Coating surfaces with nanostructures

    公开(公告)号:US11414761B2

    公开(公告)日:2022-08-16

    申请号:US15349072

    申请日:2016-11-11

    摘要: At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution.

    Charge balancing circuit, stimulator circuit and method for charge balancing

    公开(公告)号:US11235147B2

    公开(公告)日:2022-02-01

    申请号:US16217432

    申请日:2018-12-12

    IPC分类号: A61N1/08 A61N1/02 A61N1/37

    摘要: A charge balancing circuit is adapted to be connected to an electrode and to a stimulation source. The charge balancing circuit has an electrode terminal for receiving an electrode voltage, an amplifier coupled to the electrode terminal and adapted to amplify and invert the electrode voltage for generating an intermediate voltage and a compensation stage. The compensation stage is adapted to generate an output current if the electrode voltage lies outside a specified safety range and to generate the output current depending on the intermediate voltage. The compensation stage is further adapted to supply the output current to the electrode terminal for driving the electrode voltage towards and/or into the safety range.

    Implantable Electrical Connecting Device

    公开(公告)号:US20210274654A1

    公开(公告)日:2021-09-02

    申请号:US17325695

    申请日:2021-05-20

    摘要: An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

    Implantable Electrical Connector Arrangment And Implantable Electrode Arrangment

    公开(公告)号:US20210268292A1

    公开(公告)日:2021-09-02

    申请号:US17323473

    申请日:2021-05-18

    摘要: An implantable electrical connector arrangement electrically connects a first electrical component and a second electrical component. The connector arrangement includes a first connector having a first terminal and a first coupling electrode connected to the first terminal and a second connector having a second terminal and a second coupling electrode connected to the second terminal. The first connector and the second connector are connectable to each other such that the first terminal and the second terminal are capacitively connectable via the first coupling electrode and the second coupling electrode in a connected state. A defined separation gap is formed between the first coupling electrode and the second coupling electrode in the connected state.