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    SPLIT CAMERA LENS AND ASSEMBLY METHOD THEREOF, CAMERA MODULE, AND TERMINAL DEVICE
    71.
    发明申请
    SPLIT CAMERA LENS AND ASSEMBLY METHOD THEREOF, CAMERA MODULE, AND TERMINAL DEVICE 有权

    公开(公告)号：US20220291473A1

    公开(公告)日：2022-09-15

    申请号：US17635495

    申请日：2020-07-08

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Takehiko TANAKA ,  Zhewen MEI ,  Haipeng PEI

    IPC: G02B7/02 ,  G03B30/00

    Abstract: Disclosed are a split camera lens (20) and an assembly method thereof, a camera module (10), and a terminal device (100). The split camera lens (20) includes: a first lens portion (21) including a first optical lens (211), and a second lens portion (22): wherein the first lens portion (21) is assembled on the second lens portion (22), and the second lens portion (22) includes a lens barrel (222) and at least one second optical lens (221) mounted in the lens barrel (222); and the second optical lens (221) at the topmost side is completely exposed on the top of the lens barrel (222), thus, a “lens barrel top face” structure of the first lens portion (21) and the second lens portion (22) is removed so as to enlarge an adjustment range of the split camera lens (20). Furthermore, in case that the camera module (10) including the split camera lens (20) is assembled on the terminal device (100), an optical zone (212) of the first optical lens (211) may be adjacent to the top of a through hole (810) of a display screen (81) so as to obtain a larger field angle and light flux, thereby ensuring that the camera module (10) has a high imaging quality.

    CAMERA MODULE ARRAY AND ASSEMBLY METHOD THEREFOR
    72.
    发明申请
    CAMERA MODULE ARRAY AND ASSEMBLY METHOD THEREFOR 有权

    公开(公告)号：US20220217254A1

    公开(公告)日：2022-07-07

    申请号：US17702384

    申请日：2022-03-23

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Takehiko TANAKA ,  Yinli FANG

    IPC: H04N5/225 ,  G02B13/02 ,  G02B13/06 ,  G02B27/00 ,  H04M1/02

    Abstract: The present application provides a camera module array, comprising at least two camera modules, wherein at least one of the camera modules has a free-form lens sheet, and the free-form lens sheet performs active alignment according to an actual imaging result received by a photosensitive chip, so that a difference between an actual reference direction of the free-form lens sheet and a reference direction determined by an optical design is not greater than 0.05 degrees. The present application further provides a corresponding assembly method for camera module array. In the present application, a TTL of the camera modules can be reduced by means of the free-form lens sheet so as to, for example, make a TTL of a wide-angle module equal or approximately equal to a TTL of a telephoto module, so that a dual-camera module composed of the wide-angle module and the telephoto module is easily mounted in a terminal device such as a mobile phone. The present application can also effectively improve the mounting precision of the free-form lens sheet.

    ARRAY CAMERA MODULE AND APPLICATION THEREOF
    73.
    发明申请
    ARRAY CAMERA MODULE AND APPLICATION THEREOF 有权

    公开(公告)号：US20220021792A1

    公开(公告)日：2022-01-20

    申请号：US17488876

    申请日：2021-09-29

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA

    IPC: H04N5/225 ,  G01N15/06 ,  G03B17/02 ,  H04M1/02

    Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

    OPTICAL LENS, CAMERA MODULE AND ASSEMBLING METHOD
    74.
    发明申请
    OPTICAL LENS, CAMERA MODULE AND ASSEMBLING METHOD 有权

    公开(公告)号：US20210333503A1

    公开(公告)日：2021-10-28

    申请号：US17270213

    申请日：2019-07-17

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Takehiko TANAKA ,  Liefeng CHEN ,  Lin LIU ,  Chunmei LIU

    IPC: G02B7/02

    Abstract: The present application provides an optical lens, comprising: a first lens component, a second lens component and a first glue material. A first lens sheet group of the first lens component and a second lens sheet group of the second lens component together constitutes an imageable optical system, wherein a second lens barrel of the second lens component has an outer top surface and an inner top surface, and the second lens sheet group bears against the inner top surface. The outer top surface comprises a glue spreading surface suitable for arranging the first glue material and an extension surface formed by extending from the glue spreading surface to a central axis of the second lens barrel, there is a first thickness from the glue spreading surface to the inner top surface, there is a second thickness from the extension surface to the inner top surface, and the first thickness is greater than the second thickness. The present application further provides a corresponding camera module and an assembling method. The present application can improve the mechanical strength and reliability of the black object of the second lens component, can improve the yield of the optical lens or the camera module, and contributes to the miniaturization of the camera module.

    CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY THEREOF, ARRAY CAMERA MODULE AND ELECTRONIC DEVICE
    76.
    发明申请
    CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY THEREOF, ARRAY CAMERA MODULE AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20210167105A1

    公开(公告)日：2021-06-03

    申请号：US16613571

    申请日：2018-05-18

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Takehiko TANAKA ,  Jingfei HE ,  Zhen HUANG ,  Zhongyu LUAN ,  Feifan CHEN

    IPC: H01L27/146 ,  H04N5/225 ,  H04M1/02 ,  H05K1/18

    Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.

    ARRAY CAMERA MODULE AND APPLICATION THEREOF
    77.
    发明申请
    ARRAY CAMERA MODULE AND APPLICATION THEREOF 审中-公开

    公开(公告)号：US20200382683A1

    公开(公告)日：2020-12-03

    申请号：US16472425

    申请日：2017-12-25

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA

    IPC: H04N5/225 ,  G01N15/06 ,  G03B17/02 ,  H04M1/02

    Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

    MANUFACTURE OF SEMICONDUCTOR MODULE WITH DUAL MOLDING
    78.
    发明申请
    MANUFACTURE OF SEMICONDUCTOR MODULE WITH DUAL MOLDING 审中-公开

    公开(公告)号：US20200321381A1

    公开(公告)日：2020-10-08

    申请号：US16909290

    申请日：2020-06-23

    Applicant: Ningbo Sunny Opotech Co., Ltd.

    Inventor： Mingzhu WANG ,  Nan GUO ,  Zhenyu CHEN ,  Bojie ZHAO ,  Takehiko TANAKA ,  Feifan CHEN ,  Ye WU

    IPC: H01L27/146 ,  H01L31/0203

    Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

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