Ceramic electronic component and method of manufacturing the same

    公开(公告)号:US11699553B2

    公开(公告)日:2023-07-11

    申请号:US17325110

    申请日:2021-05-19

    摘要: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

    ACOUSTIC WAVE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER

    公开(公告)号:US20230208395A1

    公开(公告)日:2023-06-29

    申请号:US17991259

    申请日:2022-11-21

    摘要: An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.

    FILTER, MULTIPLEXER, AND COMMUNICATION MODULE

    公开(公告)号:US20230208377A1

    公开(公告)日:2023-06-29

    申请号:US18076936

    申请日:2022-12-07

    发明人: Toshiyuki SAITO

    IPC分类号: H03H7/01 H03H7/46 H01F27/28

    摘要: A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    74.
    发明公开

    公开(公告)号:US20230207219A1

    公开(公告)日:2023-06-29

    申请号:US18076291

    申请日:2022-12-06

    发明人: Maiko YAMANE

    摘要: A ceramic electronic component includes a multilayer body in which internal electrodes are stacked in a first axis direction, the multilayer body having side faces perpendicular to a second axis direction that is orthogonal to the first axis direction, ends of the internal electrodes being positioned at the side faces and aligned within a range of 0.5 μm in the second axis direction; and side margin portions covering the side faces, respectively, the side margin portions including a ceramic polycrystal as a main component and glass grains dispersed in the polycrystal, a total volume ratio of the glass grains with respect to the polycrystal being 1% or more and 20% or less, a median diameter of the glass grains is 0.20 μm or more and less than 0.75 μm, and is 90% or more of a median diameter of crystal grains constituting the polycrystal.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, CIRCUIT BOARD, AND PACKAGE

    公开(公告)号:US20230187132A1

    公开(公告)日:2023-06-15

    申请号:US17988922

    申请日:2022-11-17

    摘要: A circuit board includes a multilayer ceramic electronic component; and a mounting board mounting the multilayer ceramic electronic component thereon, wherein the multilayer ceramic electronic component comprises: a ceramic main body having a dimension in the first axis direction of the ceramic main body of 0.1 mm or more, and a ratio of a dimension in the second axis direction of the ceramic main body to the dimension in the first axis direction of 130 or more, a plurality of internal electrodes laminated inside the ceramic main body in the first axis direction, and both edges of the plurality of internal electrodes in the second axis direction being aligned with each other within 0.5 μm in the second axis direction, and external electrodes respectively covering the end surfaces, and wherein the mounting board faces the second principal surface of the multilayer ceramic electronic component mounted thereon.

    PIEZOELECTRIC THIN FILM RESONATOR AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230172071A1

    公开(公告)日:2023-06-01

    申请号:US17987216

    申请日:2022-11-15

    发明人: Yuta TSUDA

    摘要: A piezoelectric thin film resonator includes a substrate, a lower electrode provided over the substrate, a piezoelectric layer provided on the lower electrode, an upper electrode provided on the piezoelectric layer, the lower electrode and the upper electrode sandwiching at least a part of the piezoelectric layer therebetween to form a resonance region, and an acoustic mirror provided between the substrate and the lower electrode, the acoustic mirror including one or more first layers and second layers that are alternately stacked, each of the one or more first layers having an end face inclined such that a first surface at the lower electrode side is larger than a second surface at the substrate side and having an edge positioned outside the resonance region in a plan view, the second layers being made of a material different from a material of the one or more first layers.

    Multi-layer ceramic electronic component

    公开(公告)号:US11664167B2

    公开(公告)日:2023-05-30

    申请号:US17104682

    申请日:2020-11-25

    发明人: Yoichi Kato

    摘要: A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.

    CERAMIC ELECTRONIC DEVICE
    78.
    发明申请

    公开(公告)号:US20230128407A1

    公开(公告)日:2023-04-27

    申请号:US17944567

    申请日:2022-09-14

    发明人: Hidetoshi MASUDA

    IPC分类号: H01G4/008 H01G4/30 H01G4/12

    摘要: A ceramic electronic device includes a multilayer body in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. In at least a part of a cover layer and side margins, a concentration of a specific metal of at least one of Ag, As, Au, Bi, Co, Cr, Cu, Fe, Ge, In, Ir, Mo, Os, Pd, Pt, Re, Rh, Ru, Se, Sn, Te, W or Zn is lower on an outer side than on a side of the multilayer body.

    Multi-layer ceramic electronic component and method of producing the same

    公开(公告)号:US11631543B2

    公开(公告)日:2023-04-18

    申请号:US17498558

    申请日:2021-10-11

    摘要: A multi-layer ceramic electronic component includes a ceramic body and an external electrode, the ceramic body including a protective portion and a functional portion, the protective portion including an end surface facing in a first direction, circumferential surfaces connected to the end surface and extending in the first direction, and a ridge that includes a recess extending along the first direction and connects the circumferential surfaces, the functional portion being disposed inside the protective portion, the external electrode including a base film covering the end surface, an intermediate film formed on the base film, and a surface film formed on the intermediate film, the base film including a first covering portion formed on the end surface, second covering portions formed on the circumferential surfaces, and a third covering portion formed on the recess and spaced apart from at least one second covering portion, the intermediate film continuously covering the first, second, and third covering portions.