公开(公告)号：US20040049874A1

公开(公告)日：2004-03-18

申请号：US10243473

申请日：2002-09-13

发明人： Eric P. Velasquez ,  Jason Ronnie P. Ribunal

IPC分类号： B05C001/00

CPC分类号： H05K3/1233 ,  B41F15/44 ,  B41L13/06 ,  H05K2203/0139

摘要： Apparatus and methods for applying solder paste to circuits, such as integrated circuits, are disclosed. The apparatus and methods comprise a squeegee blade having a pair of elongated face sides spaced apart by a selected thickness and a corresponding pair of elongated substantially parallel narrow sides spaced apart by a selected width. The elongated face sides and elongated narrow sides join together to form squeegee operating edges. The squeegee blade is free of mounting aperture as to provide four operating edges. The squeegee blade is mounted to a resilient clamping structure which applies a regular and controlled gripping force so as to avoid deformation of the squeegee blade edge due to excessive mounting force. The plurality of fasteners are received by the clamping structure for adjusting the gripping force to the squeegee blade.

公开(公告)号：US20040045458A1

公开(公告)日：2004-03-11

申请号：US10236108

申请日：2002-09-06

发明人： Gerald Pham-Van-Diep ,  Frank Andres

IPC分类号： B41L013/18

CPC分类号： H05K3/1233 ,  B41L13/02 ,  H05K2203/0285 ,  H05K2203/0292

摘要： An apparatus and method for depositing material on a surface of an electronic substrate includes a frame, a substrate support coupled to the frame to support the electronic substrate, a stencil coupled to the frame having at least one aperture to receive a material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of material on the substrates, and a vibration system, coupled to one of the stencil, the frame and the substrate support, and coupled to the controller, that introduces a vibration to the stencil, wherein the vibration has a frequency controlled by the controller based on characteristics of at least one of the material, the stencil and the electronic substrate. Release of material from the apertures is accomplished while the vibration is applied to the stencil.

摘要翻译： 用于在电子基板的表面上沉积材料的装置和方法包括框架，耦合到框架以支撑电子基板的基板支撑件，耦合到框架的模板具有至少一个孔以接收要沉积的材料 电子基板的表面上的孔径，控制基板上的材料分配的控制器和耦合到模板，框架和基板支撑件之一并耦合到控制器的振动系统，其引入振动 其中所述振动具有基于所述材料，所述模板和所述电子基板中的至少一个的特性由所述控制器控制的频率。 当将振动施加到模板时，实现从孔中释放材料。

公开(公告)号：US06698347B2

公开(公告)日：2004-03-02

申请号：US10006973

申请日：2001-12-04

申请人： Seiichi Miyahara ,  Kimiyuki Yamasaki ,  Takahiro Fukagawa ,  Kunihiko Tokita

发明人： Seiichi Miyahara ,  Kimiyuki Yamasaki ,  Takahiro Fukagawa ,  Kunihiko Tokita

IPC分类号： B41L1318

CPC分类号： H05K3/1233 ,  B41F15/42 ,  B41P2215/132 ,  H05K2203/0126

摘要： Cream solder stored in a squeegee head is pressurized by a pressurizing plate, and the squeegee head is slid on a mask plate, so that the cream solder is printed onto a substrate via pattern apertures. This is done by a screen printing apparatus, in which pressurized solder is accommodated, and the solder is brought into contact with a surface of the mask plate via an opening formed on a lower face of the cell. A rectifier is disposed in the cell for blocking the cream solder from flowing into a specific area just above the opening. This structure allows the solder to flow into the opening in a slant direction, and causes the solder to roll. This mechanism prevents the solder from being hardened due to staying stagnant just above the opening, and thus prevents defective printings.

摘要翻译： 储存在刮板头中的奶油焊膏通过加压板加压，并且刮板头在掩模板上滑动，使得膏状焊料通过图案孔印刷到基底上。 这是通过容纳加压焊料的丝网印刷装置完成的，并且焊料通过形成在电池的下表面上的开口与掩模板的表面接触。 整流器设置在电池中，用于阻止膏状焊料流入开口正上方的特定区域。 该结构允许焊料沿倾斜方向流入开口，并使焊料滚动。 这种机制防止焊料刚好在开口上方停滞而硬化，从而防止有缺陷的印刷。

公开(公告)号：US06659002B2

公开(公告)日：2003-12-09

申请号：US09999373

申请日：2001-10-31

申请人： Daniel T. Langdon ,  Keith C. O'Neil ,  Kurt A. Smith ,  Randall J. Werner ,  Ralph R. Comulada, Jr.

