摘要:
Provided according to an aspect of the present disclosure is an electric field aided robotic nozzle printer including a solution storage apparatus for supplying a discharging solution; a nozzle for discharging the discharging solution supplied by the solution storage apparatus; a voltage applying apparatus for applying high voltage onto the nozzle; a flat and movable collector, in which organic wires formed after discharge from the nozzle are aligned; a robot stage, which is installed below the collector and enables to move the collector in an x-y direction (horizontal direction) within a horizontal plane; a micro distance controller for regulating the distance between the nozzle and the collector in a Z direction (vertical direction); and a base plate, which is installed below the robot stage, for maintaining flatness of the collector and preventing vibration generated during the operation of the robot stage.
摘要:
A USB compatible apparatus for connecting an optical universal serial bus (USB) (or an optical serial bus; OSB) device and an electrical USB device, and a structure of the apparatus are provided. More particularly, a USB compatible apparatus for guaranteeing a connection between an optical USB device for inputting/outputting an optical signal and an electrical USB device for inputting/outputting an electrical signal, for example, signal transmission and reception between an electrical USB device (e.g., an electrical USB memory) and an optical USB device (e.g., a computer) having an optical USB port, and a structure of the USB compatible apparatus (a first exemplary embodiment), and a USB compatible apparatus for guaranteeing signal transmission and reception between an optical USB device (e.g., an optical USB memory) and an electrical USB device (e.g., a portable telephone) having an electrical USB port, and a structure of the USB compatible apparatus (a second exemplary embodiment) are provided.
摘要:
A composition including a conducting polymer and an ionomer, and an opto-electronic and an electronic device including the composition are provided. The composition is prepared by doping a conducting polymer with an ionomer which has a low water uptake, has a low content of by-products decomposed by a reaction with electrons, and can crosslink with the conducting polymer. Thus, the opto-electronic device including the composition has improved device performance such as device efficiency and lifetime.
摘要:
Provided are a conducting polymer film composition comprising a graft copolymer of a self-doped conducting polymer and an organic opto-electronic device comprising a conducting polymer film formed of the above-mentioned composition. In the graft copolymer, the conducting polymer and a polyacid are connected to each other via chemical binding. Therefore, the composition of the present invention can be used in organic opto-electronic devices with minimal or no dedoping occurring from heat generated inside the device. As a result, the present invention can improve efficiency and life-time of the organic opto-electronic device.
摘要:
An optical transmission and reception control apparatus is provided. The present invention relates to an optical transmission and reception control apparatus for enabling smooth optical transmission and reception when a photo diode and/or a laser diode fail. The apparatus includes a plurality of laser diodes, a laser driver, a first switching unit, a plurality of photo diodes, an optical power amplifier, a second switching unit, an optical power detection module, and a control module.
摘要:
An express interface apparatus using an optical connection is provided. The apparatus connects between a central processing unit (CPU) in a computer system and an external device supporting optical signal transfer using a peripheral component interconnect express (PCIE) supporting high-speed signal processing. The apparatus includes an optical connection module for connecting the external device so that an optical signal is input/output; an optical-to-electrical conversion module for converting the optical signal from the optical connection module into an electrical signal or converting an electrical signal into an optical signal; a signal processing module connected to the optical-to-electrical conversion module for performing signal processing to divide or merge the electrical signal; and a PCIE control module for controlling a processed signal from the signal processing module to deliver the signal to the CPU via a PCIE slot and controlling high-speed data transmitted and received between the CPU and the external device, such that a signal can be transmitted and received without a distortion or bottleneck phenomenon in high-speed data transfer.
摘要:
An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB