Electronic Package Device and Fabrication Method Thereof, Method for Testing Electronic Package Device
    71.
    发明申请
    Electronic Package Device and Fabrication Method Thereof, Method for Testing Electronic Package Device 有权
    电子封装器件及其制造方法,电子封装器件测试方法

    公开(公告)号:US20160056381A1

    公开(公告)日:2016-02-25

    申请号:US14646138

    申请日:2014-10-21

    Inventor: Dan Wang

    Abstract: Embodiments of the disclosure provide an electronic package device and a fabrication method thereof, and a method for testing the electronic package device. The electronic package device comprises a base substrate and a package substrate that are provided opposite to each other, and a sealant provided therebetween. The electronic package device further comprises an electronic function layer provided on a side of the base substrate facing the package substrate, and a laminated film layer and a test lead provided on a side of the package substrate facing the base substrate. The laminated film layer comprises a hygroscopic film adjacent to the package substrate and a piezoelectric film coating surfaces of the hygroscopic film. The piezoelectric film contacts one end of the test lead, and the other end of the test lead passes through the sealant and extends to an exterior of the electronic package device.

    Abstract translation: 本公开的实施例提供一种电子封装器件及其制造方法,以及用于测试电子封装器件的方法。 电子封装装置包括彼此相对设置的基底基板和封装基板,以及设置在其间的密封剂。 所述电子封装装置还包括设置在所述基板的面向所述封装基板的一侧上的电子功能层,以及设置在所述封装基板的面向所述基板的一侧的层叠膜层和测试引线。 层压膜层包括与封装基板相邻的吸湿膜和吸湿膜的压电膜涂覆表面。 压电膜接触测试引线的一端,测试引线的另一端通过密封剂并延伸到电子封装器件的外部。

    Display panel packaging structure
    72.
    发明授权
    Display panel packaging structure 有权
    显示面板封装结构

    公开(公告)号:US09045273B2

    公开(公告)日:2015-06-02

    申请号:US14164629

    申请日:2014-01-27

    CPC classification number: B65D81/056

    Abstract: A display panel packaging structure is provided to avoid damage of the display panel during transportation. The display panel packaging structure includes a box and a cover covering the box. The box is adapted to receive a display panel and the box is provided with at least a stopper therein adapted to abut against a side surface of the display panel.

    Abstract translation: 提供显示面板包装结构,以避免运输过程中显示面板的损坏。 显示面板包装结构包括一个盒子和一个覆盖盒子的盖子。 盒子适于接收显示面板,并且盒子中设置有至少一个止挡件,其适于抵靠显示面板的侧表面。

    OLED display substrate and display apparatus

    公开(公告)号:US12178062B2

    公开(公告)日:2024-12-24

    申请号:US17260563

    申请日:2020-04-09

    Abstract: An OLED display substrate includes a base substrate with a display region arranged thereon. First, second and third sub-pixels are arranged in the display region. A first electrode layer, a pixel defining layer, a second electrode layer, and organic functional layers are arranged in the display region. The organic functional layers include first, second and third light-emitting layers. The first light-emitting layer covers the display region and is an integral structure. The second and third light-emitting layers are arranged on a side of the first light-emitting layer towards the second electrode layer. An orthographic projection of each sub light-emitting layer of the second and third light-emitting layers on the base substrate completely covers an orthographic projection of an opening of the pixel defining layer on the base substrate, and does not overlap with orthographic projections of other openings of the pixel defining layer on the base substrate.

    OLED device with lowered carrier-transporting capability and method for manufacturing the same

    公开(公告)号:US10741623B2

    公开(公告)日:2020-08-11

    申请号:US15855248

    申请日:2017-12-27

    Inventor: Dan Wang Na Li

    Abstract: The present disclosure relates to a method of manufacturing an OLED device, an OLED device and a display panel. The method comprises: forming a first electrode layer over a substrate; forming a pixel define layer over the first electrode layer, the pixel define layer having a plurality of openings each corresponding to a light emitting region of each sub-pixel unit; performing a roughening process over a surface of the pixel define layer apart away from the first electrode layer; forming a hole injection layer covering the pixel define layer and the openings; and forming a hole transport layer, a light emitting layer, an electron transport layer and a second electrode layer in sequence over the hole injection layer at regions corresponding to the openings.

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