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公开(公告)号:US06659851B2
公开(公告)日:2003-12-09
申请号:US10122044
申请日:2002-04-12
IPC分类号: B24B2300
摘要: A fastening device for a polishing paper cloth of a portable polishing machine. The device comprises an attaching portion which can be detachably attached to a base plate of the polishing machine and a fastening device main body for winding the polishing paper cloth thereon to engage therewith. Multiple concave grooves, which are continuous in the winding direction of the polishing paper cloth in parallel, and a cavity portion formed inside are provided. Therefore, by giving flexibility to the main body to allow it to be deformed in many directions, it is possible to prevent a reaction to the operator due to oscillation of the polishing machine generated during the polishing and to improve a discharging function for the polishing waste to the outside by allowing the polishing waste generated during the polishing to easily intrude in the concave grooves. Additionally, during the polishing, the air from the outside is flown through the concave grooves so as to increase the contacts with the outside air, which enables to improve the discharge efficiency of the friction heat generated in the polishing.
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公开(公告)号:US06162117A
公开(公告)日:2000-12-19
申请号:US332419
申请日:1999-06-14
申请人: Quynh M. Vo
发明人: Quynh M. Vo
摘要: A nail buffing tool for use with a powered drill is disclosed, with the buffing tool having a shaft connected to the drill, a hub, a nail contacting layer, and a compressive layer intermediate the nail contacting layer and the hub. The nail contacting layer is on the exterior of the tool, the nail contacting layer comprises abrasive grit, and the hub is connected to the shaft. Preferably, the compressive layer is fabricated from a foamed substance. The thickness of the compressive layer relative to the hub engaging layer is not as fixed, however, in the preferred embodiment of the invention it would probably be thicker than the hub engaging layer. Similarly, the thickness of the compressive layer relative to the diameter of the hub is not as fixed, although in the preferred embodiment of the invention it would be less than the diameter of the hub. In a modified embodiment is an artificial nail buffing tool for use with a powered drill tool having a drill bit having a shaft and a hub connected thereto, with the artificial nail buffing tool having a hub engaging layer, a compressive layer, and a nail contacting layer on the exterior of the buffing tool. The hub engaging layer is intermediate the hub and the compressive layer, and the compressive layer is intermediate the nail contacting layer and the hub engaging layer. The abrasive grit can either be secured to the nail contacting layer by a material or secured directly thereto.
摘要翻译: 公开了一种用于动力钻头的指甲抛光工具,其中抛光工具具有连接到钻头的轴,轮毂,指甲接触层和位于指甲接触层和轮毂之间的压缩层。 指甲接触层位于工具的外部,指甲接触层包括研磨砂粒,并且毂连接到轴。 优选地,压缩层由发泡物质制成。 压缩层相对于毂接合层的厚度不是固定的,然而,在本发明的优选实施例中,它可能比毂接合层更厚。 类似地,压缩层相对于毂的直径的厚度不是固定的,尽管在本发明的优选实施例中,它的厚度将小于毂的直径。 在改进的实施例中,是一种用于具有钻头的动力钻具的人造指甲抛光工具,钻头具有连接到其上的轴和毂,人造指甲抛光工具具有轮毂接合层,压缩层和指甲接触 层在抛光工具的外部。 毂接合层位于轮毂和压缩层的中间,压缩层位于指甲接触层和轮毂接合层之间。 磨料砂砾可以通过材料固定到指甲接触层上或直接固定在其上。
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公开(公告)号:US5827115A
公开(公告)日:1998-10-27
申请号:US684941
申请日:1996-07-19
申请人: Noburu Shimizu
发明人: Noburu Shimizu
CPC分类号: B24D9/00 , B24B37/04 , B24B37/042
摘要: A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a rotary drum provided on a surface thereof with a polishing pad. A stand supports the workpiece to be polished. A controlling device controls reciprocation of the drum and rotation of the workpiece to obtain a relationship: V/.omega.>L in which V represents velocity of reciprocation of the drum reciprocating on the workpiece to polish an entire surface of the workpiece, .omega. represents rotational angular velocity of the workpiece, and L represents a distance from the rotational center of the workpiece to a radially outermost point on the workpiece.
摘要翻译: 用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置包括在其表面上设置有抛光垫的旋转滚筒。 支架支撑待抛光的工件。 控制装置控制滚筒的往复运动和工件的旋转以获得关系:V /ω> Lin其中V表示在工件上往复运动的滚筒的往复运动速度,以抛光工件的整个表面,ω表示旋转角速度 的工件,L表示从工件的旋转中心到工件的径向最外点的距离。
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公开(公告)号:US5735731A
公开(公告)日:1998-04-07
申请号:US606194
申请日:1996-02-23
申请人: Byoung-hun Lee
发明人: Byoung-hun Lee
IPC分类号: B24B37/20 , B24B37/22 , B24D9/00 , H01L21/304 , H01L21/683 , B24B5/00
摘要: An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.
