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公开(公告)号：US07131478B2
公开(公告)日：2006-11-07
申请号：US11037221
申请日：2005-01-19
申请人： Shinichiro Endo , Takashi Andoh , Hiroyuki Fujiwara , Yuuji Nagasawa , Hironori Konno , Hiroaki Imagawa , Wataru Hirai
发明人： Shinichiro Endo , Takashi Andoh , Hiroyuki Fujiwara , Yuuji Nagasawa , Hironori Konno , Hiroaki Imagawa , Wataru Hirai
IPC分类号： B65H5/28
CPC分类号： H05K13/0419 , Y10S156/941 , Y10T156/11 , Y10T156/1105 , Y10T156/1768 , Y10T156/19 , Y10T156/1906 , Y10T156/1983 , Y10T156/1994
摘要： An apparatus for supplying a component carrier in the form of a tape is provided. The component carrier has a number of cavities formed on one surface thereof for containing components. A pair of spaced first and second guide plates that function to guide one surface of the component carrier. A movable guide plate is disposed between the first and second guide plates so that it can move back and forth between a first position adjacent to the first guide plate for defining a component pickup station and a second position adjacent to the second guide plate. The movable guide plate has an extension which extends along at least one longitudinal edge of the component carrier and opposes the one surface of the component carrier for preventing movement thereof when the movable guide plate takes the first position.
摘要翻译： 提供一种用于提供带状形式的部件载体的装置。 部件载体在其一个表面上形成有用于容纳部件的多个空腔。 一对间隔开的第一和第二引导板，其用于引导部件载体的一个表面。 可动引导板设置在第一和第二引导板之间，使得其可在与第一引导板相邻的第一位置之间来回移动，以限定部件拾取站和与第二引导板相邻的第二位置。 可移动导板具有延伸部分，该延伸部分沿着部件载体的至少一个纵向边缘延伸，并且与可移动引导板处于第一位置时防止其移动的部件载体的一个表面相对。
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公开(公告)号：US20060011644A1
公开(公告)日：2006-01-19
申请号：US10527668
申请日：2003-07-15
申请人： Satoshi Kawaguchi , Teruo Kawaguchi , Kiyoshi Imai , Koji Okawa , Shuichi Kubota
发明人： Satoshi Kawaguchi , Teruo Kawaguchi , Kiyoshi Imai , Koji Okawa , Shuichi Kubota
IPC分类号： B65H3/00
CPC分类号： H05K13/0419 , Y10S156/941 , Y10T156/11 , Y10T156/19 , Y10T156/1983
摘要： A part feeding device capable of preventing the adhesive surface of a top tape from being exposed even if a pleat line is displaced and easily and collectively removing the top tape collected by winding on a reel body and a part feeding method, the device comprising a top tape transfer part (1) having raising rollers (6) raising the top tape (104) a specified amount by generally 90° with the adhesive surfaces thereof at both ends facing inside, a folding rollers (5) folding the raised top tape by falling on the unraised top tape, and a tape delivery part (18) feeding the folded top tape at a specified pitch, wherein the reel body collecting the peeled top tape can collectively push out the group of the wound top tape in the axial direction.
摘要翻译： 一种能够防止顶部带的粘合剂表面即使褶皱线移位并且容易地并且集体地去除通过缠绕在卷轴主体上收集的顶部带子和部件进给方法的部件进给装置，该装置包括顶部 带传送部件（1），其具有提升辊（6），其顶部带（104）将两个端部的粘合表面面向内部大致90度地提高指定的量，折叠辊（5）通过下落而折叠升高的顶部带 在未经引导的顶部胶带上的胶带传送部分（18）以及以指定间距供给折叠顶部胶带的带传送部分（18），其中收集剥离的顶部胶带的卷轴体可以沿着轴向共同地推出卷绕的顶部胶带组。
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公开(公告)号：US06948541B2
公开(公告)日：2005-09-27
申请号：US10884940
申请日：2004-07-07
申请人： Johan Bergstrom , Maria Liljegren , Johan Skaborn
发明人： Johan Bergstrom , Maria Liljegren , Johan Skaborn
CPC分类号： H05K13/0417 , Y10S156/941 , Y10T156/11 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1983 , Y10T156/1994
摘要： System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides.Each tape guide also comprises visual marking for indicating the sub-set to which the tape guide belongs.