发明人： Daniel T. Langdon ,  Keith C. O'Neil ,  Kurt A. Smith ,  Randall J. Werner ,  Ralph R. Comulada, Jr.

IPC分类号： B05C1704

CPC分类号： H05K3/1233 ,  B41F15/46 ,  H05K1/0306 ,  H05K2203/0126

摘要： Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

公开(公告)号：US06646662B1

公开(公告)日：2003-11-11

申请号：US09317998

申请日：1999-05-25

申请人： Satoshi Nebashi ,  Takao Nishikawa ,  Tatsuya Shimoda

发明人： Satoshi Nebashi ,  Takao Nishikawa ,  Tatsuya Shimoda

IPC分类号： B41J201

CPC分类号： B41J2/01 ,  B44C1/22 ,  H01L21/31144 ,  H01L21/32139 ,  H05K3/1233 ,  H05K2203/0134 ,  Y10T29/42

摘要： A template 1 is brought close to or in contact with a surface to be patterned 111 and patterns are formed with liquid 62 on the surface 111. This method comprises the steps of: bringing the template 1 close to or essentially in contact with the surface 111, supplying liquid 62 to a plurality of through holes 12 established in the pattern transfer region 10 of the template 1 for supplying the liquid 62, and separating the template 1 from the surface 111 after the liquid 62 is adhered to the surface 111 via the through holes 12.

摘要翻译： 将模板1靠近或与待图案化的表面111接触，并且在表面111上形成有液体62的图案。该方法包括以下步骤：使模板1靠近或基本上与表面111接触 将液体62供给到设置在用于供给液体62的模板1的图案转印区域10中的多个通孔12中，并且在液体62经由通过液体62粘附到表面111之后将模板1与表面111分离。 孔12。

公开(公告)号：US06615715B2

公开(公告)日：2003-09-09

申请号：US09898243

申请日：2001-07-03

申请人： Seikoh Abe ,  Michinori Tomomatsu ,  Seiichi Miyahara ,  Kimiyuki Yamasaki

发明人： Seikoh Abe ,  Michinori Tomomatsu ,  Seiichi Miyahara ,  Kimiyuki Yamasaki

IPC分类号： B05D136

CPC分类号： B41F15/40 ,  B41P2215/132 ,  H05K3/1233 ,  H05K2203/0126

摘要： A squeegee head having a volume-variable container and a printing space is used. The volume-variable container is variable in capacity with pressures applied thereto. The volume-variable container includes a projecting portion having a plurality of projections, a push-plate with a plurality of through-holes formed therein, and a side wall. A paste is stored in the volume-variable container. The projecting portion is pressurized to move and the paste is pushed out into the printing space from the through-holes, and then, the projections are fitted into the through-holes. In this way, the paste being stable in viscosity is completely pushed out into the printing space without wasting at all.

公开(公告)号：US20030033943A1

公开(公告)日：2003-02-20

申请号：US09931753

申请日：2001-08-20

发明人： Takehiko Murakami

IPC分类号： B41L013/04

CPC分类号： H05K3/1233 ,  B41F15/46 ,  H05K2203/0134

摘要： To prevents a displacement of a screen mask accompanying with a movement of a squeegee and an oxidization of a printing agent, a printing agent sweeping drum (1) has closed both end portions, has a supporting shaft (2) inserted to a center portion thereof, has a lower end portion partly opened, is made rotatable with respect to the supporting shaft, oscillates along a moving direction of the squeegee via a movement of the supporting shaft (2), moves downward at a movement starting end position, moves upward at a terminal end position, and rotates at a predetermined angle in an opposite direction at a predetermined timing at the starting end position and the terminal end position, a squeegee (4) inclined at a predetermined angle and moving upward and downward at a predetermined timing being arranged within the printing agent sweeping drum 1, a squeegee (10) and a printing agent extruding plate (11) being attached to a lower end of the squeegee holder (4) and a nitrogen gas (17) being charged into the printing agent sweeping drum (1).

