公开(公告)号：US11194362B2

公开(公告)日：2021-12-07

申请号：US16994299

申请日：2020-08-14

Applicant: Apple Inc.

Inventor： Scott Myers ,  Matthew Theobald ,  Richard Heley ,  Adam Stagnaro ,  Richard Hung Minh Dinh ,  David Pakula ,  Tang Yew Tan

IPC: G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  H05K5/02 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

公开(公告)号：US20210274671A1

公开(公告)日：2021-09-02

申请号：US17325639

申请日：2021-05-20

Applicant: Apple Inc.

Inventor： David Pakula ,  Stephen Brian Lynch ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  Lee Hua Tan

IPC: H05K5/03 ,  H04M1/02 ,  G06F1/16 ,  A45C11/00 ,  A45F5/00 ,  G06F3/041 ,  H05K5/00

Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

公开(公告)号：USD926766S1

公开(公告)日：2021-08-03

申请号：US29746916

申请日：2020-08-18

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  M. Evans Hankey ,  Julian Hoenig ,  Lee E. Hooton ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  David A. Pakula ,  Michael D. Quinones ,  Marwan Rammah ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US20200249724A1

公开(公告)日：2020-08-06

申请号：US16854795

申请日：2020-04-21

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Mattia Pascolini ,  Richard Hung Minh Dinh ,  Trent Weber ,  Robert Schlub ,  Josh Nickel ,  Robert Hill ,  Nanbo Jin ,  Tang Yew Tan

IPC: G06F1/16 ,  H05K5/02 ,  H01Q1/42 ,  H04M1/02 ,  H01Q1/24 ,  H01Q1/22 ,  H05K5/03

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

公开(公告)号：US20200021012A1

公开(公告)日：2020-01-16

申请号：US16450863

申请日：2019-06-24

Applicant: Apple Inc.

Inventor： Phillip M. Hobson ,  Stephen P. Zadesky ,  Erik L. Wang ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  Adam D. Mittleman ,  Kenneth A. Jenks ,  Robert J. Hill ,  Robert W. Schlub

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q9/42 ,  H01Q13/10 ,  H01Q21/28 ,  H01Q5/371 ,  H01Q5/40 ,  H01Q1/50

Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

公开(公告)号：US10521065B2

公开(公告)日：2019-12-31

申请号：US15275254

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Steven P. Hotelling ,  Brian R. Land ,  Mark Arthur Hamblin ,  Tang Yew Tan

IPC: G06F3/044 ,  B32B7/12 ,  G02F1/1333 ,  G06F3/041 ,  B32B37/12 ,  G02F1/1335

Abstract: A multi-touch sensor panel is disclosed that can include a glass subassembly having a plurality of column traces of substantially transparent conductive material that can be formed on the back side, wherein the glass subassembly can also act as a cover that can be touched on the front side. Row traces of the same or different substantially transparent conductive material can then be located near the column traces, and a layer of dielectric material can be coupled between the column traces and the row traces. The row and column traces can be oriented to cross over each other at crossover locations separated by the dielectric material, and the crossover locations can form mutual capacitance sensors for detecting one or more touches on the front side of the glass subassembly.

公开(公告)号：USD856337S1

公开(公告)日：2019-08-13

申请号：US29612838

申请日：2017-08-04

Applicant: Apple Inc.

Designer： Jody Akana ,  Molly Anderson ,  Bartley K. Andre ,  Shota Aoyagi ,  Anthony Michael Ashcroft ,  Marine C. Bataille ,  Jeremy Bataillou ,  Daniele De Iuliis ,  Markus Diebel ,  M. Evans Hankey ,  Julian Hoenig ,  Lee E. Hooton ,  Richard P. Howarth ,  Jonathan P. Ive ,  Julian Jaede ,  Daniel W. Jarvis ,  Duncan Robert Kerr ,  Robert F. Meyer ,  David A. Pakula ,  Michael D. Quinones ,  Marwan Rammah ,  Peter Russell-Clarke ,  Benjamin Andrew Shaffer ,  Mikael Silvanto ,  Christopher J. Stringer ,  Joe Sung Ho Tan ,  Tang Yew Tan ,  Clement Tissandier ,  Eugene Antony Whang ,  Rico Zörkendörfer

公开(公告)号：US10334745B2

公开(公告)日：2019-06-25

申请号：US15821301

申请日：2017-11-22

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Mattia Pascolini ,  Richard Hung Minh Dinh ,  Trent Weber ,  Robert Schlub ,  Josh Nickel ,  Robert Hill ,  Nanbo Jin ,  Tang Yew Tan

IPC: H01Q1/24 ,  H01Q1/42 ,  H05K5/02

Abstract: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.

公开(公告)号：US10303219B2

公开(公告)日：2019-05-28

申请号：US15892310

申请日：2018-02-08

Applicant: Apple Inc.

Inventor： Scott A. Myers ,  Matthew Theobald ,  Richard Heley ,  Adam Stagnaro ,  Richard Hung Minh Dinh ,  David A. Pakula ,  Tang Yew Tan

IPC: G06F1/16 ,  H04M1/02 ,  H05K5/03 ,  H05K5/02 ,  H01Q1/22 ,  H01Q1/24

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assembles can include a window through which display circuitry can provide content to a user of the device.

公开(公告)号：US10277722B2

公开(公告)日：2019-04-30

申请号：US15275161

申请日：2016-09-23

Applicant: Apple Inc.

Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

IPC: H04M1/00 ,  H04B1/38 ,  H04M1/02 ,  H05K5/02 ,  H05K1/02 ,  H05K7/14

Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.