公开(公告)号：US06739888B2

公开(公告)日：2004-05-25

申请号：US10441117

申请日：2003-05-20

Applicant: Hajime Kato ,  Mitsuhiro Matsumoto ,  Yutaka Masuda

Inventor： Hajime Kato ,  Mitsuhiro Matsumoto ,  Yutaka Masuda

IPC: H01R1362

CPC classification number: H01R13/62933 ,  B60L3/00 ,  B60L2270/147 ,  H01R13/62905 ,  H01R24/38 ,  H01R2105/00 ,  H01R2201/26

Abstract: When one shielded connector is engaged with the other shielded connector, a conductive connector housing of the one connector is electrically connected to a conductive connector housing of the other connector to establish shield connection. Either one of the connectors has a conductive rotating lever, while the other connector has an engaging portion for engaging with the rotating lever to connect the shielded connectors by rotation of the rotating lever. A conductive resilient abutting member, which abuts on the rotating lever and/or the other connector housing to be resiliently deformed when the connectors are connected with each other by rotation of the rotating lever, is provided on the rotating lever and/or the other connector housing.

Abstract translation: 当一个屏蔽连接器与另一个屏蔽连接器接合时，一个连接器的导电连接器外壳电连接到另一个连接器的导电连接器外壳，以建立屏蔽连接。 连接器中的任一个具有导电旋转杆，而另一个连接器具有用于与旋转杆接合的接合部分，以通过旋转杆的旋转来连接屏蔽连接器。 当旋转杆和/或另一个连接器设置连接器通过旋转杆的旋转而彼此连接时，抵靠旋转杆和/或另一个连接器壳体弹性变形的导电弹性抵靠构件 住房。

公开(公告)号：US06695632B2

公开(公告)日：2004-02-24

申请号：US10425972

申请日：2003-04-30

Applicant: Mitsuhiro Matsumoto ,  Hirotaka Fukushima ,  Hajime Kato

Inventor： Mitsuhiro Matsumoto ,  Hirotaka Fukushima ,  Hajime Kato

IPC: H01R1364

CPC classification number: H01R13/6485 ,  H01R13/111 ,  H01R13/18 ,  H01R13/187 ,  H01R13/5202 ,  H01R13/5205 ,  H01R13/6273

Abstract: A low-cost shield connector 1 connecting smoothly with a mating connector includes a connector housing 20, a terminal 21, an inner housing 22, a spacer 23 and a lance 42. The connector housing 20 is formed into tubular shape. The terminal 21 is joined to a shield wire 29. The inner housing 22 receiving the terminal 21 is received in the connector housing 20. The spacer 23 to be mounted in the inner housing 22 prevents the terminal 21 from coming off from the inner housing 22. The lance 42 formed integrally with the inner housing 22 is locked in the connector housing 20.

Abstract translation: 与配合连接器平滑连接的低成本屏蔽连接器1包括连接器壳体20，端子21，内壳体22，间隔件23和矛杆42.连接器壳体20形成为管状。 端子21连接到屏蔽线29.接收端子21的内壳体22被容纳在连接器壳体20中。要安装在内壳体22中的间隔件23防止端子21从内壳体22脱落 与内壳体22一体形成的喷枪42被锁定在连接器壳体20中。

公开(公告)号：US06635233B2

公开(公告)日：2003-10-21

申请号：US09812282

申请日：2001-03-20

Applicant: Hajime Kato ,  Masahito Yoshikawa ,  Kazuyoshi Iwayama ,  Shinichi Sakaguchi ,  Naoyuki Uchiyama

Inventor： Hajime Kato ,  Masahito Yoshikawa ,  Kazuyoshi Iwayama ,  Shinichi Sakaguchi ,  Naoyuki Uchiyama

IPC: C01B3948

CPC classification number: C10G45/64 ,  B01J29/04 ,  C01B39/48 ,  C01P2002/72 ,  C01P2004/03 ,  C01P2004/62 ,  C07C5/2708 ,  C07C17/358 ,  C07C2529/78 ,  C10G35/065 ,  C10G35/095 ,  C07C15/00

Abstract: A CFI-type zeolite where the atomic ratio of silicon to the heteroatom is 45 or less and the long axes of the crystals are 0.7 &mgr;m or less is useful as a catalyst for conversion reaction of aromatic compounds because the zeolite has a number of active sites and small crystals.

