Method for fabricating group-III nitride devices and devices fabricated using method
    82.
    发明授权
    Method for fabricating group-III nitride devices and devices fabricated using method 有权
    使用方法制造III族氮化物器件的方法和器件

    公开(公告)号:US07332365B2

    公开(公告)日:2008-02-19

    申请号:US10848937

    申请日:2004-05-18

    Abstract: A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first mirror layer and the substrate. Flip-chip mounting the epitaxial semiconductor structure, with its first mirror and substrate on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and substrate. The substrate is then removed from the epitaxial structure by introducing an etch environment to the substrate. A second mirror layer is deposited on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first and second mirror layers. A device according to the present invention comprising a resonant cavity light emitting diode (RCLED) mounted to a submount.

    Abstract translation: 根据本发明的用于制造高光提取光子器件的方法,包括在衬底上生长外延半导体结构并在外延半导体结构上沉积第一镜面层,使得外延半导体结构夹在第一镜面层和衬底之间 。 倒装芯片安装外延半导体结构,其第一反射镜和衬底位于基座上,使得外延半导体器件结构夹在基座和衬底之间。 然后通过向衬底引入蚀刻环境,从衬底去除衬底。 第二镜层沉积在外延半导体结构上,使得外延半导体结构夹在第一和第二镜层之间。 根据本发明的装置包括安装到底座的谐振腔发光二极管(RCLED)。

    Highly efficient gallium nitride based light emitting diodes via surface roughening
    86.
    发明申请
    Highly efficient gallium nitride based light emitting diodes via surface roughening 有权
    通过表面粗糙化的高效氮化镓基发光二极管

    公开(公告)号:US20070121690A1

    公开(公告)日:2007-05-31

    申请号:US10581940

    申请日:2003-12-09

    Abstract: A gallium nitride (GaN) based light emitting diode (LED), wherein light is extracted through a nitrogen face (N-face) (42) of the LED and a surface of the N-face (42) is roughened into one or more hexagonal shaped cones. The roughened surface reduces light reflections occurring repeatedly inside the LED, and thus extracts more light out of the LED. The surface of the N-face (42) is roughened by an anisotropic etching, which may comprise a dry etching or a photo-enhanced chemical (PEC) etching.

    Abstract translation: 一种氮化镓(GaN)基发光二极管(LED),其中通过LED的氮面(N面)(42)提取光,并且将N面(42)的表面粗糙化成一个或多个 六角形锥体。 粗糙表面减少LED内部重复发生的光反射,从而从LED中提取更多的光。 通过各向异性蚀刻使N面(42)的表面粗糙化,其可以包括干蚀刻或光增强化学(PEC)蚀刻。

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