLE INC.

Inventor： Sawyer I. Cohen ,  Scott A. Myers ,  Dale N. Memering

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06K9/00053

Abstract: An electronic device may include a biometric sensing device that has a sensing area, and a substrate positioned above the sensing area and/or the biometric sensing device. The substrate can include vias that are formed through at least a portion of the substrate. The vias can be positioned at least above the sensing area of the biometric sensing device. The vias may be filled with a conductive material or a dielectric material. Alternatively, some vias can be filled with a conductive material while other vias are filled with a non-conductive or dielectric material.

Abstract translation: 电子设备可以包括具有感测区域的生物特征感测装置和位于感测区域上方的基板和/或生物测定传感装置。 衬底可以包括通过衬底的至少一部分形成的通孔。 通孔可以至少位于生物测定装置的感测区域的上方。 通孔可以用导电材料或电介质材料填充。 或者，可以用导电材料填充一些通孔，而其它通孔用非导电或电介质材料填充。

公开(公告)号：US20140177180A1

公开(公告)日：2014-06-26

申请号：US13726509

申请日：2012-12-24

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/02 ,  H05K1/11 ,  H05K13/00 ,  H05K9/00

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。