公开(公告)号：US06401542B1

公开(公告)日：2002-06-11

申请号：US09614211

申请日：2000-07-11

申请人： Hajime Kato

发明人： Hajime Kato

IPC分类号： G01L906

CPC分类号： G01L19/148 ,  G01L19/0038 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A down-sized pressure sensing semiconductor device with improved EMI tolerance as compared with conventional ones is achieved. A metal substrate (11) has a through hole (12), in which a cylinder (9b) of a pressure leading-in tube (9) is inserted, and is fixed to a flange (9a) of the pressure leading-in tube (9). A control circuit component (13) for controlling a semiconductor chip (1) is disposed on the metal substrate (11). On the metal substrate (11), a connector electrode (14) is further provided which establishes electrical connections between the pressure sensing semiconductor device and external circuits. Further, a metal cover (17) in the shape of a connector leading to external circuits is soldered to the metal substrate (11) to cover the semiconductor chip (1) and the control circuit component (13) together with the metal substrate (11). The cover (17) is electrically connected to a conductive wire (e.g., a ground wire) formed on the metal substrate (11).

摘要翻译： 实现了与传统半导体器件相比具有改善的EMI容差的小型压力感测半导体器件。 金属基板（11）具有通孔（12），其中插入有压力导入管（9）的圆筒（9b），并且被固定到压力导入管的凸缘（9a） （9）。 用于控制半导体芯片（1）的控制电路部件（13）设置在金属基板（11）上。 在金属基板（11）上，还设有连接器电极（14），其在压力感测半导体器件和外部电路之间建立电连接。 此外，将通向外部电路的连接器形状的金属盖（17）焊接到金属基板（11）以与金属基板（11）一起覆盖半导体芯片（1）和控制电路部件（13） ）。 盖（17）电连接到形成在金属基板（11）上的导线（例如接地线）。

公开(公告)号：US5773881A

公开(公告)日：1998-06-30

申请号：US751699

申请日：1996-11-18

申请人： Hajime Kato

发明人： Hajime Kato

IPC分类号： G01P15/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/12 ,  H01L23/02 ,  H01L23/48

CPC分类号： G01P15/123 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105

摘要： An impact load effected on the single body of an acceleration sensor device is absorbed with a relatively simple construction, thereby protecting a semiconductor sensor element provided in the sensor. The acceleration sensor device comprises a semiconductor sensor element 2 which can sense an acceleration in a direction perpendicular to its principal plane, a base plate 3 which supports the sensor element 2, a package 11 which supports the base plate 3 and encloses the base plate 3 and the sensor element 2, a frame 12 which has a plurality of leg sections 12d protruding from a bottom plane of the package 11 and is fixed on the package 11, and a cap-shaped resin cover 13 which has a roof section 13a opposite to an upper surface of the package 11 or the frame 12 and covers the package 11 from above as fixed on the package 11, and a side wall section 13b of the cover 13 extends at least to a position corresponding to a place where the sensor element 2 is arranged.

摘要翻译： 通过相对简单的结构吸收对加速度传感器装置的单体产生的冲击载荷，从而保护设置在传感器中的半导体传感器元件。 加速度传感器装置包括可以感测与其主平面垂直的方向的加速度的半导体传感器元件2，支撑传感器元件2的基板3，支撑基板3并包围基板3的封装11 和传感器元件2，具有从包装11的底面突出并固定在包装11上的多个脚部12d的框架12和具有与第一包装11相对的顶部部分13a的帽状树脂罩13 包装11或框架12的上表面，并且从固定在包装11上的上方覆盖包装11，并且盖13的侧壁部分13b至少延伸到与传感器元件2 被安排。

公开(公告)号：US5693884A

公开(公告)日：1997-12-02

申请号：US680026

申请日：1996-07-15

申请人： Hajime Kato

发明人： Hajime Kato

IPC分类号： G01P1/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/12 ,  H01L29/84

CPC分类号： G01P1/003 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0828

摘要： A semiconductor acceleration sensor includes a substrate, a semiconductor sensor chip with a diaphragm and having one end fixed to a pedestal, the pedestal including at least one thick film layer and disposed on the substrate, and a protrusion of at least one thick film layer on the substrate directly opposite a free end of the sensor chip, shorter than the pedestal. The protrusion protects the semiconductor sensor chip from breakage at the diaphragm due to impacts.

