Abstract:
The present invention realizes a function equivalent to an optical half-ND filter electrically and incorporates this function in an image-signal processing system, thereby to compress the dynamic range of images, both effectively and flexibly. The present invention provides an imaging apparatus including an imaging unit that photographs an object, thereby to generate a video signal, a pattern-generating unit that generates a two-dimensional gradation pattern, and a multiplying unit that multiplies the video signal by a gain that corresponds to the two-dimensional gradation pattern.
Abstract:
The invention provides an image processing apparatus and an image processing method. An area to which image data belongs is discriminated, and a correction coefficient to be used for correction of a pixel value of the image data is produced based on a result of the discrimination. Then, the pixel value of the image data is corrected with the correction coefficient. The relationship in magnitude among pixel values in the same area is maintained because the same coefficient is used, but pixel values which belong to different areas can be varied or even reversed. This allows the gradation of an entire image to be corrected while preventing partial deterioration of the contrast.
Abstract:
In an image pickup apparatus, a level compensator compensates the level of an image xL (i, j) sensed by an image sensor by exposure for a long time on the basis of the exposure of the image to produce a compensated image xL′ (i, j), while another level compensator compensates the level of an image xS (i, j) sensed by the image sensor by exposure for a short time on the basis of the exposure of the image to produce a compensated image xS′ (i, j). The image pickup apparatus also includes an image synthesizer to synthesize these compensates images xL′ (i, j) and xS′ (i, j) to produce a single synthetic image x (i, j). A dynamic range compressor also included in the image pickup apparatus compresses the synthetic image x (i, j) to produce a compressed image y (i, j) for delivery to outside.
Abstract:
A connector (10) has a housing (12) with insertion holes (15) and terminal fittings (20) to be pressed into the insertion holes (15). Each terminal fitting (20) has a press-in portion (23) to be pressed into the insertion hole (15) while pushing material of the housing (12) outward. An accommodating portion (24) is continuous with the press-in portion (23) and has slanted surfaces (24A) narrowing the press-in portion (23) toward the rear side with respect to the inserting direction. Thus, material pushed out by the press-in portion (23) returns after the passage of the press-in portion (23) and engages the accommodat9ing portion (24). The width between the rear ends of the slanted surfaces (24A) of the accommodating portion (24) is equal to or smaller than the width of the insertion hole (15).
Abstract:
A circuit board terminal (10) has a board connecting portion (12) with a pair of resilient contacts (14) that bulge out with a deformation space (15) therebetween. A resiliently deformable strut (17) bridges the facing inner surfaces of the two resilient contacts (14). The board connecting portion (12) can be inserted into a through hole (23) in a circuit board (20). Thus, the resilient contacts (14) are pressed against the inner surface of the through hole (23) by a resilient force of the strut (17) acting in elongating directions and their own resilient forces acting in opening directions.
Abstract:
An electrostatic precipitator for removing fine particles from gas is described. The precipitator includes an array of dust collection pipes, each negatively charged and serving as an electrode. Each pipe has a pin-like positively charged discharge electrode centrally located within it. Mist-laden gas is caused to flow through the pipes and is electrostatically cleaned. A slit is formed in the pipes to permit some cleaned gas to be mixed with uncleaned gas and reintroduced into the pipes to reduce the density of the fine particles in the gas entering the pipes. The pipes may be vertically or horizontally arranged.
Abstract:
A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.
Abstract:
An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.
Abstract:
A method for forming a resist pattern comprises the steps of coating a resist on a substrate, baking the resist, selectively radiating electromagnetic waves or particle rays onto a surface of the resists, and developing the resist. The method further comprises, after the baking step and before the developing step, the step of cooling the resist in such a manner that a temperature control plate is disposed parallel to and adjacent to the substrate.
Abstract:
This invention is described an automatic developing device. The automatic developing device according to this invention is comprising: a stage on which the substrate to be treated is disposed after application of the resist and the patterning step is complete; a sealed frame capable of movement, that is used to sealingly cover the substrate disposed on this stage; a supply pipe for supplying developer into this sealed frame; a treatment vessel in which installs the stage, the sealing frame and the developer supply pipe; and at least one nozzle which sprays rinsing liquid provider in this treatment vessel.