摘要翻译： 用于处理与组件安装机中的电路板组件相关的组件的系统。 该系统包括设置在组件磁带盘上的多个组件磁带，以及多个磁带引导件，其被布置用于接收给定组件磁带宽度的组件磁带，并且用于将组件磁带置于适当位置，用于馈送组件磁带并用于从 组件安装机中的组件磁带。 带引导件具有类似的几何轮廓和基本构造，并且每个带引导件包括用于通过移除覆盖该部件的覆盖带的一部分而使拾取位置处的部件露出的部件曝光装置。 磁带引导件被分成磁带引导件的子集，其中每个单独的子组的磁带引导件具有相同设计的部件曝光装置，该设计取决于用于该子集的组件磁带的配置 磁带导轨 每个磁带引导件还包括用于指示磁带引导件所属的子集的视觉标记。
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公开(公告)号：US06910514B2
公开(公告)日：2005-06-28
申请号：US10312404
申请日：2001-06-29
申请人： Shinichiro Endo , Takashi Andoh , Hiroyuki Fujiwara , Yuuji Nagasawa , Hironori Konno , Hiroaki Imagawa , Wataru Hirai
发明人： Shinichiro Endo , Takashi Andoh , Hiroyuki Fujiwara , Yuuji Nagasawa , Hironori Konno , Hiroaki Imagawa , Wataru Hirai
CPC分类号： H05K13/0419 , Y10S156/941 , Y10T156/11 , Y10T156/1105 , Y10T156/1768 , Y10T156/19 , Y10T156/1906 , Y10T156/1983 , Y10T156/1994
摘要： An apparatus 101 for supplying a component carrier in the form of a tape is provided. The component carrier 102 has a number of cavities 116 formed on one surface thereof for containing components 115. A pair of spaced first and second guide plates 106 and 107 guide one surface of the component carrier. A movable guide plate 109 is disposed between the first and second guide plates so that it can move back and forth between a first position adjacent to the first guide plate for defining a component pickup station 111 and a second position adjacent to said second guide plate. The movable guide plate has an extension 112 which extends along at least one longitudinal edge of the component carrier and opposes to said one surface of said component carrier for preventing movement thereof when the movable guide plate takes the first position.
摘要翻译： 提供一种用于提供带状形式的分量载体的装置101。 部件载体102具有在其一个表面上形成的用于容纳部件115的多个空腔116。 一对间隔的第一和第二导向板106和107引导部件载体的一个表面。 可动引导板109设置在第一和第二引导板之间，使得其可以在与第一引导板相邻的第一位置之间来回移动，以限定部件拾取站111和与所述第二引导板相邻的第二位置。 可移动导板具有延伸部112，该延伸部112沿着部件托架的至少一个纵向边缘延伸并且与所述部件托架的所述一个表面相对，用于当可移动引导板处于第一位置时防止其移动。
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公开(公告)号：US06751853B2
公开(公告)日：2004-06-22
申请号：US09772792
申请日：2001-01-30
IPC分类号： B23P1900
CPC分类号： H01L21/67144 , B25B11/005 , H01L21/67132 , H01L21/6838 , Y10S156/93 , Y10S156/941 , Y10S156/942 , Y10T29/49822 , Y10T29/49998 , Y10T29/53191 , Y10T29/53274 , Y10T156/1179 , Y10T156/19 , Y10T156/1978
摘要： An apparatus which reduces the surface area with which a carrier film adheres to a die, including a plate member including laterally-spaced supports. Preferably, the apparatus also includes a vacuum source operatively connected to the plate member. Upon placement of a carrier film having an array of semiconductor dice adhered thereto onto the plate member, the dice are proximate the supports. The vacuum pulls air from the spaces between the supports, which partially releases the carrier film from the bottom surface of at least some of the dice. The apparatus may also include a die removal mechanism such as a vacuum collet type die pick-up mechanism, an extendable member die plunge-up mechanism, or a combination thereof. The present invention also includes a method for reducing the surface area with which a carrier film adheres to a die to facilitate removal thereof.
摘要翻译： 一种减少载体膜附着于模具的表面积的装置，包括包括横向隔开的支撑件的板构件。 优选地，该装置还包括可操作地连接到板构件的真空源。 在将具有粘附到其上的半导体晶片阵列的载体膜放置在板构件上时，骰子靠近支撑件。 真空从支撑件之间的空间抽吸空气，其部分地从至少一些骰子的底表面释放载体膜。 该设备还可以包括诸如真空夹头型模具拾取机构的模具移除机构，可延伸构件模具插入机构或其组合。 本发明还包括一种减少载体膜附着于模具以便于除去的表面积的方法。
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公开(公告)号：US20030102082A1
公开(公告)日：2003-06-05
申请号：US10318231
申请日：2002-12-12
IPC分类号： B32B001/00
CPC分类号： H01L21/6835 , B26F3/004 , H01L21/67092 , H01L2221/68363 , H01L2924/30105 , Y10S156/941 , Y10T29/49821 , Y10T83/364 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/19 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939
摘要： This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
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公开(公告)号：US20030010444A1
公开(公告)日：2003-01-16
申请号：US09901141
申请日：2001-07-10
发明人： See Yap Ong , Tong Heng Cheah , Shu Chuen Ho , Teng Hock Kuah
IPC分类号： B32B001/00
CPC分类号： H01L21/6835 , Y10S156/941 , Y10T29/49819 , Y10T29/49822 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1989
摘要： A resin body is moulded around a die located on the front surface of a lead frame, and subsequently masking tape adhered to the rear surface of the lead frame is peeled away. While the tape is peeled away, the front surface of the lead frame is clamped by a surface which contains, or which can be deformed to contain, a recess for receiving the resin body. The peeling is performed by firstly separating an edge portion of the tape from the lead frame by a diagonal motion, and subsequently moving the edge portion across the lead frame so as to peel back the tape until its adhered surface faces away from the lead frame. A retrieval plate is urged against the adhered surface, so that the adhered surface becomes adhered to the retrieval plate. This process is repeated for successive lead frames, so that a stack of masking tape sections is formed on the retrieval plate.