Abstract translation: 硅与杂原子的原子比为45以下，晶体的长轴为0.7μm以下的CFI型沸石可用作芳香族化合物的转化反应的催化剂，因为沸石具有多个活性部位 和小晶体。

公开(公告)号：US06401542B1

公开(公告)日：2002-06-11

申请号：US09614211

申请日：2000-07-11

Applicant: Hajime Kato

Inventor： Hajime Kato

IPC: G01L906

CPC classification number: G01L19/148 ,  G01L19/0038 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A down-sized pressure sensing semiconductor device with improved EMI tolerance as compared with conventional ones is achieved. A metal substrate (11) has a through hole (12), in which a cylinder (9b) of a pressure leading-in tube (9) is inserted, and is fixed to a flange (9a) of the pressure leading-in tube (9). A control circuit component (13) for controlling a semiconductor chip (1) is disposed on the metal substrate (11). On the metal substrate (11), a connector electrode (14) is further provided which establishes electrical connections between the pressure sensing semiconductor device and external circuits. Further, a metal cover (17) in the shape of a connector leading to external circuits is soldered to the metal substrate (11) to cover the semiconductor chip (1) and the control circuit component (13) together with the metal substrate (11). The cover (17) is electrically connected to a conductive wire (e.g., a ground wire) formed on the metal substrate (11).

Abstract translation: 实现了与传统半导体器件相比具有改善的EMI容差的小型压力感测半导体器件。 金属基板（11）具有通孔（12），其中插入有压力导入管（9）的圆筒（9b），并且被固定到压力导入管的凸缘（9a） （9）。 用于控制半导体芯片（1）的控制电路部件（13）设置在金属基板（11）上。 在金属基板（11）上，还设有连接器电极（14），其在压力感测半导体器件和外部电路之间建立电连接。 此外，将通向外部电路的连接器形状的金属盖（17）焊接到金属基板（11）以与金属基板（11）一起覆盖半导体芯片（1）和控制电路部件（13） ）。 盖（17）电连接到形成在金属基板（11）上的导线（例如接地线）。

公开(公告)号：US5773881A

公开(公告)日：1998-06-30

申请号：US751699

申请日：1996-11-18

Applicant: Hajime Kato

Inventor： Hajime Kato

IPC: G01P15/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/12 ,  H01L23/02 ,  H01L23/48

CPC classification number: G01P15/123 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105

Abstract: An impact load effected on the single body of an acceleration sensor device is absorbed with a relatively simple construction, thereby protecting a semiconductor sensor element provided in the sensor. The acceleration sensor device comprises a semiconductor sensor element 2 which can sense an acceleration in a direction perpendicular to its principal plane, a base plate 3 which supports the sensor element 2, a package 11 which supports the base plate 3 and encloses the base plate 3 and the sensor element 2, a frame 12 which has a plurality of leg sections 12d protruding from a bottom plane of the package 11 and is fixed on the package 11, and a cap-shaped resin cover 13 which has a roof section 13a opposite to an upper surface of the package 11 or the frame 12 and covers the package 11 from above as fixed on the package 11, and a side wall section 13b of the cover 13 extends at least to a position corresponding to a place where the sensor element 2 is arranged.

Abstract translation: 通过相对简单的结构吸收对加速度传感器装置的单体产生的冲击载荷，从而保护设置在传感器中的半导体传感器元件。 加速度传感器装置包括可以感测与其主平面垂直的方向的加速度的半导体传感器元件2，支撑传感器元件2的基板3，支撑基板3并包围基板3的封装11 和传感器元件2，具有从包装11的底面突出并固定在包装11上的多个脚部12d的框架12和具有与第一包装11相对的顶部部分13a的帽状树脂罩13 包装11或框架12的上表面，并且从固定在包装11上的上方覆盖包装11，并且盖13的侧壁部分13b至少延伸到与传感器元件2 被安排。

公开(公告)号：US5693884A

公开(公告)日：1997-12-02

申请号：US680026

申请日：1996-07-15

Applicant: Hajime Kato

Inventor： Hajime Kato

IPC: G01P1/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/12 ,  H01L29/84

CPC classification number: G01P1/003 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828

Abstract: A semiconductor acceleration sensor includes a substrate, a semiconductor sensor chip with a diaphragm and having one end fixed to a pedestal, the pedestal including at least one thick film layer and disposed on the substrate, and a protrusion of at least one thick film layer on the substrate directly opposite a free end of the sensor chip, shorter than the pedestal. The protrusion protects the semiconductor sensor chip from breakage at the diaphragm due to impacts.

Abstract translation: 一种半导体加速度传感器，包括：基板，具有隔膜的半导体传感器芯片，其一端固定在基座上，所述基座包括至少一个厚膜层，并且设置在所述基板上;以及至少一个厚膜层的突出部， 基板直接与传感器芯片的自由端相对，比基座短。 该凸起保护半导体传感器芯片免受因隔膜而产生的冲击。

公开(公告)号：US4131474A

公开(公告)日：1978-12-26

申请号：US804731

申请日：1977-06-08

Applicant: Hiroshi Uchikawa ,  Hajime Kato

Inventor： Hiroshi Uchikawa ,  Hajime Kato

IPC: B22C1/16 ,  C04B7/32 ,  C04B28/06 ,  B28B7/34

CPC classification number: B22C1/167 ,  C04B28/065 ,  C04B7/323

Abstract: This invention relates to mixtures of molding sand which comprise a mixture of a molding sand with a rapid hardening cement containing calcium aluminate as amorphous glass and/or crystals, and/or calcium haloaluminate, a polymer water holding agent and a lime, or mixture of a molding sand with the above-mentioned rapid hardening cement, a polymer water reducing agent, a lime, and, if necessary, a foaming agent, and in either case with water. The mixture also provides a method of mixing the ingredients except for water and then kneading the mixture with water.