公开(公告)号：US20030011098A1

公开(公告)日：2003-01-16

申请号：US10201416

申请日：2002-07-22

发明人： Charles W. Lewis ,  Jesse Pedigo ,  Joseph Schug

IPC分类号： B28B001/48

CPC分类号： H05K3/1233 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  Y10T29/49165

摘要： Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

摘要翻译： 用于改进电子基板通孔和通孔填充的方法，特别是通过使用通过控制深度钻孔超大非贯穿孔形成的钻孔支座以及使用插入的支撑柱来防止在填充期间底板的松弛。 特别地，通过使用：（1）适于与包括至少两个要填充的通孔的基板一起使用的通孔填充支架，每个通孔具有X密耳的直径，所述支座包括至少一个 通过直径至少为12X密耳的孔的控制深度钻孔形成的凹陷; 和（2）适于与包括要填充的至少一个通孔的基板一起使用的通孔填充支座，所述支座包括：至少一个凹部; 以及定位在所述凹部内的至少一个支撑柱，其中所述支撑柱不是所述支座的组成部分。

公开(公告)号：US06491204B1

公开(公告)日：2002-12-10

申请号：US09721282

申请日：2000-11-22

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B23K100

CPC分类号： H05K3/1233 ,  B23K1/018 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/26 ,  H05K2203/0139

摘要： A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication With a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle. After cleaning, the cleaning solution may be filtered and reused in a closed loop method.

摘要翻译： 用于从印刷电路板模板的底侧清洗焊膏的清洁装置包括其中的清洁溶液容器和可在擦拭位置和清洁溶液容器之间移动的刀片保持器。 刮刀安装在刀架上。 当与要清洁的模板连通时，具有安装在其上的刀片的刀片保持器来回往复运动。 刀片从与模板连通的擦拭位置移动到容器中的清洁溶液中。 气动活塞和旋转致动器提供刮刀的受控运动。 擦拭刮板可以在擦拭期间振动以改善焊膏从模板的去除，并且清洁溶液可能被超声波振动以改善焊膏从擦拭刀片的去除。 擦拭刀片还可以被脉冲成海绵，以在下一个清洁循环之前去除多余的清洁溶液。 清洁后，清洁溶液可以过滤并以闭环方式重复使用。

公开(公告)号：US20020178943A1

公开(公告)日：2002-12-05

申请号：US10199035

申请日：2002-07-22

发明人： Ken Takahashi ,  Naoichi Chikahisa ,  Yousuke Nagasawa ,  Takao Naito ,  Akihiko Wachi ,  Seishiro Yanachi ,  Nobuyasu Nagafuku ,  Nobuyuki Kakishima

IPC分类号： B41M001/12

CPC分类号： B41F15/0818 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2201/09727 ,  H05K2203/0139 ,  H05K2203/0264 ,  H05K2203/0783 ,  H05K2203/163

摘要： A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a, 5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121, 120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area. Upon an occurrence of print standby time during a printing operation, the print standby time is measured, and at a resumption of printing with the print standby canceled, the paste placed on the stencil during the standby time is screen-printed, by moving the squeegee at an adjusted print speed lower than the reference print speed based on a relationship between the print standby time and a print time due to the adjusted print speed after the resumption of printing.

摘要翻译： 一种丝网印刷方法和装置，用于通过移动刮板（5a，5b）将与模板（4）相对应的电路图案印刷到放置在可升降/定位台（2）上的打印物品（1） ），同时将刮刀推入模板上，使得印刷浆料（9）经由模板印刷到制品上。 将刮板提升到推入行程的程度，刮板被推入该冲压行程，此后通过向下移动工件将制品从模板分离开。 板被分为第一和第二区域（121,120），其中模版沿着刮板移动方向的开口尺寸的值小于并且不小于阈值，并且使第一区域上的刮板的速度变慢 比在第二个地区。 在打印操作期间发生打印待机时间时，测量打印待机时间，并且在打印待机状态下恢复打印被取消时，在待机时间期间放置在模板上的粘贴被丝网印刷，通过移动刮板 基于打印待机时间与打印时间之间的关系，该打印速度低于基准打印速度，该打印速度由于打印恢复后的调整打印速度而导致。