摘要翻译： 将树脂体模制在位于引线框架的前表面上的模具周围，随后将附着在引线框架的后表面上的胶带剥离。 当胶带被剥离时，引线框架的前表面由包含用于接收树脂体的凹部的容纳或可变形的表面夹紧。 通过首先将引线框架的边缘部分以对角线运动分离，然后将边缘部分移动穿过引线框架从而剥离带，直到其粘附表面背离引线框架来进行剥离。 将取出板推靠在粘接面上，使粘接面附着在回卷板上。 对于连续的引线框架重复该过程，使得在拾取板上形成一叠遮蔽带部分。
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公开(公告)号：US20020104616A1
公开(公告)日：2002-08-08
申请号：US09776758
申请日：2001-02-06
发明人： Bhola De , Daniel Stofman
IPC分类号： B32B001/00
CPC分类号： H01L21/67132 , Y10S134/902 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/1126 , Y10T156/1137 , Y10T156/1179 , Y10T156/19
摘要： A wafer demounting receptacle comprises a substantially circular plate member and an upstanding rim structure provided around a periphery of the plate member. The rim structure is stepped and includes a first step defining a first diameter, and a second step defining a second diameter grater than the first diameter. The riser of the first step has a very low height so that a gap between the plate member and a fragile semiconductor wafer bonded to a carrier having a peripheral abutment surface resting on the run of the first step, limits the bending of an edge portion of the wafer in a direction towards the plate member while the wafer is partially demounted from a wafer carrier. The plate member is further provided with a pattern of holes that generates eddy currents in a solvent that flows over the wafer, carrier, and receptacle so as to soften and dissolve the mounting adhesive between the wafer and carrier such that the wafer is separated from the carrier. The wafer demount receptacle can be used in conjunction with a wafer demount tool comprising a chamber defined between a backing plate and a contact plate. The chamber is provided with a gas inlet for introducing a pressurized gas, while the contact plate is provided with a plurality of through-holes. The wafer demount tool is mated to the wafer demount receptacle such that the contact plate is juxtaposed against the back side of a wafer carrier resting in the wafer demount receptacle. Pressurized gas flowing through the wafer demount tool displaces solvent from the wafer-carrier interface to further promote separation of the wafer from the carrier.
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公开(公告)号：US06418999B1
公开(公告)日：2002-07-16
申请号：US09211757
申请日：1998-12-15
IPC分类号： B32B3500
CPC分类号： H01L21/6835 , B26F3/004 , H01L21/67092 , H01L2221/68363 , H01L2924/30105 , Y10S156/941 , Y10T29/49821 , Y10T83/364 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/19 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939
摘要： This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
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公开(公告)号：US06415843B1
公开(公告)日：2002-07-09
申请号：US09756849
申请日：2001-01-10
申请人： Bhola De , Mark Spencer Grey
发明人： Bhola De , Mark Spencer Grey
IPC分类号： B32B3500
CPC分类号： H01L21/68707 , Y10S156/941 , Y10T156/11 , Y10T156/1184 , Y10T156/19 , Y10T156/1961
摘要： A wafer removing spatula has a handle connected to a tray. A shaft of the handle is provided with a pair of support guides and the tray is provided with a wafer support surface which rests on a tray support surface. The support guides and the tray support surface are configured and dimensioned to ensure that the wafer support surface is substantially parallel to the upper surface of a base plate on which both the support guides and the tray support surface rest. A front edge of the wafer support surface is provided with a bevel to facilitate lifting a wafer from a wafer carrier surface. The height of the lowermost portion of the front edge is approximately the same as the height of a wafer carrier placed on the base plate. During operation, the spatula is moved on the base plate towards the carrier with the wafer mounted thereon. The front edge of the spatula eases just above the upper surface of the wafer carrier such that the beveled edge creates and then enters a separation gap between the wafer and the wafer carrier, thereby causing the wafer to separate from the wafer carrier and climb onto the wafer support surface.
摘要翻译： 晶片去除刮刀具有连接到托盘的手柄。 手柄的轴设置有一对支撑引导件，并且托盘设置有搁置在托盘支撑表面上的晶片支撑表面。 支撑引导件和托盘支撑表面的构造和尺寸被确定为确保晶片支撑表面基本上平行于基板的上表面，其中支撑引导件和托盘支撑表面都搁置在基板的上表面上。 晶片支撑表面的前边缘设置有斜面以便于从晶片载体表面提起晶片。 前边缘的最低部分的高度与放置在基板上的晶片载体的高度大致相同。 在操作期间，将刮刀在其上安装有晶片的基板上朝向载体移动。 刮刀的前边缘刚好在晶片载体的上表面上方，使得斜切边缘产生并且然后进入晶片和晶片载体之间的分离间隙，从而使晶片与晶片载体分离并爬上 晶片支撑面。
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