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公开(公告)号:US20130162485A1
公开(公告)日:2013-06-27
申请号:US13773010
申请日:2013-02-21
Applicant: Apple Inc.
Inventor: Phillip M. Hobson , Stephen P. Zadesky , Erik L. Wang , Tang Yew Tan , Richard H. Dinh , Adam D. Mittleman , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub
IPC: H01Q1/24
CPC classification number: H01Q1/243 , H01Q1/24 , H01Q1/273 , H01Q1/38 , H01Q1/46 , H01Q1/48 , H01Q1/50 , H01Q5/371 , H01Q5/40 , H01Q7/00 , H01Q9/0421 , H01Q9/42 , H01Q13/10 , H01Q21/28
Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.
Abstract translation: 可以提供包含导电外壳和其它导电元件的手持电子设备。 导电元件可形成天线接地平面。 用于手持电子设备的一个或多个天线可以由接地平面和一个或多个相关联的天线谐振元件形成。 收发器电路可以通过诸如同轴电缆的传输线连接到谐振元件。 套圈可以压接到同轴电缆。 具有延伸构件的托架可以压接在套圈上以将同轴电缆接地到壳体和接地平面中的其它导电元件。 接地平面可能包含一个天线槽。 坞站连接器和柔性电路可以以不影响槽的谐振频率的方式与槽重叠。 电气部件可以使用隔离元件例如电感器和电阻器与天线隔离。
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公开(公告)号:US20130129986A1
公开(公告)日:2013-05-23
申请号:US13746603
申请日:2013-01-22
Applicant: Apple Inc.
Inventor: Richard Walter Heley , Erming Luo , Adam Mittleman , John Payne , Tang Yew Tan , Erik Wang
CPC classification number: H05K13/00 , G03F7/20 , G03F7/2014 , G03F7/2016 , G03F7/202 , Y10T428/2462
Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface.
Abstract translation: 公开了在产品上提供标记的技术或工艺。 产品上提供的标记可以是文字和/或图形。 这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。 在一个实施例中,产品具有外壳,并且标记将设置在外壳上。 例如,用于特定产品的壳体可以包括外部壳体表面,并且标记可以设置在外部壳体表面上。
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公开(公告)号:US12114444B2
公开(公告)日:2024-10-08
申请号:US18383855
申请日:2023-10-25
Applicant: Apple Inc.
Inventor: Stephen P. Zadesky , Phillip M. Hobson , Tang Yew Tan
CPC classification number: H05K5/0217 , H04M1/0252 , H05K5/0013 , Y10T29/18 , Y10T29/477 , Y10T29/49826
Abstract: A cold worked stainless steel bezel for a portable electronic device is provided. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring, (e.g., using a special tool or a magnetic field). Because the bezel is manufactured from cold worked stainless steel, it is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints.
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公开(公告)号:US11994916B2
公开(公告)日:2024-05-28
申请号:US18106354
申请日:2023-02-06
Applicant: Apple Inc.
Inventor: Scott A. Myers , Mattia Pascolini , Richard Hung Minh Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H01Q1/42 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/0247 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
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公开(公告)号:US20230288965A1
公开(公告)日:2023-09-14
申请号:US18199499
申请日:2023-05-19
Applicant: Apple Inc.
Inventor: Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1698 , H04M1/0249 , H05K5/03 , H05K5/02 , H04M1/026 , H05K5/0208 , G06F1/1684 , H01Q1/2258 , H01Q1/241 , H04M1/0274 , H01Q1/42 , H05K5/0247 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号:US20230007799A1
公开(公告)日:2023-01-05
申请号:US17899353
申请日:2022-08-30
Applicant: Apple Inc.
Inventor: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号:US20220418138A1
公开(公告)日:2022-12-29
申请号:US17899410
申请日:2022-08-30
Applicant: Apple Inc.
Inventor: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号:US11540408B2
公开(公告)日:2022-12-27
申请号:US15217605
申请日:2016-07-22
Applicant: Apple Inc.
Inventor: Lucy Elizabeth Browning , Charles B. Woodhull , Bryan Patrick Kiple , David A. Pakula , Tang Yew Tan , Julie Hanchak-Connors , John Murray Thornton, III , Thomas Johannessen , Peter Russell-Clarke , Masashige Tatebe , Napthaneal Y. Tan
IPC: H05K5/04 , H05K5/02 , C25D11/02 , C25D11/12 , C25D11/24 , B23P11/00 , B23P17/00 , G03F1/38 , H01Q1/24 , H04M1/02 , C25D11/34 , H05K13/00 , H05K5/03 , H01Q1/42 , B23C5/10 , B23C5/00 , B23P17/02 , H04M1/11
Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.
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公开(公告)号:US11464126B2
公开(公告)日:2022-10-04
申请号:US17033117
申请日:2020-09-25
Applicant: Apple Inc.
Inventor: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
IPC: G06F1/16 , H05K7/14 , H04M1/02 , H05K5/03 , G02B7/02 , H05K5/00 , G02B13/00 , B29L31/34 , H04N5/225
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号:US20220075422A1
公开(公告)日:2022-03-10
申请号:US17525614
申请日:2021-11-12
Applicant: Apple Inc.
Inventor: Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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