摘要翻译： 一种半导体加速度传感器，包括：基板，具有隔膜的半导体传感器芯片，其一端固定在基座上，所述基座包括至少一个厚膜层，并且设置在所述基板上;以及至少一个厚膜层的突出部， 基板直接与传感器芯片的自由端相对，比基座短。 该凸起保护半导体传感器芯片免受因隔膜而产生的冲击。

公开(公告)号：US4131474A

公开(公告)日：1978-12-26

申请号：US804731

申请日：1977-06-08

申请人： Hiroshi Uchikawa ,  Hajime Kato

发明人： Hiroshi Uchikawa ,  Hajime Kato

IPC分类号： B22C1/16 ,  C04B7/32 ,  C04B28/06 ,  B28B7/34

CPC分类号： B22C1/167 ,  C04B28/065 ,  C04B7/323

摘要： This invention relates to mixtures of molding sand which comprise a mixture of a molding sand with a rapid hardening cement containing calcium aluminate as amorphous glass and/or crystals, and/or calcium haloaluminate, a polymer water holding agent and a lime, or mixture of a molding sand with the above-mentioned rapid hardening cement, a polymer water reducing agent, a lime, and, if necessary, a foaming agent, and in either case with water. The mixture also provides a method of mixing the ingredients except for water and then kneading the mixture with water.

摘要翻译： 本发明涉及型砂混合物，其包括型砂与含有铝酸钙作为无定形玻璃和/或晶体的快速硬化水泥和/或卤化铝酸钙，聚合物保水剂和石灰的混合物或混合物 具有上述快速硬化水泥的成型砂，聚合物减水剂，石灰，以及必要时的发泡剂，并且在任一情况下都具有水。 该混合物还提供了除水以外的成分混合，然后将混合物与水混合的方法。

公开(公告)号：US4051303A

公开(公告)日：1977-09-27

申请号：US596798

申请日：1975-07-17

申请人： Takao Hayashi ,  Hajime Kato

发明人： Takao Hayashi ,  Hajime Kato

IPC分类号： B41M5/155 ,  B41M5/22

CPC分类号： B41M5/155 ,  Y10S428/913 ,  Y10S428/914

摘要： A recording sheet comprising a support having thereon a color developer layer containing (1) a metal compound of an aromatic carboxylic acid and (2) at least one of gelatin or a gelatin derivative, the metal compound of an aromatic carboxylic acid being capable of forming a colored image when reacted with a color former.

公开(公告)号：US3954489A

公开(公告)日：1976-05-04

申请号：US444650

申请日：1974-02-21

申请人： Hiroshi Uchikawa ,  Hajime Kato

发明人： Hiroshi Uchikawa ,  Hajime Kato

IPC分类号： C04B22/06 ,  C04B7/345 ,  C04B22/00 ,  C04B22/08 ,  C04B28/06 ,  C04B7/02 ,  C04B7/35

CPC分类号： C04B28/065 ,  C04B22/0013

摘要： This invention relates to a method for retarding the setting time of rapid hardening cement which comprises adding a boric compound to cement manufactured by adding insoluble anhydrite to clinker powder containing 11CaO.7Al.sub.2 O.sub.3.CaX.sub.2 or adding the clinker to insoluble anhydrite and intergrinding the mixture, and a method for still more retarding the setting time of rapid hardening cement which comprises adding a boric compound to cement containing a set-retarding agent other than the boric compound.

摘要翻译： 本发明涉及一种延缓快速硬化水泥凝固时间的方法，该方法包括向通过向含有11CaO.7Al2O3.CaX2的熟料中加入不溶性无水石膏制成的水泥加入硼化合物，或将熟料加入不溶性无水石膏中并研磨混合物， 一种用于进一步延缓快速硬化水泥凝固时间的方法，该方法包括向含有硼化合物以外的阻凝剂的水泥中加入硼化合物。

公开(公告)号：US09040845B2

公开(公告)日：2015-05-26

申请号：US13993404

申请日：2011-12-27

申请人： Hajime Kato ,  Masahiro Tanaka

发明人： Hajime Kato ,  Masahiro Tanaka

IPC分类号： H01R13/648 ,  H02G3/04 ,  H02G15/02 ,  H05K9/00 ,  H01R13/52 ,  H01R13/6599 ,  B60R16/02

CPC分类号： H02G3/04 ,  B60R16/0215 ,  H01R13/5208 ,  H01R13/6599 ,  H02G15/02 ,  H05K9/0007 ,  H05K9/0018

摘要： A shielding structure for a wire harness includes a seal member which has a wire through hole that allows the wire to pass therethrough while sealing a circumference of the wire. The wire has a structure where an insulating resin layer is formed on an outer circumference of a conductor, and a predetermined range in a length direction of the conductor is coated with a shield layer formed by resin plating to cover an outer circumferential surface of the insulating resin layer. A terminal portion of the wire is passed through the wire through hole of the seal member to be introduced into the shield wall to a position where the shield layer exists, whereby an inner circumference of the wire through hole is made in close contact with the shield layer to cause the shield layer and the seal member to be electrically conducted with each other.