Abstract translation: 本发明涉及型砂混合物，其包括型砂与含有铝酸钙作为无定形玻璃和/或晶体的快速硬化水泥和/或卤化铝酸钙，聚合物保水剂和石灰的混合物或混合物 具有上述快速硬化水泥的成型砂，聚合物减水剂，石灰，以及必要时的发泡剂，并且在任一情况下都具有水。 该混合物还提供了除水以外的成分混合，然后将混合物与水混合的方法。

公开(公告)号：US3954489A

公开(公告)日：1976-05-04

申请号：US444650

申请日：1974-02-21

Applicant: Hiroshi Uchikawa ,  Hajime Kato

Inventor： Hiroshi Uchikawa ,  Hajime Kato

IPC: C04B22/06 ,  C04B7/345 ,  C04B22/00 ,  C04B22/08 ,  C04B28/06 ,  C04B7/02 ,  C04B7/35

CPC classification number: C04B28/065 ,  C04B22/0013

Abstract: This invention relates to a method for retarding the setting time of rapid hardening cement which comprises adding a boric compound to cement manufactured by adding insoluble anhydrite to clinker powder containing 11CaO.7Al.sub.2 O.sub.3.CaX.sub.2 or adding the clinker to insoluble anhydrite and intergrinding the mixture, and a method for still more retarding the setting time of rapid hardening cement which comprises adding a boric compound to cement containing a set-retarding agent other than the boric compound.

Abstract translation: 本发明涉及一种延缓快速硬化水泥凝固时间的方法，该方法包括向通过向含有11CaO.7Al2O3.CaX2的熟料中加入不溶性无水石膏制成的水泥加入硼化合物，或将熟料加入不溶性无水石膏中并研磨混合物， 一种用于进一步延缓快速硬化水泥凝固时间的方法，该方法包括向含有硼化合物以外的阻凝剂的水泥中加入硼化合物。

公开(公告)号：US09040845B2

公开(公告)日：2015-05-26

申请号：US13993404

申请日：2011-12-27

Applicant: Hajime Kato ,  Masahiro Tanaka

Inventor： Hajime Kato ,  Masahiro Tanaka

IPC: H01R13/648 ,  H02G3/04 ,  H02G15/02 ,  H05K9/00 ,  H01R13/52 ,  H01R13/6599 ,  B60R16/02

CPC classification number: H02G3/04 ,  B60R16/0215 ,  H01R13/5208 ,  H01R13/6599 ,  H02G15/02 ,  H05K9/0007 ,  H05K9/0018

Abstract: A shielding structure for a wire harness includes a seal member which has a wire through hole that allows the wire to pass therethrough while sealing a circumference of the wire. The wire has a structure where an insulating resin layer is formed on an outer circumference of a conductor, and a predetermined range in a length direction of the conductor is coated with a shield layer formed by resin plating to cover an outer circumferential surface of the insulating resin layer. A terminal portion of the wire is passed through the wire through hole of the seal member to be introduced into the shield wall to a position where the shield layer exists, whereby an inner circumference of the wire through hole is made in close contact with the shield layer to cause the shield layer and the seal member to be electrically conducted with each other.

公开(公告)号：US08894449B2

公开(公告)日：2014-11-25

申请号：US13498401

申请日：2010-07-27

Applicant: Mitsuhiro Matsumoto ,  Hajime Kato ,  Tatsuya Goto

Inventor： Mitsuhiro Matsumoto ,  Hajime Kato ,  Tatsuya Goto

IPC: H01R4/30 ,  H01R9/24 ,  H01R4/34 ,  H01R11/12

CPC classification number: H01R9/24 ,  H01R4/34 ,  H01R11/12

Abstract: [Problem] To provide a compact terminal block.[Means for solving problem]A terminal block 1 includes: a terminal block main body 2 on which a plurality of seating surfaces 13 are provided; a plurality of fixing members 3 penetrating first and second connection terminals and fixing the first and second connection terminals to the seating surfaces 13 in a manner that the first connection terminals are connected to electronic devices, and the second connection terminals 8 to be electrically connected to the first connection terminals are overlapped with the seating surfaces 13. The seating surfaces 13 are sloped relative to a direction W that the first and second connection terminals are arranged.

Abstract translation: [问题]提供紧凑型端子块。 [解决问题的方案]接线端子1包括：端子台主体2，其上设置有多个座表面13; 多个固定构件3，穿过第一和第二连接端子，并将第一和第二连接端子以第一连接端子连接到电子设备的方式固定到座表面13，并且第二连接端子8电连接到 第一连接端子与座表面13重叠。就座表面13相对于布置第一和第二连接端子的方向W倾斜。