摘要翻译: 用于化学和机械平面化半导体晶片的表面的改进的化学机械抛光(CMP)装置包括用于加载和固定半导体晶片的平坦晶片台,使得待抛光材料的表面,即晶片的表面 面朝上,以及形成在要被抛光的晶片的暴露表面上的高速旋转的圆柱形抛光垫,使得晶片和衬垫的接触点线性移动。 该台被构造成通过真空孔通过真空抽吸来支撑晶片。 圆筒形抛光垫具有用于在其中心传递旋转的旋转轴线和在旋转轴的圆周表面上具有不同硬度的双层抛光垫。
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公开(公告)号:US4777771A
公开(公告)日:1988-10-18
申请号:US15619
申请日:1998-02-17
申请人: Paul Becker , Manfred Brinkmann
发明人: Paul Becker , Manfred Brinkmann
CPC分类号: B24D9/00
摘要: A grinding tool has two bodies each provided with a row of grinding segments and arranged so that the bodies with the grinding segments are movable relative to one another; the grinding segments of one row are offset relative to the grinding segments of the other row so that upon movement of the base bodies relative to one another the rows of the grinding segments are insertable into each other at least over their partial length; the grinding segments are arranged on the supporting segments, the supporting segments are arranged on the grinding segment receivers, which in turn are arranged on the base bodies, and each of the supporting segments with the respective grinding segment carried thereby is releasably fixable in the respective grinding segment receiver in two respective mirror-inverted operative positions.
摘要翻译: 研磨工具具有两个主体,每个主体均设置有一排研磨段,并且布置成使得具有磨削段的本体可相对于彼此移动; 一列的磨削段相对于另一排的研磨段偏移,使得当基体相对于彼此移动时,研磨段的排可以至少在其部分长度上相互插入; 研磨段布置在支撑段上,支撑段布置在研磨段接收器上,磨削段接收器又布置在基体上,并且每个带有相应的研磨段的支撑段可释放地固定在相应的 研磨段接收器在两个相应的镜反转操作位置。
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公开(公告)号:US4196548A
公开(公告)日:1980-04-08
申请号:US895148
申请日:1978-04-10
申请人: Norman G. Hahn
发明人: Norman G. Hahn
CPC分类号: B24D9/00
摘要: Apparatus is disclosed for the surface sanding and fine finishing of contoured workpieces of wood or other similar fibrous material. A rotatable disc-like member having a contoured working surface is provided with surface recesses to accommodate a mating spider which affixes a sheet of abrasive material to the working surface. By matching the contour of the working surface with that of the workpiece, rotational contact results in a fine finish, especially in end-grain areas.
摘要翻译: 公开了用于木材或其它类似纤维材料的轮廓工件的表面打磨和精加工的装置。 具有轮廓工作表面的可旋转的盘状构件设置有表面凹部以容纳将工作表面附着研磨材料片的配合的蜘蛛。 通过将工作表面的轮廓与工件的轮廓相匹配,旋转接触将导致精细的光洁度,特别是在末端颗粒区域。
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公开(公告)号:US3614845A
公开(公告)日:1971-10-26
申请号:US3614845D
申请日:1969-07-18
申请人: HERBERT E COOK
发明人: COOK HERBERT E
CPC分类号: B24D9/00
摘要: AN ABRASIVE CONE ASSEMBLY COMPRISING A MANDREL AND AN EXPENDABLE CONE TIP. THE ROTARY DRIVING CONNECTION BETWEEN THE ELEMENTS INCLUDES COMPLEMENTARY PROJECTING AND RECESSED PORTION ALLOWING A CLOSED COUPLED CONNECTION THEREBETWEEN, AND FEATURES A PROJECTING PIN ON THE MANDREL PROVIDING ELONGATED CENTRAL BEARING SUPPORT IN THE CONE.
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公开(公告)号:US3304663A
公开(公告)日:1967-02-21
申请号:US34156364
申请日:1964-01-31
申请人: ARDEN RUTH B
发明人: ARDEN RUTH B
IPC分类号: B24D9/00
CPC分类号: B24D9/00
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公开(公告)号:US3079731A
公开(公告)日:1963-03-05
申请号:US908760
申请日:1960-02-16
CPC分类号: B24B13/012 , B24B11/00 , B24B13/02 , B24B13/065 , B24B17/025 , B24D9/00 , B24D9/085 , B24D13/00 , B24D13/14 , B24D13/142 , Y10T82/141 , Y10T82/148 , Y10T409/30868
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公开(公告)号:US3056242A
公开(公告)日:1962-10-02
申请号:US3577760
申请日:1960-06-13
申请人: HUNTER ERNEST W
发明人: HUNTER ERNEST W
IPC分类号: B24D9/00
CPC分类号: B24D9/00
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