公开(公告)号：US08894449B2

公开(公告)日：2014-11-25

申请号：US13498401

申请日：2010-07-27

申请人： Mitsuhiro Matsumoto ,  Hajime Kato ,  Tatsuya Goto

发明人： Mitsuhiro Matsumoto ,  Hajime Kato ,  Tatsuya Goto

IPC分类号： H01R4/30 ,  H01R9/24 ,  H01R4/34 ,  H01R11/12

CPC分类号： H01R9/24 ,  H01R4/34 ,  H01R11/12

摘要： [Problem] To provide a compact terminal block.[Means for solving problem]A terminal block 1 includes: a terminal block main body 2 on which a plurality of seating surfaces 13 are provided; a plurality of fixing members 3 penetrating first and second connection terminals and fixing the first and second connection terminals to the seating surfaces 13 in a manner that the first connection terminals are connected to electronic devices, and the second connection terminals 8 to be electrically connected to the first connection terminals are overlapped with the seating surfaces 13. The seating surfaces 13 are sloped relative to a direction W that the first and second connection terminals are arranged.

摘要翻译： [问题]提供紧凑型端子块。 [解决问题的方案]接线端子1包括：端子台主体2，其上设置有多个座表面13; 多个固定构件3，穿过第一和第二连接端子，并将第一和第二连接端子以第一连接端子连接到电子设备的方式固定到座表面13，并且第二连接端子8电连接到 第一连接端子与座表面13重叠。就座表面13相对于布置第一和第二连接端子的方向W倾斜。

公开(公告)号：US08808026B2

公开(公告)日：2014-08-19

申请号：US13257238

申请日：2010-04-22

申请人： Yasuhiro Yamaguchi ,  Mitsuhiro Matsumoto ,  Sachiko Yagome ,  Hajime Kato

发明人： Yasuhiro Yamaguchi ,  Mitsuhiro Matsumoto ,  Sachiko Yagome ,  Hajime Kato

IPC分类号： H01R13/73

CPC分类号： H01R13/5219 ,  H01R13/5202 ,  H01R24/66 ,  H01R24/76 ,  H01R2201/26

摘要： A waterproof structure, which is for one connector fixed to a mounting hole of an automotive motor's metallic case and another connector fixed to a mounting hole of an automotive inverter's metallic case and connected to the one connector, comprises ring-shaped first and second packings. The first packing resides between the one case's surface and the one connector's surface that are orthogonal to a fitting direction of the connectors such that the one case's mounting hole is surrounded thereby to provide waterproof interface between the one case and the one connector. The second packing resides between the other case's surface and the other connector's surface that are parallel to the fitting direction. The second packing extends on an outer circumferential surface of the other connector to provide waterproof interface between an inner circumferential surface of the other case's mounting hole and the other connector's outer circumferential surface.

摘要翻译： 固定在汽车电动机金属壳体的安装孔上的一个连接器和固定于汽车逆变器的金属壳体的安装孔并连接到一个连接器的另一个连接器的防水结构包括环形的第一和第二密封件。 第一填料位于一个壳体表面和一个连接器表面之间，其与连接器的装配方向正交，使得一个壳体的安装孔被围绕，从而在一个壳体和一个连接器之间提供防水接口。 第二个包装位于另一个壳体的表面和另一个连接器的表面之间，该表面与配合方向平行。 第二包装在另一连接器的外周面上延伸，以在另一个壳体的安装孔的内周面与另一个连接器的外周面之间提供防水接口。

公开(公告)号：US08678842B2

公开(公告)日：2014-03-25

申请号：US13813070

申请日：2011-07-22

申请人： Hideomi Adachi ,  Hidehiko Kuboshima ,  Hajime Kato

发明人： Hideomi Adachi ,  Hidehiko Kuboshima ,  Hajime Kato

IPC分类号： H01R13/15

CPC分类号： H01R13/46 ,  H01R13/4361 ,  H01R13/512 ,  H01R13/639 ,  H01R24/62 ,  H01R2107/00

摘要： A terminal connection structure 1 includes first terminal fittings 5 connected to a motor 7, second terminal fittings 22 connected to an inverter, and a clip terminal. The first terminal fittings 5 and the second terminal fittings 22 respectively includes electrical contact portions 8 and 27 formed in a band plate shape and superimposed on each other. The clip terminal is caused to approach the electrical contact portions 8 and 27 along a crossing direction with respect to the longitudinal direction of the electrical contact portions 8 and 27 superimposed on each other, and sandwiches the electrical contact portions 8 and 27 superimposed on each other, between a pair of the contact pieces 35.

摘要翻译： 端子连接结构1包括连接到电动机7的第一端子配件5，连接到逆变器的第二端子接头22和夹子端子。 第一端子配件5和第二端子配件22分别包括形成为带状并且彼此重叠的电接触部分8和27。 使夹子端子相对于彼此重叠的电接触部分8和27的纵向的交叉方向接近电接触部分8和27，并且夹在彼此重叠的电接触部分8和27 在一对接触片35之间。